Ali Lehaf

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Surface finishes with low RBTV for fine and mixed bump pitch archit...
- Patent number 11,935,857
- Issue date Mar 19, 2024
- Intel Corporation
- Kristof Darmawaikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration resistant and profile consistent contact arrays
- Patent number 11,699,648
- Issue date Jul 11, 2023
- Tahoe Research, LTD.
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface finishes with low rBTV for fine and mixed bump pitch archit...
- Patent number 11,488,918
- Issue date Nov 1, 2022
- Intel Corporation
- Kristof Darmawaikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration resistant and profile consistent contact arrays
- Patent number 11,309,239
- Issue date Apr 19, 2022
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration resistant and profile consistent contact arrays
- Patent number 10,854,541
- Issue date Dec 1, 2020
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration resistant and profile consistent contact arrays
- Patent number 10,431,537
- Issue date Oct 1, 2019
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COPPERLESS REGIONS TO CONTROL PLATING GROWTH
- Publication number 20240243088
- Publication date Jul 18, 2024
- Intel Corporation
- Brandon C. MARIN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR...
- Publication number 20240213198
- Publication date Jun 27, 2024
- Intel Corporation
- Liang He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLYTIC SURFACE FINISH ARCHITECTURE
- Publication number 20240105575
- Publication date Mar 28, 2024
- Intel Corporation
- Jason M. GAMBA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNEC...
- Publication number 20240096809
- Publication date Mar 21, 2024
- Intel Corporation
- Hiroki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE WITH MICRO LEDS
- Publication number 20240079530
- Publication date Mar 7, 2024
- Intel Corporation
- Jacob VEHONSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HAVING ONE OR MORE ELECTRICAL INTERCONNECTS
- Publication number 20240006298
- Publication date Jan 4, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE LITHOGRAPHY METHODS FOR INTERCONNECT ARCHITECTURES
- Publication number 20230420346
- Publication date Dec 28, 2023
- Intel Corporation
- Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO REDUCE DEFECTS IN INTERCONNECTS BETWEEN S...
- Publication number 20230097624
- Publication date Mar 30, 2023
- Intel Corporation
- Kyle McElhinny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIRST LEVEL INTERCONNECT UNDER BUMP METALLIZATIONS FOR FINE PITCH H...
- Publication number 20230091379
- Publication date Mar 23, 2023
- Intel Corporation
- Liang HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE FINISHES WITH LOW RBTV FOR FINE AND MIXED BUMP PITCH ARCHIT...
- Publication number 20230015619
- Publication date Jan 19, 2023
- Intel Corporation
- Kristof DARMAWAIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION RESISTANT AND PROFILE CONSISTENT CONTACT ARRAYS
- Publication number 20220199515
- Publication date Jun 23, 2022
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPERLESS REGIONS TO CONTROL PLATING GROWTH
- Publication number 20210082852
- Publication date Mar 18, 2021
- Intel Corporation
- Bradon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION RESISTANT AND PROFILE CONSISTENT CONTACT ARRAYS
- Publication number 20210035901
- Publication date Feb 4, 2021
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE FINISHES WITH LOW RBTV FOR FINE AND MIXED BUMP PITCH ARCHIT...
- Publication number 20200135679
- Publication date Apr 30, 2020
- Intel Corporation
- Kristof DARMAWAIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION RESISTANT AND PROFILE CONSISTENT CONTACT ARRAYS
- Publication number 20190393145
- Publication date Dec 26, 2019
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Surface finishes with low RBTV for fine and mixed bump pitch archit...

Electromigration resistant and profile consistent contact arrays

Surface finishes with low rBTV for fine and mixed bump pitch archit...

Electromigration resistant and profile consistent contact arrays

Electromigration resistant and profile consistent contact arrays

Electromigration resistant and profile consistent contact arrays

Patents Applicationslast 30 patents

COPPERLESS REGIONS TO CONTROL PLATING GROWTH

UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR...

ELECTROLYTIC SURFACE FINISH ARCHITECTURE

MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNEC...

IC PACKAGE WITH MICRO LEDS

SUBSTRATE HAVING ONE OR MORE ELECTRICAL INTERCONNECTS

SINGLE LITHOGRAPHY METHODS FOR INTERCONNECT ARCHITECTURES

METHODS AND APPARATUS TO REDUCE DEFECTS IN INTERCONNECTS BETWEEN S...

FIRST LEVEL INTERCONNECT UNDER BUMP METALLIZATIONS FOR FINE PITCH H...

SURFACE FINISHES WITH LOW RBTV FOR FINE AND MIXED BUMP PITCH ARCHIT...

ELECTROMIGRATION RESISTANT AND PROFILE CONSISTENT CONTACT ARRAYS

COPPERLESS REGIONS TO CONTROL PLATING GROWTH

ELECTROMIGRATION RESISTANT AND PROFILE CONSISTENT CONTACT ARRAYS

SURFACE FINISHES WITH LOW RBTV FOR FINE AND MIXED BUMP PITCH ARCHIT...

ELECTROMIGRATION RESISTANT AND PROFILE CONSISTENT CONTACT ARRAYS