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Anthony L. Coyle
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Parker, TX, US
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Patents Grants
last 30 patents
Information
Patent Grant
Method for fabricating low resistance, low inductance interconnecti...
Patent number
RE48420
Issue date
Feb 2, 2021
Texas Instruments Incorporated
Bernhard P. Lange
Information
Patent Grant
Method for fabricating low resistance, low inductance interconnecti...
Patent number
RE46618
Issue date
Nov 28, 2017
Texas Instruments Incorporated
Bernhard P. Lange
Information
Patent Grant
Method for fabricating low resistance, low inductance interconnecti...
Patent number
RE46466
Issue date
Jul 4, 2017
Texas Instruments Incorporated
Bernhard P. Lange
Information
Patent Grant
Non-pull back pad package with an additional solder standoff
Patent number
8,232,144
Issue date
Jul 31, 2012
Texas Instuments Incorporated
Bernhard P Lange
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
High power integrated circuit device having bump pads
Patent number
8,154,117
Issue date
Apr 10, 2012
Texas Instruments Incorporated
Stefan W. Wiktor
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermally enhanced single inline package (SIP)
Patent number
8,053,285
Issue date
Nov 8, 2011
Texas Instruments Incorporated
Chris E Haga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi lead frame power package
Patent number
8,053,876
Issue date
Nov 8, 2011
Texas Instruments Incorporated
Steven A Kummerl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High current semiconductor device system having low resistance and...
Patent number
8,039,956
Issue date
Oct 18, 2011
Texas Instruments Incorporated
Anthony L. Coyle
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip chip package with advanced electrical and thermal properties f...
Patent number
7,863,098
Issue date
Jan 4, 2011
Texas Instruments Incorporated
Bernhard P. Lange
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermally enhanced single inline package (SIP)
Patent number
7,612,437
Issue date
Nov 3, 2009
Texas Instruments Incorporated
Chris Edward Haga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Non-pull back pad package with an additional solder standoff
Patent number
7,608,484
Issue date
Oct 27, 2009
Texas Instruments Incorporated
Bernhard P. Lange
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Integrated circuit chip packaging assembly
Patent number
7,488,623
Issue date
Feb 10, 2009
Texas Instruments Incorporated
Steven A Kummerl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip chip package with advanced electrical and thermal properties f...
Patent number
7,476,976
Issue date
Jan 13, 2009
Texas Instruments Incorporated
Bernhard P. Lange
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating low resistance, low inductance interconnecti...
Patent number
7,335,536
Issue date
Feb 26, 2008
Texas Instruments Incorporated
Bernhard P. Lange
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit chip packaging assembly
Patent number
7,256,482
Issue date
Aug 14, 2007
Texas Instruments Incorporated
Steven Alfred Kummerl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having integrated metal parts for thermal enh...
Patent number
7,084,494
Issue date
Aug 1, 2006
Texas Instruments Incorporated
Anthony L. Coyle
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Molded package for micromechanical devices and method of fabrication
Patent number
7,026,710
Issue date
Apr 11, 2006
Texas Instruments Incorporated
Anthony L. Coyle
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Plastic chip-scale package having integrated passive components
Patent number
6,916,689
Issue date
Jul 12, 2005
Texas Instruments Incorporated
Samuel D. Pritchett
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating a molded package for micromechanical devices
Patent number
6,858,910
Issue date
Feb 22, 2005
Texas Instruments Incorporated
Anthony L. Coyle
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Flip chip semiconductor device in a molded chip scale package
Patent number
6,753,616
Issue date
Jun 22, 2004
Texas Instruments Incorporated
Anthony L. Coyle
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contact structure for reliable metallic interconnection
Patent number
6,696,757
Issue date
Feb 24, 2004
Texas Instruments Incorporated
Mohammad Yunus
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Plastic chip-scale package having integrated passive components
Patent number
6,586,676
Issue date
Jul 1, 2003
Texas Instruments Incorporated
Samuel D. Pritchett
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Plastic package for micromechanical devices
Patent number
6,541,832
Issue date
Apr 1, 2003
Texas Instruments Incorporated
Anthony L. Coyle
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Flip chip semiconductor device in a molded chip scale package (CSP)...
Patent number
6,518,089
Issue date
Feb 11, 2003
Texas Instruments Incorporated
Anthony L. Coyle
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating a molded package for micromechanical devices
Patent number
6,489,178
Issue date
Dec 3, 2002
Texas Instruments Incorporated
Anthony L. Coyle
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Chip size integrated circuit package
Patent number
6,049,129
Issue date
Apr 11, 2000
Texas Instruments Incorporated
Chee Kiang Yew
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
CHIP ON LEAD WITH SMALL POWER PAD DESIGN
Publication number
20100171201
Publication date
Jul 8, 2010
M. Todd Wyant
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH POWER INTEGRATED CIRCUIT DEVICE
Publication number
20100164052
Publication date
Jul 1, 2010
TEXAS INSTRUMENTS INCORPORATED
STEFAN W. WIKTOR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi Lead Frame Power Package
Publication number
20100019361
Publication date
Jan 28, 2010
TEXAS INSTRUMENTS INCORPORATED
Steven A. Kummerl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thermally Enhanced Single Inline Package (SIP)
Publication number
20100015761
Publication date
Jan 21, 2010
TEXAS INSTRUMENTS INCORPORATED
Chris Edward Haga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Non-Pull Back Pad Package with an Additional Solder Standoff
Publication number
20100006623
Publication date
Jan 14, 2010
TEXAS INSTRUMENTS INCORPORATED
Bernhard P. Lange
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
FLIP CHIP PACKAGE WITH ADVANCED ELECTRICAL AND THERMAL PROPERTIES F...
Publication number
20090087948
Publication date
Apr 2, 2009
TEXAS INSTRUMENTS INCORPORATED
Bernhard P. LANGE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thermally enhanced single inline package (SIP)
Publication number
20080173990
Publication date
Jul 24, 2008
TEXAS INSTRUMENTS INCORPORATED
Chris Edward Haga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Microelectronic Assembly Using Chip-On-Lead (COL) and Cantilever Leads
Publication number
20080157299
Publication date
Jul 3, 2008
Jeffery Gail Holloway
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRESS-IMPROVED FLIP-CHIP SEMICONDUCTOR DEVICE HAVING HALF-ETCHED L...
Publication number
20080135990
Publication date
Jun 12, 2008
TEXAS INSTRUMENTS INCORPORATED
Anthony L. Coyle
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Non-Pull Back Pad Package with an Additional Solder Standoff
Publication number
20080102563
Publication date
May 1, 2008
TEXAS INSTRUMENTS INCORPORATED
Bernhard P. Lange
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
INTERDIGITATED LEADFINGERS
Publication number
20080079124
Publication date
Apr 3, 2008
CHRIS EDWARD HAGA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi Lead Frame Power Package
Publication number
20080020517
Publication date
Jan 24, 2008
TEXAS INSTRUMENTS INCORPORATED
Steven A. Kummerl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuits Having Controlled Inductances
Publication number
20070296056
Publication date
Dec 27, 2007
TEXAS INSTRUMENTS INCORPORATED
Anthony L. Coyle
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Chip Packaging Assembly
Publication number
20070259484
Publication date
Nov 8, 2007
TEXAS INSTRUMENTS INCORPORATED
Steven Alfred Kummerl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Closed loop thermally enhanced flip chip BGA
Publication number
20070090533
Publication date
Apr 26, 2007
TEXAS INSTRUMENTS INCORPORATED
Chris Haga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for fabricating low resistance, low inductance interconnecti...
Publication number
20070048996
Publication date
Mar 1, 2007
Bernhard P. Lange
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
High current semiconductor device system having low resistance and...
Publication number
20070040237
Publication date
Feb 22, 2007
Anthony L. Coyle
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package Having Integrated Metal Parts for Thermal Enh...
Publication number
20060226521
Publication date
Oct 12, 2006
Anthony L. Coyle
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Flip chip package with advanced electrical and thermal properties f...
Publication number
20060186551
Publication date
Aug 24, 2006
TEXAS INSTRUMENTS INCORPORATED
Bernhard P. Lange
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi lead frame power package
Publication number
20060131734
Publication date
Jun 22, 2006
TEXAS INSTRUMENTS INCORPORATED
Steven A. Kummerl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit chip packaging assembly
Publication number
20060033185
Publication date
Feb 16, 2006
Steven Alfred Kummerl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOLDED PACKAGE FOR MICROMECHANICAL DEVICES AND METHOD OF FABRICATION
Publication number
20060006523
Publication date
Jan 12, 2006
Anthony L. Coyle
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Semiconductor package having integrated metal parts for thermal enh...
Publication number
20050280124
Publication date
Dec 22, 2005
Anthony L. Coyle
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer-level assembly method for chip-size devices having flipped chips
Publication number
20050151268
Publication date
Jul 14, 2005
William D. Boyd
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Plastic dual-in-line packaging (PDIP) having enhanced heat dissipation
Publication number
20050110137
Publication date
May 26, 2005
TEXAS INSTRUMENTS INCORPORATED
Anthony L. Coyle
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Contact structure for reliable metallic interconnection
Publication number
20040150105
Publication date
Aug 5, 2004
Mohammad Yunus
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
CONTACT STRUCTURE FOR RELIABLE METALLIC INTERCONNECTION
Publication number
20030234447
Publication date
Dec 25, 2003
Mohammad Yunus
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Plastic chip-scale package having integrated passive components
Publication number
20030205400
Publication date
Nov 6, 2003
Samuel D. Pritchett
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Flip chip semiconductor device in a molded chip scale package (CSP)...
Publication number
20030092217
Publication date
May 15, 2003
Anthony L. Coyle
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package for printhead chip
Publication number
20030090558
Publication date
May 15, 2003
Anthony L. Coyle
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS