Abiola AWUJOOLA

Person

Pleasanton, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wire bond wires for interference shielding
- Patent number 11,810,867
- Issue date Nov 7, 2023
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 11,462,483
- Issue date Oct 4, 2022
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 10,559,537
- Issue date Feb 11, 2020
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded wire bond wires
- Patent number 10,490,528
- Issue date Nov 26, 2019
- Invensas Corporation
- Ashok S. Prabhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded wire bond wires for vertical integration with separate sur...
- Patent number 10,325,877
- Issue date Jun 18, 2019
- Invensas Corporation
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 10,115,678
- Issue date Oct 30, 2018
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded wire bond wires for vertical integration with separate sur...
- Patent number 9,984,992
- Issue date May 29, 2018
- Invensas Corporation
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 9,812,402
- Issue date Nov 7, 2017
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 9,490,222
- Issue date Nov 8, 2016
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond integrated circuit package for high speed I/O
- Patent number 7,804,167
- Issue date Sep 28, 2010
- LSI Logic Corporation
- Clifford Fishley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package layout supporting many voltage splits and f...
- Patent number 7,750,460
- Issue date Jul 6, 2010
- LSI Corporation
- Clifford R. Fishley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit carrier apparatus method and system
- Patent number 7,166,492
- Issue date Jan 23, 2007
- LSI Logic Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active trace rerouting
- Patent number 6,748,576
- Issue date Jun 8, 2004
- LSI Logic Corporation
- Leonard L. Mora
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20240047376
- Publication date Feb 8, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20230059375
- Publication date Feb 23, 2023
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SOLUTIONS FOR HIGH BANDWIDTH NETWORKING APPLICATIONS
- Publication number 20210210478
- Publication date Jul 8, 2021
- Intel Corporation
- Susheel JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20200118939
- Publication date Apr 16, 2020
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20190027444
- Publication date Jan 24, 2019
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Wire Bond Wires for Vertical Integration With Separate Sur...
- Publication number 20180240773
- Publication date Aug 23, 2018
- Invensas Corporation
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Bond Wires for Interference Shielding
- Publication number 20180061774
- Publication date Mar 1, 2018
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded wire bond wires for vertical integration with separate sur...
- Publication number 20170194281
- Publication date Jul 6, 2017
- Invensas Corporatoin
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20170117231
- Publication date Apr 27, 2017
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded wire bond wires
- Publication number 20170103968
- Publication date Apr 13, 2017
- Invensas Corporation
- Ashok S. PRABHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) LEADFRAME DESIGN
- Publication number 20130161804
- Publication date Jun 27, 2013
- Clifford R. Fishley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) LEADFRAME DESIGN
- Publication number 20130161805
- Publication date Jun 27, 2013
- LSI Corporation
- Clifford R. Fishley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED HEAT SPREADER FOR USE IN AN ELECTRONIC DEVICE AND METHOD O...
- Publication number 20120126387
- Publication date May 24, 2012
- LSI Corporation
- Clifford R. Fishley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY PACKAGE LAYOUT SUPPORTING MANY VOLTAGE SPLITS AND F...
- Publication number 20090212413
- Publication date Aug 27, 2009
- Clifford R. Fishley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND INTEGRATED CIRCUIT PACKAGE FOR HIGH SPEED I/O
- Publication number 20080128919
- Publication date Jun 5, 2008
- Clifford Fishley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI shielded integrated circuit packaging apparatus method and system
- Publication number 20050104164
- Publication date May 19, 2005
- LSI Logic Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit carrier apparatus method and system
- Publication number 20050104172
- Publication date May 19, 2005
- LSI Logic Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Active trace rerouting
- Publication number 20030221178
- Publication date Nov 27, 2003
- Leonard L. Mora
- H01 - BASIC ELECTRIC ELEMENTS

Abiola AWUJOOLA

Person

Patents Grantslast 30 patents

Wire bond wires for interference shielding

Wire bond wires for interference shielding

Wire bond wires for interference shielding

Embedded wire bond wires

Embedded wire bond wires for vertical integration with separate sur...

Wire bond wires for interference shielding

Embedded wire bond wires for vertical integration with separate sur...

Wire bond wires for interference shielding

Wire bond wires for interference shielding

Wire bond integrated circuit package for high speed I/O

Ball grid array package layout supporting many voltage splits and f...

Integrated circuit carrier apparatus method and system

Active trace rerouting

Patents Applicationslast 30 patents

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

PACKAGING SOLUTIONS FOR HIGH BANDWIDTH NETWORKING APPLICATIONS

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

Embedded Wire Bond Wires for Vertical Integration With Separate Sur...

Wire Bond Wires for Interference Shielding

Embedded wire bond wires for vertical integration with separate sur...

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

Embedded wire bond wires

INTEGRATED CIRCUIT (IC) LEADFRAME DESIGN

INTEGRATED CIRCUIT (IC) LEADFRAME DESIGN

ENHANCED HEAT SPREADER FOR USE IN AN ELECTRONIC DEVICE AND METHOD O...

BALL GRID ARRAY PACKAGE LAYOUT SUPPORTING MANY VOLTAGE SPLITS AND F...

WIRE BOND INTEGRATED CIRCUIT PACKAGE FOR HIGH SPEED I/O

EMI shielded integrated circuit packaging apparatus method and system

Integrated circuit carrier apparatus method and system

Active trace rerouting