Akito Yoshida

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stackable via package and method
- Patent number 12,035,472
- Issue date Jul 9, 2024
- Amkor Technology Singapore Holding Ptd. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable via package and method
- Patent number 11,700,692
- Issue date Jul 11, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable via package and method
- Patent number 11,089,685
- Issue date Aug 10, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable via package and method
- Patent number 10,548,221
- Issue date Jan 28, 2020
- Amkor Technology, Inc.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable variable height via package and method
- Patent number 10,257,942
- Issue date Apr 9, 2019
- Amkor Technology, Inc.
- Akito Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stackable via package and method
- Patent number 10,206,285
- Issue date Feb 12, 2019
- Amkor Technology, Inc.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable via package and method
- Patent number 10,034,372
- Issue date Jul 24, 2018
- Amkor Technology, Inc.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable via package and method
- Patent number 9,730,327
- Issue date Aug 8, 2017
- Amkor Technology, Inc.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable via package and method
- Patent number 9,012,789
- Issue date Apr 21, 2015
- Amkor Technology, Inc.
- Akito Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stackable via package and method
- Patent number 8,704,368
- Issue date Apr 22, 2014
- Amkor Technology, Inc.
- Akito Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stackable protruding via package and method
- Patent number 8,623,753
- Issue date Jan 7, 2014
- Amkor Technology, Inc.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable variable height via package and method
- Patent number 8,471,154
- Issue date Jun 25, 2013
- Amkor Technology, Inc.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable semiconductor package
- Patent number 8,466,545
- Issue date Jun 18, 2013
- Amkor Technology, Inc.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable treated via package and method
- Patent number 8,300,423
- Issue date Oct 30, 2012
- Amkor Technology, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable semiconductor package
- Patent number 8,227,905
- Issue date Jul 24, 2012
- Amkor Technology, Inc.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable via package and method
- Patent number 8,222,538
- Issue date Jul 17, 2012
- Amkor Technology, Inc.
- Akito Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package failure prognostic structure and method
- Patent number 8,022,521
- Issue date Sep 20, 2011
- Amkor Technology, Inc.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable semiconductor package
- Patent number 7,982,306
- Issue date Jul 19, 2011
- Amkor Technology, Inc.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable semiconductor package
- Patent number 7,737,542
- Issue date Jun 15, 2010
- Amkor Technology, Inc.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land patterns for a semiconductor stacking structure and method the...
- Patent number 7,691,745
- Issue date Apr 6, 2010
- Amkor Technology, Inc.
- Akito Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Land patterns for a semiconductor stacking structure and method the...
- Patent number 7,652,361
- Issue date Jan 26, 2010
- Amkor Technology, Inc.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a stack of semiconductor packages
- Patent number 7,459,349
- Issue date Dec 2, 2008
- Amkor Technology, Inc.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land patterns for a semiconductor stacking structure and method the...
- Patent number 7,429,799
- Issue date Sep 30, 2008
- Amkor Technology, Inc.
- Akito Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacking structure for semiconductor devices using a folded over fl...
- Patent number 7,154,171
- Issue date Dec 26, 2006
- Amkor Technology, Inc.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable semiconductor package with solder on pads on which second...
- Patent number 6,987,314
- Issue date Jan 17, 2006
- Amkor Technology, Inc.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package capable of die stacking
- Patent number 6,750,545
- Issue date Jun 15, 2004
- Amkor Technology, Inc.
- Sun Goo Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKABLE VIA PACKAGE AND METHOD
- Publication number 20230354523
- Publication date Nov 2, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE VIA PACKAGE AND METHOD
- Publication number 20220117087
- Publication date Apr 14, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE VIA PACKAGE AND METHOD
- Publication number 20200337152
- Publication date Oct 22, 2020
- Amkor Technology, Inc.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS

Akito Yoshida

Person

Patents Grantslast 30 patents

Stackable via package and method

Stackable via package and method

Stackable via package and method

Stackable via package and method

Stackable variable height via package and method

Stackable via package and method

Stackable via package and method

Stackable via package and method

Stackable via package and method

Stackable via package and method

Stackable protruding via package and method

Stackable variable height via package and method

Stackable semiconductor package

Stackable treated via package and method

Stackable semiconductor package

Stackable via package and method

Package failure prognostic structure and method

Stackable semiconductor package

Stackable semiconductor package

Land patterns for a semiconductor stacking structure and method the...

Land patterns for a semiconductor stacking structure and method the...

Method of forming a stack of semiconductor packages

Land patterns for a semiconductor stacking structure and method the...

Stacking structure for semiconductor devices using a folded over fl...

Stackable semiconductor package with solder on pads on which second...

Semiconductor package capable of die stacking

Patents Applicationslast 30 patents

STACKABLE VIA PACKAGE AND METHOD

STACKABLE VIA PACKAGE AND METHOD

STACKABLE VIA PACKAGE AND METHOD