Arnd Scholz

Person

Dresden, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnect structure for semiconductor devices
- Patent number 8,138,538
- Issue date Mar 20, 2012
- Qimonda AG
- Hans-Peter Moll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor structures
- Patent number 7,867,912
- Issue date Jan 11, 2011
- Qimonda AG
- Dirk Caspary
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing integrated circuits including a FET with a...
- Patent number 7,863,136
- Issue date Jan 4, 2011
- Qimonda AG
- Matthias Goldbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method of manufacturing an integrated circuit
- Patent number 7,622,354
- Issue date Nov 24, 2009
- Qimonda AG
- Lars Dreeskornfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process window enhancement for deep trench spacer conservation
- Patent number 6,825,093
- Issue date Nov 30, 2004
- Infineon Technologies AG
- Arnd R. Scholz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a gate electrode contact spacer for a vertical DR...
- Patent number 6,673,686
- Issue date Jan 6, 2004
- Infineon Technologies AG
- Arnd R. Scholz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer assisted trench top isolation for vertical DRAM's
- Patent number 6,586,300
- Issue date Jul 1, 2003
- Infineon Technologies AG
- Klaus M. Hummler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT STRUCTURE FOR SEMICONDUCTOR DEVICES
- Publication number 20100090264
- Publication date Apr 15, 2010
- QIMONDA AG
- Hans-Peter Moll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING INTEGRATED CIRCUITS INCLUDING A FET WITH A...
- Publication number 20100078711
- Publication date Apr 1, 2010
- QIMONDA AG
- Matthias Goldbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATOR MATERIAL OVER BURIED CONDUCTIVE LINE
- Publication number 20090321805
- Publication date Dec 31, 2009
- QIMONDA AG
- Johannes von Kluge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT
- Publication number 20090057778
- Publication date Mar 5, 2009
- Lars Dreeskornfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method for forming a recessed channel transistor, met...
- Publication number 20080299722
- Publication date Dec 4, 2008
- Jessica Hartwich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR, INTEGRATED CIRCUIT AND METHOD OF FORMING AN INTEGRATED...
- Publication number 20080296674
- Publication date Dec 4, 2008
- QIMONDA AG
- Andrew Graham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF FORMING AN INTEGRATED CIRCUIT
- Publication number 20080283910
- Publication date Nov 20, 2008
- QIMONDA AG
- Lars Dreeskornfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR STRUCTURES
- Publication number 20080197394
- Publication date Aug 21, 2008
- QIMONDA AG
- Dirk Caspary
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transistor, memory cell and method of manufacturing a transistor
- Publication number 20070176253
- Publication date Aug 2, 2007
- Peng-Fei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating a buried conductive connection to a trench c...
- Publication number 20060134877
- Publication date Jun 22, 2006
- Infineon Technologies AG
- Bernd Goebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process window enhancement for deep trench spacer conservation
- Publication number 20030064600
- Publication date Apr 3, 2003
- Infineon Technologies North America Corp.
- Arnd R. Scholz
- H01 - BASIC ELECTRIC ELEMENTS

Arnd Scholz

Person

Patents Grantslast 30 patents

Interconnect structure for semiconductor devices

Methods of manufacturing semiconductor structures

Method of manufacturing integrated circuits including a FET with a...

Integrated circuit and method of manufacturing an integrated circuit

Process window enhancement for deep trench spacer conservation

Method of forming a gate electrode contact spacer for a vertical DR...

Spacer assisted trench top isolation for vertical DRAM&#x00027;s

Patents Applicationslast 30 patents

INTERCONNECT STRUCTURE FOR SEMICONDUCTOR DEVICES

METHOD OF MANUFACTURING INTEGRATED CIRCUITS INCLUDING A FET WITH A...

INSULATOR MATERIAL OVER BURIED CONDUCTIVE LINE

INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT

Manufacturing method for forming a recessed channel transistor, met...

TRANSISTOR, INTEGRATED CIRCUIT AND METHOD OF FORMING AN INTEGRATED...

INTEGRATED CIRCUIT AND METHOD OF FORMING AN INTEGRATED CIRCUIT

METHODS OF MANUFACTURING SEMICONDUCTOR STRUCTURES

Transistor, memory cell and method of manufacturing a transistor

Method for fabricating a buried conductive connection to a trench c...

Process window enhancement for deep trench spacer conservation

Spacer assisted trench top isolation for vertical DRAM's