VERTICAL CIRCUITS, INC

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SCOTTS VALLEY, CA, US

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Assembly having stacked die mounted on substrate
- Patent number 8,357,999
- Issue date Jan 22, 2013
- Vertical Circuits (Assignment for the Benefit of Creditors), LLC
- Marc E. Robinson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support mounted electrically interconnected die assembly
- Patent number 8,178,978
- Issue date May 15, 2012
- Vertical Circuits, Inc.
- Simon J. S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat leadless packages and stacked leadless package assemblies
- Patent number 8,159,053
- Issue date Apr 17, 2012
- Vertical Circuits, Inc.
- Lawrence Douglas Andrews, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level surface passivation of stackable integrated circuit chips
- Patent number 7,923,349
- Issue date Apr 12, 2011
- Vertical Circuits, Inc.
- Simon J. S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die separation method
- Patent number 7,863,159
- Issue date Jan 4, 2011
- Vertical Circuits, Inc.
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat leadless packages and stacked leadless package assemblies
- Patent number 7,843,046
- Issue date Nov 30, 2010
- Vertical Circuits, Inc.
- Lawrence Douglas Andrews, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional six surface conformal die coating
- Patent number 7,705,432
- Issue date Apr 27, 2010
- Vertical Circuits, Inc.
- Al Vindasius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die assembly having electrical interconnect
- Patent number 7,535,109
- Issue date May 19, 2009
- Vertical Circuits, Inc.
- Marc E. Robinson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micropede stacked die component assembly
- Patent number 7,245,021
- Issue date Jul 17, 2007
- Vertical Circuits, Inc.
- Al Vindasius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die BGA or LGA component assembly
- Patent number 7,215,018
- Issue date May 8, 2007
- Vertical Circuits, Inc.
- Al Vindasius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon segment programming apparatus and three terminal fuse confi...
- Patent number 6,486,528
- Issue date Nov 26, 2002
- Vertical Circuits, Inc.
- David V. Pedersen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Support mounted electrically interconnected die assembly
- Publication number 20130099392
- Publication date Apr 25, 2013
- Vertical Circuits, Inc.
- Simon J. S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor die having fine pitch electrical interconnects
- Publication number 20120248607
- Publication date Oct 4, 2012
- Vertical Circuits, Inc.
- Keith Lake Barrie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Connector Between Die Pad and Z-Interconnect for Stacked...
- Publication number 20120119385
- Publication date May 17, 2012
- Vertical Circuits, Inc.
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE ASSEMBLY HAVING REDUCED STRESS ELECTRICAL INTERCONNECTS
- Publication number 20110272825
- Publication date Nov 10, 2011
- Vertical Circuits, Inc.
- Scott McGrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Die Electrical Insulation By Additive Process
- Publication number 20110266684
- Publication date Nov 3, 2011
- Vertical Circuits, Inc.
- Jeffrey S. Leal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL SURFACE PASSIVATION OF STACKABLE INTEGRATED CIRCUIT CHIPS
- Publication number 20110147943
- Publication date Jun 23, 2011
- Vertical Circuits, Inc.
- Simon J.S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-chip underfill
- Publication number 20110115099
- Publication date May 19, 2011
- Vertical Circuits, Inc.
- Marcos Karnezos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Separation Method
- Publication number 20110101505
- Publication date May 5, 2011
- Vertical Circuits, Inc.
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrically Interconnected Stacked Die Assemblies
- Publication number 20110037159
- Publication date Feb 17, 2011
- Vertical Circuits, Inc.
- Simon J.S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flat Leadless Packages and Stacked Leadless Package Assemblies
- Publication number 20110012246
- Publication date Jan 20, 2011
- Vertical Circuits, Inc.
- Lawrence Douglas Andrews, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical interconnect for die stacked in zig-zag configuration
- Publication number 20100327461
- Publication date Dec 30, 2010
- Vertical Circuits, Inc.
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INTERCONNECT FORMED BY AEROSOL APPLICATION OF ELE...
- Publication number 20100140811
- Publication date Jun 10, 2010
- Vertical Circuits, Inc.
- Jeffrey S. Leal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sensor
- Publication number 20100117224
- Publication date May 13, 2010
- Vertical Circuits, Inc.
- Simon J. S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensor
- Publication number 20100052087
- Publication date Mar 4, 2010
- Vertical Circuits, Inc.
- Simon J. S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Separation Method
- Publication number 20090315174
- Publication date Dec 24, 2009
- Vertical Circuits, Inc.
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Support Mounted Electrically Interconnected Die Assembly
- Publication number 20090230528
- Publication date Sep 17, 2009
- Vertical Circuits, Inc.
- Simon J. S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT LEADLESS PACKAGES AND STACKED LEADLESS PACKAGE ASSEMBLIES
- Publication number 20090206458
- Publication date Aug 20, 2009
- Vertical Circuits, Inc.
- LAWRENCE DOUGLAS ANDREWS, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE STACKED DIE PACKAGE
- Publication number 20090102038
- Publication date Apr 23, 2009
- Vertical Circuits, Inc.
- SIMON J.S. MCELREA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Interconnect Formed by Pulsed Dispense
- Publication number 20090068790
- Publication date Mar 12, 2009
- Vertical Circuits, Inc.
- Terrence Caskey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DIE MOUNT BY CONFORMAL DIE COATING
- Publication number 20090065916
- Publication date Mar 12, 2009
- VERTICAL CIRCUITS, INC.
- Scott Jay Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CIRCUITRY FORMED ON INTEGRATED CIRCUIT DEVICE USI...
- Publication number 20080315407
- Publication date Dec 25, 2008
- Vertical Circuits, Inc.
- Lawrence Douglas Andrews, JR.
- G01 - MEASURING TESTING
Information Patent Application
WAFER LEVEL SURFACE PASSIVATION OF STACKABLE INTEGRATED CIRCUIT CHIPS
- Publication number 20080315434
- Publication date Dec 25, 2008
- Vertical Circuits, Inc.
- Simon J.S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY INTERCONNECTED STACKED DIE ASSEMBLIES
- Publication number 20080303131
- Publication date Dec 11, 2008
- Vertical Circuits, Inc.
- Simon J.S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL ELECTRICAL INTERCONNECT FORMED ON SUPPORT PRIOR TO DIE MOUNT
- Publication number 20080224279
- Publication date Sep 18, 2008
- Vertical Circuits, Inc.
- Terrence Caskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three Dimensional Six Surface Conformal Die Coating
- Publication number 20070290377
- Publication date Dec 20, 2007
- Vertical Circuits, Inc.
- Al Vindasius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assembly Having Stacked Die Mounted On Substrate
- Publication number 20070284716
- Publication date Dec 13, 2007
- Vertical Circuits, Inc.
- Al Vindasius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Assembly Having Electrical Interconnect
- Publication number 20070252262
- Publication date Nov 1, 2007
- Vertical Circuits, Inc.
- Marc Robinson
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks

Information Trademark
77288756 - WL-SCSP
- Serial number 77288756
- Filing date Sep 25, 2007
- Vertical Circuits, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
77182906 - STACKED-WLCSP
- Serial number 77182906
- Filing date May 16, 2007
- Vertical Circuits, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
77182961 - STACKCOAT
- Serial number 77182961
- Filing date May 16, 2007
- Vertical Circuits, Inc.
- 17 - Rubber, gutta-percha, gum, asbestos, mica and goods made from these materials and not included in other classes
Information Trademark
77182923 - WAFER-LEVEL STACKED-CSP
- Serial number 77182923
- Filing date May 16, 2007
- Vertical Circuits, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
77183061 - DIGITAL INTERCONNECT
- Serial number 77183061
- Filing date May 16, 2007
- Vertical Circuits, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
77182936 - STACKED WAFER-LEVEL CSP
- Serial number 77182936
- Filing date May 16, 2007
- Vertical Circuits, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
77183086 - VIP
- Serial number 77183086
- Filing date May 16, 2007
- Vertical Circuits, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
77183073 - VERTICAL DIGITAL DISPENSE
- Serial number 77183073
- Filing date May 16, 2007
- Vertical Circuits, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
77181563 - Z-SKY
- Serial number 77181563
- Filing date May 15, 2007
- Vertical Circuits, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
77181387 - SWLCSP
- Serial number 77181387
- Filing date May 15, 2007
- Vertical Circuits, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
77123624 - MICROPEDE
- Serial number 77123624
- Registration number 3338994
- Filing date Mar 6, 2007
- Vertical Circuits, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
78861953 - TRW COMPONENTS INTERNATIONAL
- Serial number 78861953
- Filing date Apr 14, 2006
- Vertical Circuits, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
78429750 - BGADISK
- Serial number 78429750
- Filing date Jun 3, 2004
- Vertical Circuits, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
78429757 - BGADRIVE
- Serial number 78429757
- Filing date Jun 3, 2004
- Vertical Circuits, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
78244094 - MICROPEDE
- Serial number 78244094
- Registration number 3298674
- Filing date Apr 30, 2003
- Vertical Circuits, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
76418124 - SIS (SYSTEM IN A SOCKET)
- Serial number 76418124
- Filing date Jun 6, 2002
- Vertical Circuits, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
75910909 - VCI
- Serial number 75910909
- Registration number 2429798
- Filing date Feb 5, 2000
- Vertical Circuits, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
75910908 - VCI
- Serial number 75910908
- Registration number 2505947
- Filing date Feb 5, 2000
- Vertical Circuits, Inc.
- 35 - Advertising

VERTICAL CIRCUITS, INC

Organization

Patents Grantslast 30 patents

Assembly having stacked die mounted on substrate

Support mounted electrically interconnected die assembly

Flat leadless packages and stacked leadless package assemblies

Wafer level surface passivation of stackable integrated circuit chips

Semiconductor die separation method

Flat leadless packages and stacked leadless package assemblies

Three dimensional six surface conformal die coating

Die assembly having electrical interconnect

Micropede stacked die component assembly

Stacked die BGA or LGA component assembly

Silicon segment programming apparatus and three terminal fuse confi...

Patents Applicationslast 30 patents

Support mounted electrically interconnected die assembly

Semiconductor die having fine pitch electrical interconnects

Electrical Connector Between Die Pad and Z-Interconnect for Stacked...

STACKED DIE ASSEMBLY HAVING REDUCED STRESS ELECTRICAL INTERCONNECTS

Selective Die Electrical Insulation By Additive Process

WAFER LEVEL SURFACE PASSIVATION OF STACKABLE INTEGRATED CIRCUIT CHIPS

Flip-chip underfill

Semiconductor Die Separation Method

Electrically Interconnected Stacked Die Assemblies

Flat Leadless Packages and Stacked Leadless Package Assemblies

Electrical interconnect for die stacked in zig-zag configuration

SEMICONDUCTOR DIE INTERCONNECT FORMED BY AEROSOL APPLICATION OF ELE...

Sensor

Image Sensor

Semiconductor Die Separation Method

Support Mounted Electrically Interconnected Die Assembly

FLAT LEADLESS PACKAGES AND STACKED LEADLESS PACKAGE ASSEMBLIES

CHIP SCALE STACKED DIE PACKAGE

Electrical Interconnect Formed by Pulsed Dispense

SEMICONDUCTOR DIE MOUNT BY CONFORMAL DIE COATING

THREE-DIMENSIONAL CIRCUITRY FORMED ON INTEGRATED CIRCUIT DEVICE USI...

WAFER LEVEL SURFACE PASSIVATION OF STACKABLE INTEGRATED CIRCUIT CHIPS

ELECTRICALLY INTERCONNECTED STACKED DIE ASSEMBLIES

VERTICAL ELECTRICAL INTERCONNECT FORMED ON SUPPORT PRIOR TO DIE MOUNT

Three Dimensional Six Surface Conformal Die Coating

Assembly Having Stacked Die Mounted On Substrate

Die Assembly Having Electrical Interconnect

Trademarklast 30 trademarks

77288756 - WL-SCSP

77182906 - STACKED-WLCSP

77182961 - STACKCOAT

77182923 - WAFER-LEVEL STACKED-CSP

77183061 - DIGITAL INTERCONNECT

77182936 - STACKED WAFER-LEVEL CSP

77183086 - VIP

77183073 - VERTICAL DIGITAL DISPENSE

77181563 - Z-SKY

77181387 - SWLCSP

77123624 - MICROPEDE

78861953 - TRW COMPONENTS INTERNATIONAL

78429750 - BGADISK

78429757 - BGADRIVE

78244094 - MICROPEDE

76418124 - SIS (SYSTEM IN A SOCKET)

75910909 - VCI

75910908 - VCI