Claims
- 1. A semiconductor package comprising:a semiconductor die having first and second principal surfaces; a heat sink attached to said first surface of the die; a lead attached to said second surface of the die, lead extending over opposite edges of the die, a notch being formed in the lead, the notch being located where the lead passes over one of the opposite edges of the die; and a nonconductive capsule encasing the die and at least a portion of the lead and the heat sink, opposite ends of the lead protruding from the capsule.
- 2. The semiconductor package of claim 1 wherein the lead is symmetrical about an axis of the die.
- 3. The semiconductor package of claim 2 wherein the notch is formed in the lead where the lead passes over the one of the opposite edges of the die and a second notch is formed in the lead where the lead passes over another one of the opposite edges of the die.
Parent Case Info
This application is related to application Ser. No. 09/322/127, co-owned and co-filed herewith, which is incorporated herein by reference in its entirety.
US Referenced Citations (3)
Number |
Name |
Date |
Kind |
5545921 |
Conru et al. |
Aug 1996 |
|
5554885 |
Yamasaki et al. |
Sep 1996 |
|
6005286 |
Kinsman |
Dec 1999 |
|