Anton Leidl

Person

Hohenbrunn, DE

People

Patents Grantslast 30 patents

Information Patent Grant
MEMS device stress-reducing structure
- Patent number 11,142,453
- Issue date Oct 12, 2021
- TDK Corporation
- Klaus Mayer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Resiliently mounted sensor system with damping
- Patent number 10,683,201
- Issue date Jun 16, 2020
- TDK Corporation
- Pirmin Hermann Otto Rombach
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit, circuit assembly and a method for its operation
- Patent number 10,622,957
- Issue date Apr 14, 2020
- TDK Corporation
- Pirmin Hermann Otto Rombach
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Integrated circuit, circuit assembly and a method for its operation
- Patent number 10,581,397
- Issue date Mar 3, 2020
- TDK Corporation
- Pirmin Hermann Otto Rombach
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Microphone and method of operating a microphone
- Patent number 10,142,729
- Issue date Nov 27, 2018
- TDK Corporation
- Jan Tue Ravnkilde
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Top-port MEMS microphone and method of manufacturing the same
- Patent number 10,136,226
- Issue date Nov 20, 2018
- TDK Corporation
- Jan Tue Ravnkilde
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a sensor
- Patent number 9,278,854
- Issue date Mar 8, 2016
- Epcos AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor module and method for producing sensor modules
- Patent number 9,061,888
- Issue date Jun 23, 2015
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Miniaturized electrical component comprising an MEMS and an ASIC an...
- Patent number 9,056,760
- Issue date Jun 16, 2015
- EPCOS AG
- Gregor Feiertag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS microphone and method for producing the MEMS microphone
- Patent number 8,865,499
- Issue date Oct 21, 2014
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing a microphone
- Patent number 8,713,789
- Issue date May 6, 2014
- EPCOS AG
- Anton Leidl
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
MEMS component, method for producing a MEMS component, and method f...
- Patent number 8,674,464
- Issue date Mar 18, 2014
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Component having stress-reduced mounting
- Patent number 8,624,466
- Issue date Jan 7, 2014
- EPCOS AG
- Ansgar Schäufele
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
MEMS-microphone
- Patent number 8,611,566
- Issue date Dec 17, 2013
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS microphone
- Patent number 8,582,788
- Issue date Nov 12, 2013
- EPCOS AG
- Anton Leidl
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor chip arrangement with sensor chip and manufacturing m...
- Patent number 8,580,613
- Issue date Nov 12, 2013
- EPCOS AG
- Gregor Feiertag
- G01 - MEASURING TESTING
Information Patent Grant
MEMS microphone
- Patent number 8,571,239
- Issue date Oct 29, 2013
- EPCOS AG
- Gregor Feiertag
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Arrangement comprising a microphone
- Patent number 8,553,920
- Issue date Oct 8, 2013
- EPCOS AG
- Gregor Feiertag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS package and method for the production thereof
- Patent number 8,432,007
- Issue date Apr 30, 2013
- EPCOS AG
- Anton Leidl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Rotating motion sensor
- Patent number 8,393,214
- Issue date Mar 12, 2013
- EPCOS AG
- Werner Ruile
- G01 - MEASURING TESTING
Information Patent Grant
Electrical module comprising a MEMS microphone
- Patent number 8,184,845
- Issue date May 22, 2012
- EPCOS AG
- Anton Leidl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS package and method for the production thereof
- Patent number 8,169,041
- Issue date May 1, 2012
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Adjustable capacitor and circuit provided therewith
- Patent number 8,009,407
- Issue date Aug 30, 2011
- EPCOS AG
- Anton Leidl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component with sensitive component structures and method for the pr...
- Patent number 7,998,805
- Issue date Aug 16, 2011
- EPCOS AG
- Thomas Baier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SAW-component having a reduced temperature path and method for the...
- Patent number 7,589,452
- Issue date Sep 15, 2009
- EPCOS AG
- Markus Hauser
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
SAW component having an improved temperature coefficient
- Patent number 7,459,991
- Issue date Dec 2, 2008
- EPCOS AG
- Werner Ruile
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Component with sensitive component structures and method for the pr...
- Patent number 7,411,291
- Issue date Aug 12, 2008
- EPCOS AG
- Thomas Baier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode structure for electro-acoustic component and method for p...
- Patent number 7,345,409
- Issue date Mar 18, 2008
- EPCOS AG
- Anton Leidl
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
MEMS Device
- Publication number 20190375630
- Publication date Dec 12, 2019
- TDK Electronics AG
- Klaus Mayer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Integrated Circuit, Circuit Assembly and a Method for its Operation
- Publication number 20180269843
- Publication date Sep 20, 2018
- TDK Corporation
- Pirmin Hermann Otto Rombach
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Integrated Circuit, Circuit Assembly and a Method for its Operation
- Publication number 20180262173
- Publication date Sep 13, 2018
- TDK Corporation
- Pirmin Hermann Otto Rombach
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
RESILIENTLY MOUNTED SENSOR SYSTEM WITH DAMPING
- Publication number 20180244515
- Publication date Aug 30, 2018
- TDK Corporation
- Pirmin Hermann Otto Rombach
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Microphone and Method of Operating a Microphone
- Publication number 20170150253
- Publication date May 25, 2017
- EPCOS AG
- Jan Tue Ravnkilde
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Top-Port MEMS Microphone and Method of Manufacturing the Same
- Publication number 20150326979
- Publication date Nov 12, 2015
- EPCOS AG
- Jan Tue Ravnkilde
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD FOR PRODUCING A SENSOR
- Publication number 20150056725
- Publication date Feb 26, 2015
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PIEZO ACTUATOR WITH PROTECTION AGAINST ENVIRONMENTAL INFLUENCES
- Publication number 20130328448
- Publication date Dec 12, 2013
- EPCOS AG
- Reinhard Gabl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS Microphone And Method For Producing The MEMS Microphone
- Publication number 20130140656
- Publication date Jun 6, 2013
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Miniaturized Electrical Component Comprising an MEMS and an ASIC an...
- Publication number 20130119492
- Publication date May 16, 2013
- EPCOS AG
- Gregor Feiertag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MICROPHONE
- Publication number 20120275634
- Publication date Nov 1, 2012
- EPCOS AG
- Anton Leidl
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MEMS-MICROPHONE
- Publication number 20120224726
- Publication date Sep 6, 2012
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MICROPHONE
- Publication number 20120093346
- Publication date Apr 19, 2012
- EPCOS AG
- Gregor Feiertag
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SENSOR MODULE AND METHOD FOR PRODUCING SENSOR MODULES
- Publication number 20110298064
- Publication date Dec 8, 2011
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR CHIP ARRANGEMENT WITH SENSOR CHIP AND MANUFACTURING M...
- Publication number 20110233690
- Publication date Sep 29, 2011
- EPCOS AG
- Gregor Feiertag
- G01 - MEASURING TESTING
Information Patent Application
MEMS Package and Method for the Production Thereof
- Publication number 20110186943
- Publication date Aug 4, 2011
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Component, Method for Producing a MEMS Component, and Method f...
- Publication number 20110018076
- Publication date Jan 27, 2011
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Arrangement Comprising a Microphone
- Publication number 20100272302
- Publication date Oct 28, 2010
- Gregor Feiertag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPONENT HAVING STRESS-REDUCED MOUNTING
- Publication number 20100176899
- Publication date Jul 15, 2010
- EPCOS AG
- Ansgar Schäufele
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ROTATING MOTION SENSOR
- Publication number 20090255337
- Publication date Oct 15, 2009
- Werner Ruile
- G01 - MEASURING TESTING
Information Patent Application
Microphone Membrane And Microphone Comprising The Same
- Publication number 20090129611
- Publication date May 21, 2009
- EPCOS AG
- Anton Leidl
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Component With Sensitive Component Structures and Method for the Pr...
- Publication number 20090011554
- Publication date Jan 8, 2009
- EPCOS AG
- Thomas Baier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mems Package and Method for the Production Thereof
- Publication number 20090001553
- Publication date Jan 1, 2009
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Mems Microphone
- Publication number 20080267431
- Publication date Oct 30, 2008
- EPCOS AG
- Anton Leidl
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Adjustable Capacitor and Circuit Provided Therewith
- Publication number 20080253056
- Publication date Oct 16, 2008
- Anton Leidl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Module Comprising a Mems Microphone
- Publication number 20080247585
- Publication date Oct 9, 2008
- EPCOS AG
- Anton Leidl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Saw-Component Having a Reduced Temperature Path and Method for the...
- Publication number 20070296306
- Publication date Dec 27, 2007
- Markus Hauser
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Component with sensitive component structures and method for the pr...
- Publication number 20060284307
- Publication date Dec 21, 2006
- EPCOS AG
- Thomas Baier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrode structure comprising an improved output compatibility and...
- Publication number 20060175639
- Publication date Aug 10, 2006
- Anton Leidl
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Saw component having an improved temperature coefficient
- Publication number 20060103486
- Publication date May 18, 2006
- Werner Ruile
- H03 - BASIC ELECTRONIC CIRCUITRY

Anton Leidl

Person

Patents Grantslast 30 patents

MEMS device stress-reducing structure

Resiliently mounted sensor system with damping

Integrated circuit, circuit assembly and a method for its operation

Integrated circuit, circuit assembly and a method for its operation

Microphone and method of operating a microphone

Top-port MEMS microphone and method of manufacturing the same

Method for producing a sensor

Sensor module and method for producing sensor modules

Miniaturized electrical component comprising an MEMS and an ASIC an...

MEMS microphone and method for producing the MEMS microphone

Method of manufacturing a microphone

MEMS component, method for producing a MEMS component, and method f...

Component having stress-reduced mounting

MEMS-microphone

MEMS microphone

Semiconductor chip arrangement with sensor chip and manufacturing m...

MEMS microphone

Arrangement comprising a microphone

MEMS package and method for the production thereof

Rotating motion sensor

Electrical module comprising a MEMS microphone

MEMS package and method for the production thereof

Adjustable capacitor and circuit provided therewith

Component with sensitive component structures and method for the pr...

SAW-component having a reduced temperature path and method for the...

SAW component having an improved temperature coefficient

Component with sensitive component structures and method for the pr...

Electrode structure for electro-acoustic component and method for p...

Patents Applicationslast 30 patents

MEMS Device

Integrated Circuit, Circuit Assembly and a Method for its Operation

Integrated Circuit, Circuit Assembly and a Method for its Operation

RESILIENTLY MOUNTED SENSOR SYSTEM WITH DAMPING

Microphone and Method of Operating a Microphone

Top-Port MEMS Microphone and Method of Manufacturing the Same

METHOD FOR PRODUCING A SENSOR

PIEZO ACTUATOR WITH PROTECTION AGAINST ENVIRONMENTAL INFLUENCES

MEMS Microphone And Method For Producing The MEMS Microphone

Miniaturized Electrical Component Comprising an MEMS and an ASIC an...

MEMS MICROPHONE

MEMS-MICROPHONE

MEMS MICROPHONE

SENSOR MODULE AND METHOD FOR PRODUCING SENSOR MODULES

SEMICONDUCTOR CHIP ARRANGEMENT WITH SENSOR CHIP AND MANUFACTURING M...

MEMS Package and Method for the Production Thereof

MEMS Component, Method for Producing a MEMS Component, and Method f...

Arrangement Comprising a Microphone

COMPONENT HAVING STRESS-REDUCED MOUNTING

ROTATING MOTION SENSOR

Microphone Membrane And Microphone Comprising The Same

Component With Sensitive Component Structures and Method for the Pr...

Mems Package and Method for the Production Thereof

Mems Microphone

Adjustable Capacitor and Circuit Provided Therewith

Electrical Module Comprising a Mems Microphone

Saw-Component Having a Reduced Temperature Path and Method for the...

Component with sensitive component structures and method for the pr...

Electrode structure comprising an improved output compatibility and...

Saw component having an improved temperature coefficient