Allen K. Lam

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Space-efficient package for laterally conducting device
- Patent number 7,667,309
- Issue date Feb 23, 2010
- GEM Services, Inc.
- James Harnden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Data center power distribution
- Patent number 7,646,590
- Issue date Jan 12, 2010
- Exaflop LLC
- Selver Corhodzic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Space-efficient package for laterally conducting device
- Patent number 7,485,498
- Issue date Feb 3, 2009
- GEM Services, Inc.
- James Harnden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Space-efficient package for laterally conducting device
- Patent number 7,215,012
- Issue date May 8, 2007
- GEM Services, Inc.
- James Harnden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Portion of a matrix for surface mount package leadframe
- Patent number D513608
- Issue date Jan 17, 2006
- GEM Services, Inc.
- James Harnden
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Portion of a matrix for surface mount package leadframe
- Patent number D505121
- Issue date May 17, 2005
- GEM Services, Inc.
- James Harnden
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Portion of a matrix for surface mount package leadframe
- Patent number D505122
- Issue date May 17, 2005
- GEM Services, Inc.
- James Harnden
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Package for semiconductor die containing symmetrical lead and heat...
- Patent number 6,800,932
- Issue date Oct 5, 2004
- Advanced Analogic Technologies, Inc.
- Allen K. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Portion of a matrix for surface mount package leadframe
- Patent number D488136
- Issue date Apr 6, 2004
- GEM Services, Inc.
- James Harnden
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Portion of a matrix for surface mount package leadframe
- Patent number D487431
- Issue date Mar 9, 2004
- GEM Services, Inc.
- James Harnden
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Portion of a matrix for surface mount package leadframe
- Patent number D485808
- Issue date Jan 27, 2004
- GEM Services, Inc.
- James Harnden
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Symmetrical package for semiconductor die
- Patent number 6,452,802
- Issue date Sep 17, 2002
- Advanced Analogic Technologies, Inc.
- Allen K. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount semiconductor package, die-leadframe combination and...
- Patent number 6,307,755
- Issue date Oct 23, 2001
- Richard K. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Symmetrical package for semiconductor die
- Patent number 6,256,200
- Issue date Jul 3, 2001
- Allen K. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simm extraction tool
- Patent number 5,203,074
- Issue date Apr 20, 1993
- Sun Microsystems, Inc.
- Alan W. Lam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Space-efficient package for laterally conducting device
- Publication number 20080217662
- Publication date Sep 11, 2008
- GEM Services, Inc.
- James Harnden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pillar Bump Package Technology
- Publication number 20080017966
- Publication date Jan 24, 2008
- Advanced Analogic Technologies, Inc.
- Richard K. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Space-efficient package for laterally conducting device
- Publication number 20070134851
- Publication date Jun 14, 2007
- GEM Services, Inc.
- James Harnden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Space-efficient package for laterally conducting device
- Publication number 20040173881
- Publication date Sep 9, 2004
- GEM Services, Inc.
- James Harnden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Symmetrical package for semiconductor die
- Publication number 20020071253
- Publication date Jun 13, 2002
- Allen K. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Symmetrical package for semiconductor die
- Publication number 20010040277
- Publication date Nov 15, 2001
- Allen K. Lam
- H01 - BASIC ELECTRIC ELEMENTS

Allen K. Lam

Person

Patents Grantslast 30 patents

Space-efficient package for laterally conducting device

Data center power distribution

Space-efficient package for laterally conducting device

Space-efficient package for laterally conducting device

Portion of a matrix for surface mount package leadframe

Portion of a matrix for surface mount package leadframe

Portion of a matrix for surface mount package leadframe

Package for semiconductor die containing symmetrical lead and heat...

Portion of a matrix for surface mount package leadframe

Portion of a matrix for surface mount package leadframe

Portion of a matrix for surface mount package leadframe

Symmetrical package for semiconductor die

Surface mount semiconductor package, die-leadframe combination and...

Symmetrical package for semiconductor die

Simm extraction tool

Patents Applicationslast 30 patents

Space-efficient package for laterally conducting device

Pillar Bump Package Technology

Space-efficient package for laterally conducting device

Space-efficient package for laterally conducting device

Symmetrical package for semiconductor die

Symmetrical package for semiconductor die