Ahmer Syed

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit (IC) packages employing a capacitor-embedded, re...
- Patent number 12,218,041
- Issue date Feb 4, 2025
- QUALCOMM Incorporated
- Jihong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top port MEMS package and method
- Patent number 10,327,076
- Issue date Jun 18, 2019
- Amkor Technology, Inc.
- Ahmer Raza Syed
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Robust pillar structure for semicondcutor device contacts
- Patent number 10,236,268
- Issue date Mar 19, 2019
- Amkor Technology, Inc.
- Karthikeyan Dhandapani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforced wafer level package comprising a core layer for reducing...
- Patent number 9,806,063
- Issue date Oct 31, 2017
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust pillar structure for semicondcutor device contacts
- Patent number 9,484,291
- Issue date Nov 1, 2016
- Amkor Technology Inc.
- Karthikeyan Dhandapani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top port MEMS microphone package and method
- Patent number 9,420,378
- Issue date Aug 16, 2016
- Amkor Technology, Inc.
- Ahmer Raza Syed
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
System, apparatus, and method for split die interconnection
- Patent number 9,379,090
- Issue date Jun 28, 2016
- QUALCOMM Incorporated
- Ahmer Raza Syed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked and staggered die MEMS package and method
- Patent number 9,013,011
- Issue date Apr 21, 2015
- Amkor Technology, Inc.
- Bob Shih-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for controlling molding compound geometry around a semicondu...
- Patent number 8,912,051
- Issue date Dec 16, 2014
- Amkor Technology, Inc.
- Ahmer Syed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge mount semiconductor package
- Patent number 8,217,507
- Issue date Jul 10, 2012
- Amkor Technology, Inc.
- Jesse E. Galloway
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame with plated end leads
- Patent number 7,183,630
- Issue date Feb 27, 2007
- Amkor Technology, Inc.
- Harry J. Fogelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reduced copper lead frame for saw-singulated chip package
- Patent number 6,885,086
- Issue date Apr 26, 2005
- Amkor Technology, Inc.
- Harry J. Fogelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with plated end leads
- Patent number 6,608,366
- Issue date Aug 19, 2003
- Harry J. Fogelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FLIP-CHIP BUMPING METAL LAYER AND BUMP STRUCTURE
- Publication number 20240371806
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Dongming HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH POST INTERCONNECTS HAVING A PRO...
- Publication number 20240079307
- Publication date Mar 7, 2024
- QUALCOMM Incorporated
- Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A CAPACITOR-EMBEDDED, RE...
- Publication number 20220344250
- Publication date Oct 27, 2022
- QUALCOMM Incorporated
- Jihong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CAVITY FOR ENHANCED DEVICE PERFORMANCE WITH AN INTEGRATED P...
- Publication number 20210375845
- Publication date Dec 2, 2021
- QUALCOMM Incorporated
- William Michael STONE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING BUMP ON EXPOSED REDISTRIBUTION INTERCO...
- Publication number 20180331061
- Publication date Nov 15, 2018
- QUALCOMM Incorporated
- Dongming He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REINFORCED WAFER LEVEL PACKAGE COMPRISING A CORE LAYER FOR REDUCING...
- Publication number 20160322332
- Publication date Nov 3, 2016
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Integrated circuit (IC) packages employing a capacitor-embedded, re...

Top port MEMS package and method

Robust pillar structure for semicondcutor device contacts

Reinforced wafer level package comprising a core layer for reducing...

Robust pillar structure for semicondcutor device contacts

Top port MEMS microphone package and method

System, apparatus, and method for split die interconnection

Stacked and staggered die MEMS package and method

Method for controlling molding compound geometry around a semicondu...

Edge mount semiconductor package

Lead frame with plated end leads

Reduced copper lead frame for saw-singulated chip package

Lead frame with plated end leads

Patents Applicationslast 30 patents

FLIP-CHIP BUMPING METAL LAYER AND BUMP STRUCTURE

PACKAGE COMPRISING A SUBSTRATE WITH POST INTERCONNECTS HAVING A PRO...

INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A CAPACITOR-EMBEDDED, RE...

PACKAGE CAVITY FOR ENHANCED DEVICE PERFORMANCE WITH AN INTEGRATED P...

INTEGRATED DEVICE COMPRISING BUMP ON EXPOSED REDISTRIBUTION INTERCO...

REINFORCED WAFER LEVEL PACKAGE COMPRISING A CORE LAYER FOR REDUCING...