Claims
- 1. A semiconductor package comprising:
a semiconductor die having first and second principal surfaces; a heat sink attached to a first surface of the die; a lead attached to a second surface of the die, the lead extending over opposite edges of the die, a notch being formed in the lead on a side of the lead facing the die, the notch being located where the lead passes over an edge of the die; and a nonconductive capsule encasing the die and at least a portion of the lead and the heat sink, opposite ends of the lead protruding from the capsule.
- 2. The semiconductor package of claim 1 wherein the lead is symmetrical about an axis of the side.
- 3. The semiconductor package of claim 2 wherein a first notch is formed in the lead where the lead passes over a first edge of the die and a second notch is formed in the lead where the lead passes over a second edge of the die.
Parent Case Info
[0001] This application is a continuation of application Ser. No. 09/322,124, filed May 27, 1999, and is related to application Ser. No. 09/322,127, each of which is incorporated herein by reference in its entirety.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09898212 |
Jul 2001 |
US |
Child |
10066023 |
Jan 2002 |
US |
Continuations (1)
|
Number |
Date |
Country |
Parent |
09322124 |
May 1999 |
US |
Child |
09898212 |
Jul 2001 |
US |