Akihiko Iwaya

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,020,225
- Issue date Jul 10, 2018
- Renesas Electronics Corporation
- Akihiko Iwaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,805,981
- Issue date Oct 31, 2017
- Renesas Electronics Corporation
- Akihiko Iwaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,617,196
- Issue date Sep 9, 2003
- Hitachi, Ltd.
- Akihiko Iwaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 6,610,561
- Issue date Aug 26, 2003
- Hitachi, Ltd.
- Kunihiro Tsubosaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,576,994
- Issue date Jun 10, 2003
- Hitachi, Ltd.
- Akihiko Iwaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,545,349
- Issue date Apr 8, 2003
- Hitachi, Ltd.
- Akihiko Iwaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,452,266
- Issue date Sep 17, 2002
- Hitachi, Ltd.
- Akihiko Iwaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,392,295
- Issue date May 21, 2002
- Hitachi, Ltd.
- Akihiko Iwaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount-type package of ball grid array with multi-chip mounting
- Patent number 6,388,318
- Issue date May 14, 2002
- Hitachi, Ltd.
- Akihiko Iwaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a lead-on-chip (LOC) semiconductor device
- Patent number 6,335,227
- Issue date Jan 1, 2002
- Kunihiro Tsubosaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead on chip semiconductor device and method of fabricating the same
- Patent number 6,137,159
- Issue date Oct 24, 2000
- Hitachi, Ltd.
- Kunihiro Tsubosaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-molded semiconductor device having a lead on chip structure
- Patent number 6,064,112
- Issue date May 16, 2000
- Hitachi, Ltd.
- Akihiko Iwaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with lead structure on principal surface of chip
- Patent number 5,869,888
- Issue date Feb 9, 1999
- Hitachi, Ltd.
- Kunihiro Tsubosaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 5,714,405
- Issue date Feb 3, 1998
- Hitachi, Ltd.
- Kunihiro Tsubosaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with lead structure within the planar area of...
- Patent number 5,583,375
- Issue date Dec 10, 1996
- Hitachi, Ltd.
- Kunihiro Tsubosaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor leadframe and its production method and plastic encap...
- Patent number 5,571,428
- Issue date Nov 5, 1996
- Hitachi, Ltd.
- Asao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor leadframe and its production method and plastic encap...
- Patent number 5,437,915
- Issue date Aug 1, 1995
- Hitachi, Ltd.
- Asao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having stacked lead structure
- Patent number 5,252,854
- Issue date Oct 12, 1993
- Hitachi, Ltd.
- Junichi Arita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180047629
- Publication date Feb 15, 2018
- RENESAS ELECTRONICS CORPORATION
- Akihiko IWAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170062314
- Publication date Mar 2, 2017
- RENESAS ELECTRONICS CORPORATION
- Akihiko IWAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20020109215
- Publication date Aug 15, 2002
- Hitachi, Ltd.
- Akihiko Iwaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20020056911
- Publication date May 16, 2002
- Hitachi, Ltd.
- Akihiko Iwaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20020053732
- Publication date May 9, 2002
- Hitachi, Ltd.
- Akihiko Iwaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20020043719
- Publication date Apr 18, 2002
- Hitachi, Ltd.
- Akihiko Iwaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20010040284
- Publication date Nov 15, 2001
- Hitachi, Ltd.
- Akihiko Iwaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating a semiconductor device
- Publication number 20010016371
- Publication date Aug 23, 2001
- Kunihiro Tsubosaki
- H01 - BASIC ELECTRIC ELEMENTS

Akihiko Iwaya

Person

Patents Grantslast 30 patents

Method of manufacturing semiconductor device

Semiconductor device

Semiconductor device

Method of fabricating a semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device

Surface mount-type package of ball grid array with multi-chip mounting

Method of fabricating a lead-on-chip (LOC) semiconductor device

Lead on chip semiconductor device and method of fabricating the same

Resin-molded semiconductor device having a lead on chip structure

Semiconductor device with lead structure on principal surface of chip

Semiconductor device

Semiconductor device with lead structure within the planar area of...

Semiconductor leadframe and its production method and plastic encap...

Semiconductor leadframe and its production method and plastic encap...

Semiconductor device having stacked lead structure

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device

Method of fabricating a semiconductor device