UNIMICRON TECHNOLOGY CORP

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TAIWAN, CN

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Patents Grantslast 30 patents

Information Patent Grant
Connector and method for manufacturing the same
- Patent number 12,184,005
- Issue date Dec 31, 2024
- Unimicron Technology Corp.
- Ching-Ho Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board and manufacturing method thereof
- Patent number 12,185,479
- Issue date Dec 31, 2024
- Unimicron Technology Corp.
- Cheng-Ta Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method thereof and electronic device
- Patent number 12,177,964
- Issue date Dec 24, 2024
- Unimicron Technology Corp.
- Jun-Rui Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 12,160,953
- Issue date Dec 3, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package carrier with improved heat dissipation efficiency and manuf...
- Patent number 12,156,325
- Issue date Nov 26, 2024
- Unimicron Technology Corp.
- Ming-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure
- Patent number 12,144,113
- Issue date Nov 12, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transmission device for suppressing glass fiber effect
- Patent number 12,133,323
- Issue date Oct 29, 2024
- Unimicron Technology Corp.
- Chin-Hsun Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 12,108,530
- Issue date Oct 1, 2024
- Unimicron Technology Corp.
- Kuang-Ching Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board assembly
- Patent number 12,101,881
- Issue date Sep 24, 2024
- Unimicron Technology Corporation
- Ching-Ho Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of improving wire structure of circuit board and improving w...
- Patent number 12,089,347
- Issue date Sep 10, 2024
- Unimicron Technology Corp.
- Chun Yi Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and manufacturing method of the same
- Patent number 12,062,742
- Issue date Aug 13, 2024
- Unimicron Technology Corp.
- Hao-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board having laminated build-up layers
- Patent number 12,057,381
- Issue date Aug 6, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of circuit board
- Patent number 12,052,815
- Issue date Jul 30, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method thereof
- Patent number 12,022,612
- Issue date Jun 25, 2024
- Unimicron Technology Corp.
- Chun-Hung Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with a conductive bump mounted on an adhesive layer
- Patent number 12,016,133
- Issue date Jun 18, 2024
- Unimicron Technology Corp.
- Ming-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 11,997,785
- Issue date May 28, 2024
- Unimicron Technology Corp.
- Chun-Lin Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,991,824
- Issue date May 21, 2024
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method thereof
- Patent number 11,991,837
- Issue date May 21, 2024
- Unimicron Technology Corp.
- Ke-Chien Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting diode package structure and manufacturing method the...
- Patent number 11,955,587
- Issue date Apr 9, 2024
- Unimicron Technology Corp.
- Jeng-Ting Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,943,877
- Issue date Mar 26, 2024
- Unimicron Technology Corp.
- Wen-Yu Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit signal enhancement method of circuit board and structure th...
- Patent number 11,937,366
- Issue date Mar 19, 2024
- Unimicron Technology Corp.
- Tzu Hsuan Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting diode package structure
- Patent number 11,923,350
- Issue date Mar 5, 2024
- Unimicron Technology Corp.
- Ming-Ru Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method of manufacturing the same
- Patent number 11,924,961
- Issue date Mar 5, 2024
- Unimicron Technology Corp.
- Ai Jing Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board stack structure and manufacturing method thereof
- Patent number 11,910,535
- Issue date Feb 20, 2024
- Unimicron Technology Corp.
- Ming-Hao Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interlayer connective structure of wiring board and method of manuf...
- Patent number 11,895,772
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Chi-Min Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure
- Patent number 11,895,773
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of package structure
- Patent number 11,895,780
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplating apparatus and electroplating method
- Patent number 11,859,302
- Issue date Jan 2, 2024
- Unimicron Technology Corp.
- Heng-Ming Nien
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Package structure and optical signal transmitter
- Patent number 11,860,428
- Issue date Jan 2, 2024
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and method of fabricating the same and chip packa...
- Patent number 11,854,961
- Issue date Dec 26, 2023
- Industrial Technology Research Institute
- Yu-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS

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Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME
- Publication number 20240413067
- Publication date Dec 12, 2024
- Unimicron Technology Corp.
- Chia-Yu PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240414850
- Publication date Dec 12, 2024
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD DEVICE
- Publication number 20240397621
- Publication date Nov 28, 2024
- Unimicron Technology Corp.
- Chin-Hsun WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240389232
- Publication date Nov 21, 2024
- Unimicron Technology Corp.
- Chun Hung KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240381533
- Publication date Nov 14, 2024
- Unimicron Technology Corp.
- Chun Hung KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CO-PACKAGED STRUCTURE FOR OPTICS AND ELECTRICS
- Publication number 20240377598
- Publication date Nov 14, 2024
- Unimicron Technology Corp.
- Chin-Sheng WANG
- G02 - OPTICS
Information Patent Application
SUBSTRATE STRUCTURE AND CUTTING METHOD THEREOF
- Publication number 20240357748
- Publication date Oct 24, 2024
- Unimicron Technology Corp.
- Jeng-Ting LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSPECTION SYSTEM AND INSPECTION METHOD OF BARE CIRCUIT BOARD
- Publication number 20240310428
- Publication date Sep 19, 2024
- Unimicron Technology Corp.
- Chun-Hsien CHIEN
- G01 - MEASURING TESTING
Information Patent Application
EMBEDDED INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240314932
- Publication date Sep 19, 2024
- Unimicron Technology Corp.
- Chen-An TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD STRUCTURE
- Publication number 20240306298
- Publication date Sep 12, 2024
- Unimicron Technology Corp.
- Tzyy-Jang TSENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20240282687
- Publication date Aug 22, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240251504
- Publication date Jul 25, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240248264
- Publication date Jul 25, 2024
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240234371
- Publication date Jul 11, 2024
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240237202
- Publication date Jul 11, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240237209
- Publication date Jul 11, 2024
- Unimicron Technology Corp.
- Ping-Tsung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240179829
- Publication date May 30, 2024
- Unimicron Technology Corp.
- Chun Hung KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANTI-DIFFUSION SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240167163
- Publication date May 23, 2024
- Unimicron Technology Corp.
- YI LING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VAPOR CHAMBER STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240159473
- Publication date May 16, 2024
- Unimicron Technology Corp.
- Chin-Sheng Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240138063
- Publication date Apr 25, 2024
- Unimicron Technology Corp.
- Ping-Tsung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240138059
- Publication date Apr 25, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240128179
- Publication date Apr 18, 2024
- Unimicron Technology Corp.
- Jyun-Hong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSION DEVICE FOR SUPPRESSING GLASS FIBER EFFECT
- Publication number 20240130038
- Publication date Apr 18, 2024
- Unimicron Technology Corp.
- Chin-Hsun WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSION DEVICE
- Publication number 20240128626
- Publication date Apr 18, 2024
- Unimicron Technology Corp.
- Yu-Kuang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD WITH LOW GRAIN BOUNDARY DENSITY AND FORMING METHOD TH...
- Publication number 20240121896
- Publication date Apr 11, 2024
- Unimicron Technology Corp.
- Chien Jung CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240114632
- Publication date Apr 4, 2024
- Unimicron Technology Corp.
- Ming-Hao WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD WITH EMBEDDED CHIP AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240105661
- Publication date Mar 28, 2024
- Unimicron Technology Corp.
- Yu-Shen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF
- Publication number 20240064901
- Publication date Feb 22, 2024
- Unimicron Technology Corp.
- Yu-Shen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240023251
- Publication date Jan 18, 2024
- Unimicron Technology Corp.
- Shao-Chien LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGE STRUCTURE
- Publication number 20240014145
- Publication date Jan 11, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS

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Trademarklast 30 trademarks

Information Trademark
87313012 - UNIMICRON
- Serial number 87313012
- Registration number 5604112
- Filing date Jan 25, 2017
- UNIMICRON TECHNOLOGY CORP.
- 40 - Treatment of materials
Information Trademark
78083848 - UNIMICRON
- Serial number 78083848
- Registration number 3066482
- Filing date Sep 13, 2001
- World Wiser Electronics, Inc.
- 40 - Treatment of materials

UNIMICRON TECHNOLOGY CORP

Organization

Patents Grantslast 30 patents

Connector and method for manufacturing the same

Flexible circuit board and manufacturing method thereof

Circuit board and manufacturing method thereof and electronic device

Circuit board structure and manufacturing method thereof

Package carrier with improved heat dissipation efficiency and manuf...

Circuit board structure

Transmission device for suppressing glass fiber effect

Circuit board structure and manufacturing method thereof

Circuit board assembly

Method of improving wire structure of circuit board and improving w...

Package structure and manufacturing method of the same

Circuit board having laminated build-up layers

Manufacturing method of circuit board

Circuit board and manufacturing method thereof

Circuit board with a conductive bump mounted on an adhesive layer

Circuit board

Circuit board structure and manufacturing method thereof

Circuit board and manufacturing method thereof

Light emitting diode package structure and manufacturing method the...

Circuit board structure and manufacturing method thereof

Circuit signal enhancement method of circuit board and structure th...

Light emitting diode package structure

Circuit board and method of manufacturing the same

Printed circuit board stack structure and manufacturing method thereof

Interlayer connective structure of wiring board and method of manuf...

Circuit board structure

Manufacturing method of package structure

Electroplating apparatus and electroplating method

Package structure and optical signal transmitter

Package substrate and method of fabricating the same and chip packa...

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD DEVICE

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CO-PACKAGED STRUCTURE FOR OPTICS AND ELECTRICS

SUBSTRATE STRUCTURE AND CUTTING METHOD THEREOF

INSPECTION SYSTEM AND INSPECTION METHOD OF BARE CIRCUIT BOARD

EMBEDDED INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF CIRCUIT BOARD STRUCTURE

MANUFACTURING METHOD OF CIRCUIT BOARD

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

ANTI-DIFFUSION SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

VAPOR CHAMBER STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

TRANSMISSION DEVICE FOR SUPPRESSING GLASS FIBER EFFECT

TRANSMISSION DEVICE

CIRCUIT BOARD WITH LOW GRAIN BOUNDARY DENSITY AND FORMING METHOD TH...

CIRCUIT BOARD STRUCTURE AND METHOD FOR FORMING THE SAME

CIRCUIT BOARD WITH EMBEDDED CHIP AND METHOD OF MANUFACTURING THE SAME

CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT PACKAGE STRUCTURE

Trademarklast 30 trademarks

87313012 - UNIMICRON

78083848 - UNIMICRON