Anang Subagio

Person

Batam Island, ID

People

Patents Grantslast 30 patents

Information Patent Grant
Lead frame routed chip pads for semiconductor packages
- Patent number 8,304,864
- Issue date Nov 6, 2012
- Unisem (Mauritius) Holdings Limited
- Romarico Santos San Antonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partially patterned lead frames and methods of making and using the...
- Patent number 8,236,612
- Issue date Aug 7, 2012
- Unisem (Mauritius) Holdings Limited
- Romarico S. San Antonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF shielding for a singulated laminate semiconductor device package
- Patent number 8,084,300
- Issue date Dec 27, 2011
- Unisem (Mauritius) Holdings Limited
- Romarico S. San Antonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
No lead package with heat spreader
- Patent number 8,022,512
- Issue date Sep 20, 2011
- Unisem (Mauritus) Holdings Limited
- Mary Jean Bajacan Ramos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless semiconductor package and method of manufacture
- Patent number 7,943,431
- Issue date May 17, 2011
- Unisem (Mauritius) Holdings Limited
- Romarico S. San Antonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame routed chip pads for semiconductor packages
- Patent number 7,820,480
- Issue date Oct 26, 2010
- Unisem (Mauritius) Holdings Limited
- Shafidul Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making QFN package with power and ground rings
- Patent number 7,816,186
- Issue date Oct 19, 2010
- Unisem (Mauritius) Holdings Limited
- Romarico S. San Antonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partially patterned lead frames and methods of making and using the...
- Patent number 7,799,611
- Issue date Sep 21, 2010
- Unisem (Mauritius) Holdings Limited
- Mary Jean Ramos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame routed chip pads for semiconductor packages
- Patent number 7,795,710
- Issue date Sep 14, 2010
- Unisem (Mauritius) Holdings Limited
- Shafidul Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partially patterned lead frames and methods of making and using the...
- Patent number 7,790,500
- Issue date Sep 7, 2010
- Unisem (Mauritius) Holdings Limited
- Mary Jean Ramos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making thermally enhanced substrate-base package
- Patent number 7,741,158
- Issue date Jun 22, 2010
- Unisem (Mauritius) Holdings Limited
- Timothy Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making flip-chip package with underfill
- Patent number 7,700,414
- Issue date Apr 20, 2010
- Unisem (Mauritius) Holdings Limited
- Romarico Santos San Antonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method for manufacturing same
- Patent number 7,563,648
- Issue date Jul 21, 2009
- Unisem (Mauritius) Holdings Limited
- Shafidul Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die pad for semiconductor packages and methods of making and using...
- Patent number 7,262,491
- Issue date Aug 28, 2007
- Advanced Interconnect Technologies Limited
- Shafidul Islam
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH ELECTROMAGNETIC SHIELDING
- Publication number 20120126378
- Publication date May 24, 2012
- Unisem (Mauritius ) Holdings Limited
- Romarico S. San Antonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO LEAD PACKAGE WITH HEAT SPREADER
- Publication number 20110304032
- Publication date Dec 15, 2011
- Mary Jean Bajacan Ramos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Partially Patterned Lead Frames and Methods of Making and Using the...
- Publication number 20110111562
- Publication date May 12, 2011
- Romarico S. San Antonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Partially Patterned Lead Frames and Methods of Making and Using the...
- Publication number 20110057298
- Publication date Mar 10, 2011
- Mary Jean Ramos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME ROUTED CHIP PADS FOR SEMICONDUCTOR PACKAGES
- Publication number 20110001224
- Publication date Jan 6, 2011
- Romarico Santos San Antonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Partially patterned lead frames and methods of making and using the...
- Publication number 20080258278
- Publication date Oct 23, 2008
- Mary Jean Ramos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame routed chip pads for semiconductor packages
- Publication number 20080076206
- Publication date Mar 27, 2008
- Shafidul Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making thermally enhanced substrate-base package
- Publication number 20070284733
- Publication date Dec 13, 2007
- Advanced Interconnect Technologies Limited, a Corporation of Mauritius.
- Timothy Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for making QFN package with power and ground rings
- Publication number 20070215990
- Publication date Sep 20, 2007
- Advanced Interconnect Technologies Limited, a corporation of the Country of M...
- Romarico S. San Antonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO LEAD PACKAGE WITH HEAT SPREADER
- Publication number 20070200207
- Publication date Aug 30, 2007
- Mary Jean Bajacan Ramos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device package and method for manufacturing same
- Publication number 20070161157
- Publication date Jul 12, 2007
- Shafidul Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadless semiconductor package and method of manufacture
- Publication number 20070126092
- Publication date Jun 7, 2007
- Advanced Interconnect Technologies Limited, a corporation of the Republic of...
- Romarico S. San Antonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die pad for semiconductor packages and methods of making and using...
- Publication number 20070052070
- Publication date Mar 8, 2007
- Shafidul Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Partially Patterned Lead Frames and Methods of Making and Using the...
- Publication number 20070052076
- Publication date Mar 8, 2007
- Mary Jean Ramos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame routed chip pads for semiconductor packages
- Publication number 20060151860
- Publication date Jul 13, 2006
- Shafidul Islam
- H01 - BASIC ELECTRIC ELEMENTS

Anang Subagio

Person

Patents Grantslast 30 patents

Lead frame routed chip pads for semiconductor packages

Partially patterned lead frames and methods of making and using the...

RF shielding for a singulated laminate semiconductor device package

No lead package with heat spreader

Leadless semiconductor package and method of manufacture

Lead frame routed chip pads for semiconductor packages

Method for making QFN package with power and ground rings

Partially patterned lead frames and methods of making and using the...

Lead frame routed chip pads for semiconductor packages

Partially patterned lead frames and methods of making and using the...

Method of making thermally enhanced substrate-base package

Method of making flip-chip package with underfill

Semiconductor device package and method for manufacturing same

Die pad for semiconductor packages and methods of making and using...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE WITH ELECTROMAGNETIC SHIELDING

NO LEAD PACKAGE WITH HEAT SPREADER

Partially Patterned Lead Frames and Methods of Making and Using the...

Partially Patterned Lead Frames and Methods of Making and Using the...

LEAD FRAME ROUTED CHIP PADS FOR SEMICONDUCTOR PACKAGES

Partially patterned lead frames and methods of making and using the...

Lead frame routed chip pads for semiconductor packages

Method of making thermally enhanced substrate-base package

Method for making QFN package with power and ground rings

NO LEAD PACKAGE WITH HEAT SPREADER

Semiconductor device package and method for manufacturing same

Leadless semiconductor package and method of manufacture

Die pad for semiconductor packages and methods of making and using...

Partially Patterned Lead Frames and Methods of Making and Using the...

Lead frame routed chip pads for semiconductor packages