Andreas Zluc

Person

Leoben, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board having embedded component
- Patent number 12,185,478
- Issue date Dec 31, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with surface-contactable component embedded in la...
- Patent number 12,165,940
- Issue date Dec 10, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Heinz Moitzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding component in component carrier by component fixation stru...
- Patent number 12,075,561
- Issue date Aug 27, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Timo Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component with dielectric layer for embedding in component carrier
- Patent number 11,749,613
- Issue date Sep 5, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with a stepped cavity and a stepped component ass...
- Patent number 11,749,573
- Issue date Sep 5, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic optical component package having organic portion and inorg...
- Patent number 11,682,661
- Issue date Jun 20, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Andreas Zluc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection arrangement, component carrier and method of forming a c...
- Patent number 11,658,142
- Issue date May 23, 2023
- AT&SAustria Technologie & Systemtechnik AG
- Heinz Moitzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component embedded in component carrier and having an exposed side...
- Patent number 11,570,897
- Issue date Jan 31, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Bettina Schuster
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making contact with a component embedded in a printed ci...
- Patent number 11,523,520
- Issue date Dec 6, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with embedded semiconductor component and embedde...
- Patent number 11,495,513
- Issue date Nov 8, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component with dielectric layer for embedding in component carrier
- Patent number 11,171,092
- Issue date Nov 9, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with a stepped cavity and a stepped component ass...
- Patent number 11,049,778
- Issue date Jun 29, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of embedding a component in a printed circuit board
- Patent number 10,779,413
- Issue date Sep 15, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Timo Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding component with pre-connected pillar in component carrier
- Patent number 10,765,005
- Issue date Sep 1, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Hannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Placement of component in circuit board intermediate product by flo...
- Patent number 10,709,023
- Issue date Jul 7, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of manufacturing flexible printed circuit boards
- Patent number 10,617,012
- Issue date Apr 7, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Andreas Zluc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a circuit board element
- Patent number 10,426,040
- Issue date Sep 24, 2019
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method for manufacturing a circuit board
- Patent number 10,306,750
- Issue date May 28, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Hannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making contact with a component embedded in a printed ci...
- Patent number 10,187,997
- Issue date Jan 22, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board having an asymmetric layer structure
- Patent number 9,967,972
- Issue date May 8, 2018
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Andreas Zluc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 9,418,930
- Issue date Aug 16, 2016
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for integrating an electronic component into a printed circu...
- Patent number 9,253,888
- Issue date Feb 2, 2016
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Method for integrating an electronic component into a printed circu...
- Patent number 8,789,271
- Issue date Jul 29, 2014
- AT & S Austria Technologies & Systemtechnik Aktiengesellschaft
- Günther Weichslberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a multilayer printed circuit board, adhesion p...
- Patent number 8,685,196
- Issue date Apr 1, 2014
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Günther Weichslberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for removing a part of a planar material layer and multilaye...
- Patent number 8,541,689
- Issue date Sep 24, 2013
- AT & S Austria Technologie & Systemtecknik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Electronic Package Comprising a Decoupling Layer Structure
- Publication number 20240030095
- Publication date Jan 25, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Andreas Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component With Dielectric Layer for Embedding in Component Carrier
- Publication number 20230369235
- Publication date Nov 16, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Making Contact with a Component Embedded in a Printed Ci...
- Publication number 20230189448
- Publication date Jun 15, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Embedded in Component Carrier and Having an Exposed Side...
- Publication number 20230135105
- Publication date May 4, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Bettina Schuster
- G02 - OPTICS
Information Patent Application
Component Carrier With Embedded Semiconductor Component and Embedde...
- Publication number 20230055435
- Publication date Feb 23, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes STAHR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Embedding Component in Component Carrier by Component Fixation Stru...
- Publication number 20220053633
- Publication date Feb 17, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Timo Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component With Dielectric Layer for Embedding in Component Carrier
- Publication number 20220037262
- Publication date Feb 3, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With a Stepped Cavity and a Stepped Component Ass...
- Publication number 20210280479
- Publication date Sep 9, 2021
- AT&S Austria Technology & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connection Arrangement, Component Carrier and Method of Forming a C...
- Publication number 20210074662
- Publication date Mar 11, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Heinz Moitzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier and Method of Manufacturing the Same
- Publication number 20210068252
- Publication date Mar 4, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Surface-Contactable Component Embedded in La...
- Publication number 20200365477
- Publication date Nov 19, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Heinz Moitzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hermetic Optical Component Package Having Organic Portion and Inorg...
- Publication number 20200365573
- Publication date Nov 19, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Andreas ZLUC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Embedding a Component in a Printed Circuit Board
- Publication number 20200323081
- Publication date Oct 8, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Timo Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Embedded Semiconductor Component and Embedde...
- Publication number 20200312737
- Publication date Oct 1, 2020
- AT&S Austria Technology & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of Manufacturing Flexible Electronic Devices
- Publication number 20200205296
- Publication date Jun 25, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Andreas ZLUC
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT WITH DIELECTRIC LAYER FOR EMBEDDING IN COMPONENT CARRIER
- Publication number 20200083173
- Publication date Mar 12, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With a Stepped Cavity and a Stepped Component Ass...
- Publication number 20190378771
- Publication date Dec 12, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedding Component With Pre-Connected Pillar in Component Carrier
- Publication number 20190124772
- Publication date Apr 25, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Hannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Making Contact with a Component Embedded in a Printed Ci...
- Publication number 20190082543
- Publication date Mar 14, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Embedded in Component Carrier and Having an Exposed Side...
- Publication number 20190045636
- Publication date Feb 7, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Bettina Schuster
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Embedding Component in Component Carrier by Component Fixation Stru...
- Publication number 20180177045
- Publication date Jun 21, 2018
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Timo Schwarz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SemiFlexible Printed Circuit Board With Embedded Component
- Publication number 20170339783
- Publication date Nov 23, 2017
- Hannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Board Having an Asymmetric Layer Structure
- Publication number 20170339784
- Publication date Nov 23, 2017
- Andreas Zluc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Manufacturing Flexible Electronic Devices
- Publication number 20170231098
- Publication date Aug 10, 2017
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Andreas ZLUC
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Placement of Component in Circuit Board Intermediate Product by Flo...
- Publication number 20170181293
- Publication date Jun 22, 2017
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Making Contact with a Component Embedded in a Printed Ci...
- Publication number 20170048984
- Publication date Feb 16, 2017
- AT&S Austia Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Embedding a Component in a Printed Circuit Board
- Publication number 20160324004
- Publication date Nov 3, 2016
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Timo Schwarz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power Module
- Publication number 20160133558
- Publication date May 12, 2016
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A CIRCUIT BOARD ELEMENT
- Publication number 20160044794
- Publication date Feb 11, 2016
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Johannes STAHR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PRINTED CIRCU...
- Publication number 20140307403
- Publication date Oct 16, 2014
- Günther Weichslberger
- H01 - BASIC ELECTRIC ELEMENTS

Andreas Zluc

Person

Patents Grantslast 30 patents

Printed circuit board having embedded component

Component carrier with surface-contactable component embedded in la...

Embedding component in component carrier by component fixation stru...

Component with dielectric layer for embedding in component carrier

Component carrier with a stepped cavity and a stepped component ass...

Hermetic optical component package having organic portion and inorg...

Connection arrangement, component carrier and method of forming a c...

Component embedded in component carrier and having an exposed side...

Method for making contact with a component embedded in a printed ci...

Component carrier with embedded semiconductor component and embedde...

Component with dielectric layer for embedding in component carrier

Component carrier with a stepped cavity and a stepped component ass...

Method of embedding a component in a printed circuit board

Embedding component with pre-connected pillar in component carrier

Placement of component in circuit board intermediate product by flo...

Methods of manufacturing flexible printed circuit boards

Method for producing a circuit board element

Circuit board and method for manufacturing a circuit board

Method for making contact with a component embedded in a printed ci...

Circuit board having an asymmetric layer structure

Power module

Method for integrating an electronic component into a printed circu...

Method for integrating an electronic component into a printed circu...

Method for producing a multilayer printed circuit board, adhesion p...

Method for removing a part of a planar material layer and multilaye...

Patents Applicationslast 30 patents

Electronic Package Comprising a Decoupling Layer Structure

Component With Dielectric Layer for Embedding in Component Carrier

Method for Making Contact with a Component Embedded in a Printed Ci...

Component Embedded in Component Carrier and Having an Exposed Side...

Component Carrier With Embedded Semiconductor Component and Embedde...

Embedding Component in Component Carrier by Component Fixation Stru...

Component With Dielectric Layer for Embedding in Component Carrier

Component Carrier With a Stepped Cavity and a Stepped Component Ass...

Connection Arrangement, Component Carrier and Method of Forming a C...

Component Carrier and Method of Manufacturing the Same

Component Carrier With Surface-Contactable Component Embedded in La...

Hermetic Optical Component Package Having Organic Portion and Inorg...

Method for Embedding a Component in a Printed Circuit Board

Component Carrier With Embedded Semiconductor Component and Embedde...

Methods of Manufacturing Flexible Electronic Devices

COMPONENT WITH DIELECTRIC LAYER FOR EMBEDDING IN COMPONENT CARRIER

Component Carrier With a Stepped Cavity and a Stepped Component Ass...

Embedding Component With Pre-Connected Pillar in Component Carrier

Method for Making Contact with a Component Embedded in a Printed Ci...

Component Embedded in Component Carrier and Having an Exposed Side...

Embedding Component in Component Carrier by Component Fixation Stru...

SemiFlexible Printed Circuit Board With Embedded Component

Circuit Board Having an Asymmetric Layer Structure

Methods of Manufacturing Flexible Electronic Devices

Placement of Component in Circuit Board Intermediate Product by Flo...

Method for Making Contact with a Component Embedded in a Printed Ci...

Method for Embedding a Component in a Printed Circuit Board

Power Module

METHOD FOR PRODUCING A CIRCUIT BOARD ELEMENT

METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PRINTED CIRCU...