Claims
- 1. A method of producing a leadframe for use in semiconductor devices, which comprises the steps of forming at least one lead in each of a plurality of element leadframes; placing said element leadframes one upon another so that leads are overlapped with each other and opposed surfaces of the overlapped leads are in face-to-face contact; and welding said overlapped leads to each other and at the same time cutting off one of said overlapped leads; wherein:
- one of the opposed surfaces of the overlapped leads is provided with a recessed portion so that said opposed surfaces have surface portions that are spaced from each other; and
- said leads are melted at regions including said spaced surface portions to weld the overlapped leads together and at the same time one of said leads which has said recessed portion is cut at the recessed portion.
- 2. A method of producing a leadframe for use in semiconductor devices as defined in claim 1, wherein a notch is formed in at least one side edge of the one leadframe having the recessed portion so that a remaining portion of the one leadframe has a width which is smaller than that of the one leadframe and said one leadframe is cut at said notch.
- 3. A method of producing a leadframe for use in semiconductor devices, which comprises the steps of forming at least one lead in each of a plurality of element leadframes; placing said element leadframes one upon the other so that leads are overlapped with each other and opposed surfaces of the overlapped leads are in face-to-face contact; and welding said overlapped leads to each other and at the same time cutting off one of said overlapped leads; wherein:
- one of the overlapped leads is bent away from the other overlapped lead to provide a bent portion so that said opposed surfaces have surface portions that are spaced from each other;
- a notch is formed in at least one side edge of the bent portion so that the bent portion has a width smaller than a main portion of the one lead; and
- said overlapped leads are melted at regions including said spaced surface portions to weld the overlapped leads together and at the same time the lead which is bent is cut at the bent portion.
Priority Claims (1)
Number |
Date |
Country |
Kind |
4-006522 |
Jan 1992 |
JPX |
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CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a Divisional of application Ser. No. 261,230, filed Jun. 16, 1994, which application is a continuation of-application Ser. No. 005,036, filed on Jan. 15, 1993 (now abandoned).
US Referenced Citations (4)
Non-Patent Literature Citations (1)
Entry |
Japanese abstract 56-169312, Welding Method of Lead Terminal of Coil, Hironori Nomura, Dec. 1981, abstract and figure. |
Divisions (1)
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Number |
Date |
Country |
Parent |
261230 |
Jun 1994 |
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Continuations (1)
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Number |
Date |
Country |
Parent |
05036 |
Jan 1993 |
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