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Anthony M. Fuller

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  • Corvallis, OR, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Applying mold chase structure to end portion of fluid ejection die
    • Patent number 11,827,021
    • Issue date Nov 28, 2023
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Corrosion tolerant micro-electromechanical fluid ejection device
    • Patent number 11,787,180
    • Issue date Oct 17, 2023
    • Hewlett-Packard Development Company, L.P.
    • Stanley J. Wang
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Fluid ejection device with break(s) in cover layer
    • Patent number 11,745,507
    • Issue date Sep 5, 2023
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Circuit die alignment target
    • Patent number 11,721,636
    • Issue date Aug 8, 2023
    • Hewlett-Packard Development Company, L.P.
    • Anthony M. Fuller
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Die for a printhead
    • Patent number 11,642,884
    • Issue date May 9, 2023
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Fluid ejection devices including contact pads
    • Patent number 11,639,055
    • Issue date May 2, 2023
    • Hewlett-Packard Development Company, L.P.
    • James Michael Gardner
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Fluid ejection devices including electrical interconnect elements f...
    • Patent number 11,472,180
    • Issue date Oct 18, 2022
    • Hewlett-Packard Development Company, L.P.
    • Anthony M. Fuller
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Die for a printhead
    • Patent number 11,413,864
    • Issue date Aug 16, 2022
    • Hewlett-Packard Development Company, L.P.
    • James Michael Gardner
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Fluid ejection devices including contact pads
    • Patent number 11,413,865
    • Issue date Aug 16, 2022
    • Hewlett-Packard Development Company, L.P.
    • James Michael Gardner
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Fluid ejection device with a carrier having a slot
    • Patent number 11,390,081
    • Issue date Jul 19, 2022
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Die for a printhead
    • Patent number 11,383,514
    • Issue date Jul 12, 2022
    • Hewlett-Packard Development Company, L.P.
    • James Michael Gardner
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Die for a printhead
    • Patent number 11,267,243
    • Issue date Mar 8, 2022
    • Hewlett-Packard Development Company, L.P.
    • James Michael Gardner
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Die contact formations
    • Patent number 11,135,839
    • Issue date Oct 5, 2021
    • Hewlett-Packard Development Company, L.P.
    • Michael W Cumbie
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Fluid ejection die molded into molded body
    • Patent number 11,097,537
    • Issue date Aug 24, 2021
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Conductive wire disposed in a layer
    • Patent number 10,933,634
    • Issue date Mar 2, 2021
    • Hewlett-Packard Development Company, L.P.
    • Anthony M Fuller
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Method of forming a micro-structure
    • Patent number 10,927,472
    • Issue date Feb 23, 2021
    • Hewlett-Packard Development Company, L.P.
    • Peter Mardilovich
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Fluid ejection device including integrated circuit
    • Patent number 10,864,719
    • Issue date Dec 15, 2020
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Termination ring with gapped metallic layer
    • Patent number 10,814,629
    • Issue date Oct 27, 2020
    • Hewlett-Packard Development Company, L.P.
    • Anthony M Fuller
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Fluid ejection device with ink feedhole bridge
    • Patent number 10,479,080
    • Issue date Nov 19, 2019
    • Hewlett-Packard Development Company, L.P.
    • Rio Rivas
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Adhesion-promoting surface
    • Patent number 10,465,308
    • Issue date Nov 5, 2019
    • Hewlett-Packard Development Company, L.P.
    • Peter Mardilovich
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Fluid ejection device
    • Patent number 10,421,275
    • Issue date Sep 24, 2019
    • Hewlett-Packard Development Company, L.P.
    • Donald W Schulte
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Nano-structure and method of making the same
    • Patent number 10,287,697
    • Issue date May 14, 2019
    • Hewlett-Packard Development Company, L.P.
    • Peter Mardilovich
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Fluid ejection device with ink feedhole bridge
    • Patent number 10,086,612
    • Issue date Oct 2, 2018
    • Hewlett-Packard Development Company, L.P.
    • Rio Rivas
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Fluid ejection structure
    • Patent number 9,815,282
    • Issue date Nov 14, 2017
    • Hewlett-Packard Development Company, L.P.
    • Bradley D. Chung
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Thermal ink jet printhead
    • Patent number 9,776,402
    • Issue date Oct 3, 2017
    • Hewlett-Packard Development Company, L.P.
    • Lawrence H. White
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Fluid ejection device with ink feedhole bridge
    • Patent number 9,776,407
    • Issue date Oct 3, 2017
    • Hewlett-Packard Development Company, L.P.
    • Rio Rivas
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Method of forming a micro-structure
    • Patent number 9,751,755
    • Issue date Sep 5, 2017
    • Hewlett-Packard Development Company, L.P.
    • Peter Mardilovich
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Article with controlled wettability
    • Patent number 9,624,101
    • Issue date Apr 18, 2017
    • Hewlett-Packard Development Company, L.P.
    • Peter Mardilovich
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Nano-structure and method of making the same
    • Patent number 9,611,559
    • Issue date Apr 4, 2017
    • Hewlett-Packard Development Company, L.P.
    • Peter Mardilovich
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Printhead die with multiple termination rings
    • Patent number 9,498,953
    • Issue date Nov 22, 2016
    • Hewlett-Packard Development Company, L.P.
    • Anthony M. Fuller
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

  • Information Patent Application

    CORROSION TOLERANT MICRO-ELECTROMECHANICAL FLUID EJECTION DEVICE
    • Publication number 20230415482
    • Publication date Dec 28, 2023
    • Hewlett-Packard Development Company, L.P.
    • Stanley J. Wang
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    FLUID EJECTION DEVICE WITH BREAK(S) IN COVER LAYER
    • Publication number 20230356527
    • Publication date Nov 9, 2023
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    FLUID EJECTION DEVICES INCLUDING CONTACT PADS
    • Publication number 20220348013
    • Publication date Nov 3, 2022
    • Hewlett-Packard Development Company, L.P.
    • James Michael GARDNER
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    CIRCULATION PATH FOR BUBBLER
    • Publication number 20220176708
    • Publication date Jun 9, 2022
    • Hewlett-Packard Development Company, L.P.
    • Boon Bing Ng
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    FLUID EJECTION DEVICE WITH BREAK(S) IN COVER LAYER
    • Publication number 20220072858
    • Publication date Mar 10, 2022
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    MANUFACTURING A CORROSION TOLERANT MICRO-ELECTROMECHANICAL FLUID EJ...
    • Publication number 20220048763
    • Publication date Feb 17, 2022
    • Hewlett-Packard Development Company, L.P.
    • Stanley J. Wang
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    A CORROSION TOLERANT MICRO-ELECTROMECHANICAL FLUID EJECTION DEVICE
    • Publication number 20220040977
    • Publication date Feb 10, 2022
    • Hewlett-Packard Development Company, L.P.
    • Stanley J. Wang
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    APPLYING MOLD CHASE STRUCTURE TO END PORTION OF FLUID EJECTION DIE
    • Publication number 20220009231
    • Publication date Jan 13, 2022
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua CHEN
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    CIRCUIT DIE ALIGNMENT TARGET
    • Publication number 20210402782
    • Publication date Dec 30, 2021
    • Hewlett-Packard Development Company, L.P.
    • Anthony M. Fuller
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIE FOR A PRINTHEAD
    • Publication number 20210370671
    • Publication date Dec 2, 2021
    • Hewlett-Packard Development Company, L.P.
    • James Michael Gardner
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    DIE FOR A PRINTHEAD
    • Publication number 20210354461
    • Publication date Nov 18, 2021
    • Hewlett-Packard Development Company, L.P.
    • James Michael GARDNER
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    DIE FOR A PRINTHEAD
    • Publication number 20210354460
    • Publication date Nov 18, 2021
    • Hewlett-Packard Development Company, L.P.
    • James Michael Gardner
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    DIE FOR A PRINTHEAD
    • Publication number 20210354462
    • Publication date Nov 18, 2021
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    FLUID EJECTION DEVICES INCLUDING ELECTRICAL INTERCONNECT ELEMENTS F...
    • Publication number 20210260872
    • Publication date Aug 26, 2021
    • Hewlett-Packard Development Company, L.P.
    • Anthony M. FULLER
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    FLUID EJECTION DEVICE WITH A CARRIER HAVING A SLOT
    • Publication number 20210229438
    • Publication date Jul 29, 2021
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua CHEN
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    FLUID EJECTION DEVICES INCLUDING CONTACT PADS
    • Publication number 20210221133
    • Publication date Jul 22, 2021
    • Hewlett-Packard Development Company, L.P.
    • James Michael GARDNER
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    TERMINATION RING WITH GAPPED METALLIC LAYER
    • Publication number 20200269581
    • Publication date Aug 27, 2020
    • Hewlett-Packard Development Company, L.P.
    • Anthony M Fuller
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    FLUID EJECTION DIE MOLDED INTO MOLDED BODY
    • Publication number 20200247123
    • Publication date Aug 6, 2020
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    DIE CONTACT FORMATIONS
    • Publication number 20200164645
    • Publication date May 28, 2020
    • Hewlett-Packard Development Company, L.P.
    • Michael W Cumbie
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    CONDUCTIVE WIRE DISPOSED IN A LAYER
    • Publication number 20190210366
    • Publication date Jul 11, 2019
    • Hewlett-Packard Development Company, L.P.
    • Anthony M Fuller
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    METHOD OF FORMING A MICRO-STRUCTURE
    • Publication number 20190106802
    • Publication date Apr 11, 2019
    • Hewlett-Packard Development Company, L.P.
    • Peter Mardilovich
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    FLUID EJECTION DEVICE WITH INK FEEDHOLE BRIDGE
    • Publication number 20190016135
    • Publication date Jan 17, 2019
    • Hewlett-Packard Development Company, L.P.
    • Rio Rivas
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    FLUID EJECTION DEVICE INCLUDING INTEGRATED CIRCUIT
    • Publication number 20180319160
    • Publication date Nov 8, 2018
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    FLUID EJECTION DEVICE WITH INK FEEDHOLE BRIDGE
    • Publication number 20170361613
    • Publication date Dec 21, 2017
    • Hewlett-Packard Development Company, L.P.
    • Rio Rivas
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    ADHESION-PROMOTING SURFACE
    • Publication number 20170342580
    • Publication date Nov 30, 2017
    • Hewlett-Packard Development Company, L.P.
    • Peter Mardilovich
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    FLUID EJECTION DEVICE
    • Publication number 20170313065
    • Publication date Nov 2, 2017
    • Hewlett-Packard Development Company, L.P.
    • Donald W Schulte
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    METHOD OF FORMING A MICRO-STRUCTURE
    • Publication number 20170267520
    • Publication date Sep 21, 2017
    • Hewlett-Packard Development Company, L.P.
    • Peter Mardilovich
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    NANO-STRUCTURE AND METHOD OF MAKING THE SAME
    • Publication number 20170159194
    • Publication date Jun 8, 2017
    • Hewlett-Packard Development Company, L.P.
    • Peter Mardilovich
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    FLUID EJECTION STRUCTURE
    • Publication number 20170106651
    • Publication date Apr 20, 2017
    • Hewlett-Packard Development Company, L.P.
    • Bradley D. Chung
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    THERMAL INK JET PRINTHEAD
    • Publication number 20160325547
    • Publication date Nov 10, 2016
    • Hewlett-Packard Development Company, L.P.
    • Lawrence H. White
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS