Anand Chandrashekar

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Reducing line bending during metal fill process
- Patent number 12,173,399
- Issue date Dec 24, 2024
- Lam Research Corporation
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ex situ coating of chamber components for semiconductor processing
- Patent number 12,163,219
- Issue date Dec 10, 2024
- Lam Research Corporation
- Damodar Rajaram Shanbhag
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High step coverage tungsten deposition
- Patent number 12,002,679
- Issue date Jun 4, 2024
- Lam Research Corporation
- Michael Bowes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Void free low stress fill
- Patent number 11,978,666
- Issue date May 7, 2024
- Lam Research Corporation
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Feature fill with nucleation inhibition
- Patent number 11,901,227
- Issue date Feb 13, 2024
- Lam Research Corporation
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tungsten feature fill with nucleation inhibition
- Patent number 11,437,269
- Issue date Sep 6, 2022
- Novellus Systems, Inc.
- Tsung-Han Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tungsten feature fill with nucleation inhibition
- Patent number 11,410,883
- Issue date Aug 9, 2022
- Novellus Systems, Inc.
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ex situ coating of chamber components for semiconductor processing
- Patent number 11,365,479
- Issue date Jun 21, 2022
- Lam Research Corporation
- Damodar Shanbhag
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tungsten feature fill
- Patent number 11,075,115
- Issue date Jul 27, 2021
- Novellus Systems, Inc.
- Anand Chandrashekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etch of tungsten for enhanced tungsten deposition fill
- Patent number 11,069,535
- Issue date Jul 20, 2021
- Lam Research Corporation
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fill process optimization using feature scale modeling
- Patent number 10,977,405
- Issue date Apr 13, 2021
- Lam Research Corporation
- Michael Bowes
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Feature fill with multi-stage nucleation inhibition
- Patent number 10,916,434
- Issue date Feb 9, 2021
- Lam Research Corporation
- Deqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ex situ coating of chamber components for semiconductor processing
- Patent number 10,760,158
- Issue date Sep 1, 2020
- Lam Research Corporation
- Damodar Shanbhag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Feature fill with nucleation inhibition
- Patent number 10,580,695
- Issue date Mar 3, 2020
- Lam Research Corporation
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Feature fill with multi-stage nucleation inhibition
- Patent number 10,580,654
- Issue date Mar 3, 2020
- Lam Research Corporation
- Deqi Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Continuous and pulsed RF plasma for etching metals
- Patent number 10,566,211
- Issue date Feb 18, 2020
- Lam Research Corporation
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Pulsing RF power in etch process to enhance tungsten gapfill perfor...
- Patent number 10,395,944
- Issue date Aug 27, 2019
- Lam Research Corporation
- Waikit Fung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tungsten feature fill with nucleation inhibition
- Patent number 10,381,266
- Issue date Aug 13, 2019
- Novellus Systems, Inc.
- Tsung-Han Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tungsten feature fill with nucleation inhibition
- Patent number 10,256,142
- Issue date Apr 9, 2019
- Novellus Systems, Inc.
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chamber conditioning for remote plasma process
- Patent number 10,211,099
- Issue date Feb 19, 2019
- Lam Research Corporation
- Deqi Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tungsten nitride barrier layer deposition
- Patent number 10,199,267
- Issue date Feb 5, 2019
- Lam Research Corporation
- Rohit Khare
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Feature fill with multi-stage nucleation inhibition
- Patent number 10,170,320
- Issue date Jan 1, 2019
- Lam Research Corporation
- Deqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tungsten feature fill
- Patent number 10,103,058
- Issue date Oct 16, 2018
- Novellus Systems, Inc.
- Anand Chandrashekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Feature fill with nucleation inhibition
- Patent number 9,997,405
- Issue date Jun 12, 2018
- Lam Research Corporation
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Pulsing RF power in etch process to enhance tungsten gapfill perfor...
- Patent number 9,978,610
- Issue date May 22, 2018
- Lam Research Corporation
- Waikit Fung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Atomic layer etching of tungsten for enhanced tungsten deposition fill
- Patent number 9,972,504
- Issue date May 15, 2018
- Lam Research Corporation
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature tungsten film deposition for small critical dimensi...
- Patent number 9,673,146
- Issue date Jun 6, 2017
- Novellus Systems, Inc.
- Feng Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tungsten feature fill
- Patent number 9,653,353
- Issue date May 16, 2017
- Novellus Systems, Inc.
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming tungsten film having low resistivity, low roughn...
- Patent number 9,589,835
- Issue date Mar 7, 2017
- Novellus Systems, Inc.
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Void free tungsten fill in different sized features
- Patent number 9,548,228
- Issue date Jan 17, 2017
- Lam Research Corporation
- Anand Chandrashekar
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESS GAS RAMP DURING SEMICONDUCTOR PROCESSING
- Publication number 20240376598
- Publication date Nov 14, 2024
- LAM RESEARCH CORPORATION
- Jasmine LIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
VOID FREE LOW STRESS FILL
- Publication number 20240234208
- Publication date Jul 11, 2024
- LAM RESEARCH CORPORATION
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
REDUCING LINE BENDING DURING METAL FILL PROCESS
- Publication number 20240158913
- Publication date May 16, 2024
- LAM RESEARCH CORPORATION
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW RESISTANCE GATE OXIDE METALLIZATION LINER
- Publication number 20230290639
- Publication date Sep 14, 2023
- LAM RESEARCH CORPORATION
- Lawrence Schloss
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
REACTANT GAS PULSE DELIVERY
- Publication number 20230130557
- Publication date Apr 27, 2023
- LAM RESEARCH CORPORATION
- Krishna BIRRU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FEATURE FILL WITH NUCLEATION INHIBITION
- Publication number 20230122846
- Publication date Apr 20, 2023
- LAM RESEARCH CORPORATION
- Rohit KHARE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNGSTEN FEATURE FILL WITH NUCLEATION INHIBITION
- Publication number 20230041794
- Publication date Feb 9, 2023
- Novellus Systems, Inc.
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
EX SITU COATING OF CHAMBER COMPONENTS FOR SEMICONDUCTOR PROCESSING
- Publication number 20230002891
- Publication date Jan 5, 2023
- LAM RESEARCH CORPORATION
- Damodar Rajaram SHANBHAG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BACKSIDE REACTIVE INHIBITION GAS
- Publication number 20220415711
- Publication date Dec 29, 2022
- LAM RESEARCH CORPORATION
- Gang LIU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TUNGSTEN FEATURE FILL WITH NUCLEATION INHIBITION
- Publication number 20220359280
- Publication date Nov 10, 2022
- Novellus Systems, Inc.
- Tsung-Han YANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
REDUCING LINE BENDING DURING METAL FILL PROCESS
- Publication number 20220349048
- Publication date Nov 3, 2022
- LAM RESEARCH CORPORATION
- Anand CHANDRASHEKAR
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
EX SITU COATING OF CHAMBER COMPONENTS FOR SEMICONDUCTOR PROCESSING
- Publication number 20220275504
- Publication date Sep 1, 2022
- LAM RESEARCH CORPORATION
- Damodar Rajaram SHANBHAG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH STEP COVERAGE TUNGSTEN DEPOSITION
- Publication number 20220181158
- Publication date Jun 9, 2022
- LAM RESEARCH CORPORATION
- Michael Bowes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNGSTEN FEATURE FILL WITH INHIBITION CONTROL
- Publication number 20220172987
- Publication date Jun 2, 2022
- LAM RESEARCH CORPORATION
- Tsung-Han Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL
- Publication number 20220115244
- Publication date Apr 14, 2022
- LAM RESEARCH CORPORATION
- Chiukin Steven LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FEATURE FILL WITH NUCLEATION INHIBITION
- Publication number 20220102208
- Publication date Mar 31, 2022
- LAM RESEARCH CORPORATION
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
VOID FREE LOW STRESS FILL
- Publication number 20220020641
- Publication date Jan 20, 2022
- LAM RESEARCH CORPORATION
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
EDGE EXCLUSION CONTROL
- Publication number 20210375591
- Publication date Dec 2, 2021
- LAM RESEARCH CORPORATION
- Anand Chandrashekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNGSTEN FEATURE FILL
- Publication number 20210327754
- Publication date Oct 21, 2021
- Novellus Systems, Inc.
- Anand Chandrashekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL
- Publication number 20210305059
- Publication date Sep 30, 2021
- LAM RESEARCH CORPORATION
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING SYSTEM FOR REMOVING DEPOSITS FROM PUMP IN AN EXHAUST OF A...
- Publication number 20210257194
- Publication date Aug 19, 2021
- LAM RESEARCH CORPORATION
- Krishna BIRRU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EX SITU COATING OF CHAMBER COMPONENTS FOR SEMICONDUCTOR PROCESSING
- Publication number 20200347497
- Publication date Nov 5, 2020
- LAM RESEARCH CORPORATION
- Damodar Shanbhag
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER ETCH OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL
- Publication number 20200286743
- Publication date Sep 10, 2020
- LAM RESEARCH CORPORATION
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILL PROCESS OPTIMIZATION USING FEATURE SCALE MODELING
- Publication number 20200242209
- Publication date Jul 30, 2020
- LAM RESEARCH CORPORATION
- Michael Bowes
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FEATURE FILL WITH MULTI-STAGE NUCLEATION INHIBITION
- Publication number 20200185225
- Publication date Jun 11, 2020
- LAM RESEARCH CORPORATION
- Deqi Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FEATURE FILL WITH NUCLEATION INHIBITION
- Publication number 20200185273
- Publication date Jun 11, 2020
- LAM RESEARCH CORPORATION
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TUNGSTEN FEATURE FILL WITH NUCLEATION INHIBITION
- Publication number 20190326168
- Publication date Oct 24, 2019
- Novellus Systems, Inc.
- Tsung-Han Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TUNGSTEN FEATURE FILL WITH NUCLEATION INHIBITION
- Publication number 20190206731
- Publication date Jul 4, 2019
- Novellus Systems, Inc.
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
EX SITU COATING OF CHAMBER COMPONENTS FOR SEMICONDUCTOR PROCESSING
- Publication number 20190185999
- Publication date Jun 20, 2019
- LAM RESEARCH CORPORATION
- Damodar Shanbhag
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FEATURE FILL WITH MULTI-STAGE NUCLEATION INHIBITION
- Publication number 20190080914
- Publication date Mar 14, 2019
- LAM RESEARCH CORPORATION
- Deqi Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Anand Chandrashekar

Person

Patents Grantslast 30 patents

Reducing line bending during metal fill process

Ex situ coating of chamber components for semiconductor processing

High step coverage tungsten deposition

Void free low stress fill

Feature fill with nucleation inhibition

Tungsten feature fill with nucleation inhibition

Tungsten feature fill with nucleation inhibition

Ex situ coating of chamber components for semiconductor processing

Tungsten feature fill

Atomic layer etch of tungsten for enhanced tungsten deposition fill

Fill process optimization using feature scale modeling

Feature fill with multi-stage nucleation inhibition

Ex situ coating of chamber components for semiconductor processing

Feature fill with nucleation inhibition

Feature fill with multi-stage nucleation inhibition

Continuous and pulsed RF plasma for etching metals

Pulsing RF power in etch process to enhance tungsten gapfill perfor...

Tungsten feature fill with nucleation inhibition

Tungsten feature fill with nucleation inhibition

Chamber conditioning for remote plasma process

Tungsten nitride barrier layer deposition

Feature fill with multi-stage nucleation inhibition

Tungsten feature fill

Feature fill with nucleation inhibition

Pulsing RF power in etch process to enhance tungsten gapfill perfor...

Atomic layer etching of tungsten for enhanced tungsten deposition fill

Low temperature tungsten film deposition for small critical dimensi...

Tungsten feature fill

Method for forming tungsten film having low resistivity, low roughn...

Void free tungsten fill in different sized features

Patents Applicationslast 30 patents

PROCESS GAS RAMP DURING SEMICONDUCTOR PROCESSING

VOID FREE LOW STRESS FILL

REDUCING LINE BENDING DURING METAL FILL PROCESS

LOW RESISTANCE GATE OXIDE METALLIZATION LINER

REACTANT GAS PULSE DELIVERY

FEATURE FILL WITH NUCLEATION INHIBITION

TUNGSTEN FEATURE FILL WITH NUCLEATION INHIBITION

EX SITU COATING OF CHAMBER COMPONENTS FOR SEMICONDUCTOR PROCESSING

BACKSIDE REACTIVE INHIBITION GAS

TUNGSTEN FEATURE FILL WITH NUCLEATION INHIBITION

REDUCING LINE BENDING DURING METAL FILL PROCESS

EX SITU COATING OF CHAMBER COMPONENTS FOR SEMICONDUCTOR PROCESSING

HIGH STEP COVERAGE TUNGSTEN DEPOSITION

TUNGSTEN FEATURE FILL WITH INHIBITION CONTROL

ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL

FEATURE FILL WITH NUCLEATION INHIBITION

VOID FREE LOW STRESS FILL

EDGE EXCLUSION CONTROL

TUNGSTEN FEATURE FILL

ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL

CLEANING SYSTEM FOR REMOVING DEPOSITS FROM PUMP IN AN EXHAUST OF A...

EX SITU COATING OF CHAMBER COMPONENTS FOR SEMICONDUCTOR PROCESSING

ATOMIC LAYER ETCH OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL

FILL PROCESS OPTIMIZATION USING FEATURE SCALE MODELING

FEATURE FILL WITH MULTI-STAGE NUCLEATION INHIBITION

FEATURE FILL WITH NUCLEATION INHIBITION

TUNGSTEN FEATURE FILL WITH NUCLEATION INHIBITION

TUNGSTEN FEATURE FILL WITH NUCLEATION INHIBITION

EX SITU COATING OF CHAMBER COMPONENTS FOR SEMICONDUCTOR PROCESSING

FEATURE FILL WITH MULTI-STAGE NUCLEATION INHIBITION