Arvind SUNDARRAJAN

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Methods for forming microwave tunable composited thin-film dielectr...
- Patent number 12,048,948
- Issue date Jul 30, 2024
- Applied Materials, Inc.
- Yueh Sheng Ow
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Methods and apparatus for processing a substrate
- Patent number 12,020,992
- Issue date Jun 25, 2024
- Applied Materials, Inc.
- Prayudi Lianto
- G01 - MEASURING TESTING
Information Patent Grant
Methods of TSV formation for advanced packaging
- Patent number 11,854,886
- Issue date Dec 26, 2023
- Applied Materials, Inc.
- Peng Suo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate having magnetic core inductor
- Patent number 11,791,094
- Issue date Oct 17, 2023
- Applied Materials, Inc.
- Peng Suo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for controlling warpage in wafer level packag...
- Patent number 11,421,316
- Issue date Aug 23, 2022
- Applied Materials, Inc.
- Prayudi Lianto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of forming through-silicon vias in substrates for advanced...
- Patent number 11,404,318
- Issue date Aug 2, 2022
- Applied Materials, Inc.
- Peng Suo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a magnetic core on a substrate
- Patent number 11,373,803
- Issue date Jun 28, 2022
- Applied Materials, Inc.
- Peng Suo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for bonding substrates
- Patent number 11,309,278
- Issue date Apr 19, 2022
- Applied Materials, Inc.
- Prayudi Lianto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate vacuum transport and storage apparatus
- Patent number 11,302,549
- Issue date Apr 12, 2022
- Applied Materials, Inc.
- Sriskantharajah Thirunavukarasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for backside via reveal processing
- Patent number 11,289,387
- Issue date Mar 29, 2022
- Applied Materials, Inc.
- Prayudi Lianto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for processing a substrate
- Patent number 11,177,146
- Issue date Nov 16, 2021
- Applied Materials, Inc.
- Qi Jie Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive-less substrate bonding to carrier plate
- Patent number 10,847,400
- Issue date Nov 24, 2020
- Applied Materials, Inc.
- Sriskantharajah Thirunavukarasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for wafer-level die bridge
- Patent number 10,651,126
- Issue date May 12, 2020
- Applied Materials, Inc.
- Chien-Kang Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming vias in polymer layers
- Patent number 10,636,696
- Issue date Apr 28, 2020
- Applied Materials, Inc.
- Yu Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-cassette carrying case
- Patent number 10,566,226
- Issue date Feb 18, 2020
- Applied Materials, Inc.
- Sriskantharajah Thirunavukarasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for backside cleaning of substrates
- Patent number 10,549,324
- Issue date Feb 4, 2020
- Applied Materials, Inc.
- Sriskantharajah Thirunavukarasu
- B08 - CLEANING
Information Patent Grant
Methods and apparatus for semiconductor package processing
- Patent number 10,515,927
- Issue date Dec 24, 2019
- Applied Materials, Inc.
- Prayudi Lianto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for 3D MIM capacitor package processing
- Patent number 10,475,735
- Issue date Nov 12, 2019
- Applied Materials, Inc.
- Peng Suo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate transfer chamber
- Patent number 10,347,516
- Issue date Jul 9, 2019
- Applied Materials, Inc.
- Sriskantharajah Thirunavukarasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry for polishing of integrated circuit packaging
- Patent number 10,319,601
- Issue date Jun 11, 2019
- Applied Materials, Inc.
- Ranga Rao Arnepalli
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method and apparatus for wafer level packaging
- Patent number 10,276,424
- Issue date Apr 30, 2019
- Applied Materials, Inc.
- Guan Huei See
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of redistribution layer formation for advanced packaging app...
- Patent number 10,229,827
- Issue date Mar 12, 2019
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reconstituted substrate formation for advanced packaging...
- Patent number 10,211,072
- Issue date Feb 19, 2019
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for transferring a substrate
- Patent number 10,153,187
- Issue date Dec 11, 2018
- Applied Materials, Inc.
- Sriskantharajah Thirunavukarasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for chemical mechanical polishing (CMP) processing with ozone
- Patent number 10,002,771
- Issue date Jun 19, 2018
- Applied Materials, Inc.
- Prayudi Lianto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for backside cleaning of substrates
- Patent number 9,993,853
- Issue date Jun 12, 2018
- Applied Materials, Inc.
- Sriskantharajah Thirunavukarasu
- B08 - CLEANING
Information Patent Grant
Methods for reducing copper overhang in a feature of a substrate
- Patent number 9,978,639
- Issue date May 22, 2018
- Applied Materials, Inc.
- Siew Kit Hoi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Structure and method of fabricating three-dimensional (3D) metal-in...
- Patent number 9,954,051
- Issue date Apr 24, 2018
- Applied Materials, Inc.
- Guan Huei See
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of enhancing polymer adhesion to copper
- Patent number 9,922,874
- Issue date Mar 20, 2018
- Applied Materials, Inc.
- Prayudi Lianto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Step coverage dielectric
- Patent number 9,472,392
- Issue date Oct 18, 2016
- Applied Materials, Inc.
- Zongbin Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of Multi-layer Die Stacking with Die-to-Wafer Bonding
- Publication number 20240266319
- Publication date Aug 8, 2024
- Guan Huei SEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon (Si) Dry Etch for Die-to-Wafer Thinning
- Publication number 20240213028
- Publication date Jun 27, 2024
- Applied Materials, Inc.
- Guan Huei SEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF TSV FORMATION FOR ADVANCED PACKAGING
- Publication number 20240087958
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Peng SUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
- Publication number 20230238287
- Publication date Jul 27, 2023
- Prayudi LIANTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WATER VAPOR PLASMA TO ENHANCE SURFACE HYDROPHILICITY
- Publication number 20230100863
- Publication date Mar 30, 2023
- Prayudi LIANTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED WIDE BACKSIDE POWER RAIL CONTACTS TO MULTIPLE TRANSIST...
- Publication number 20230064183
- Publication date Mar 2, 2023
- Applied Materials, Inc.
- Suketu Arun Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER RAIL TO DEEP VIAS
- Publication number 20230068312
- Publication date Mar 2, 2023
- Applied Materials, Inc.
- Suketu Arun Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ULTRA THINNING OF WAFER
- Publication number 20230061392
- Publication date Mar 2, 2023
- Applied Materials, Inc.
- Suketu Arun Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF TSV FORMATION FOR ADVANCED PACKAGING
- Publication number 20220328354
- Publication date Oct 13, 2022
- Applied Materials, Inc.
- Peng SUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
- Publication number 20220258304
- Publication date Aug 18, 2022
- National University of Singapore
- Prayudi LIANTO
- G01 - MEASURING TESTING
Information Patent Application
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
- Publication number 20220181142
- Publication date Jun 9, 2022
- Applied Materials, Inc.
- Chien-Kang HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING THROUGH-SILICON VIAS IN SUBSTRATES FOR ADVANCED...
- Publication number 20220165621
- Publication date May 26, 2022
- Applied Materials, Inc.
- Peng SUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR BACKSIDE VIA REVEAL PROCESSING
- Publication number 20220037216
- Publication date Feb 3, 2022
- Applied Materials, Inc.
- Prayudi LIANTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE HAVING MAGNETIC CORE INDUCTOR AND METHOD OF...
- Publication number 20210233707
- Publication date Jul 29, 2021
- Applied Materials, Inc.
- Peng Suo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR WAFER-LEVEL PACKAGING USING DIRECT WRITING
- Publication number 20210202334
- Publication date Jul 1, 2021
- Applied Materials, Inc.
- PENG SUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
- Publication number 20210134627
- Publication date May 6, 2021
- Applied Materials, Inc.
- Qi Jie Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR CONTACTLESS SUBSTRATE WARPAGE CORRECTION
- Publication number 20210057238
- Publication date Feb 25, 2021
- Applied Materials, Inc.
- CHIN WEI TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR SUBSTRATE WARPAGE CORRECTION
- Publication number 20210035795
- Publication date Feb 4, 2021
- Applied Materials, Inc.
- Qi Jie PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR REMOVING ABRASIVE PARTICLES
- Publication number 20200306931
- Publication date Oct 1, 2020
- Applied Materials, Inc.
- PRAYUDI LIANTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE-LESS SUBSTRATE BONDING TO CARRIER PLATE
- Publication number 20200211883
- Publication date Jul 2, 2020
- Applied Materials, Inc.
- SRISKANTHARAJAH THIRUNAVUKARASU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING MICROWAVE TUNABLE COMPOSITED THIN-FILM DIELECTR...
- Publication number 20200206775
- Publication date Jul 2, 2020
- Applied Materials, Inc.
- Yueh Sheng Ow
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
METHODS FOR BONDING SUBSTRATES
- Publication number 20200135690
- Publication date Apr 30, 2020
- Applied Materials, Inc.
- PRAYUDI LIANTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND APPARATUS FOR CONTROLLING WARPAGE IN WAFER LEVEL PACKAG...
- Publication number 20200131624
- Publication date Apr 30, 2020
- Applied Materials, Inc.
- PRAYUDI LIANTO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE TRANSFER CHAMBER
- Publication number 20190326146
- Publication date Oct 24, 2019
- Applied Materials, Inc.
- SRISKANTHARAJAH THIRUNAVUKARASU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CASSETTE CARRYING CASE
- Publication number 20190326147
- Publication date Oct 24, 2019
- Applied Materials, Inc.
- SRISKANTHARAJAH THIRUNAVUKARASU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR EMBEDDED ANTIFUSES
- Publication number 20190287898
- Publication date Sep 19, 2019
- Peng Suo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF RECONSTITUTED SUBSTRATE FORMATION FOR ADVANCED PACKAGING...
- Publication number 20190181019
- Publication date Jun 13, 2019
- Applied Materials, Inc.
- Han-Wen CHEN
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHODS AND APPARATUS FOR WAFER-LEVEL DIE BRIDGE
- Publication number 20190181092
- Publication date Jun 13, 2019
- Applied Materials, Inc.
- CHIEN-KANG HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE HAVING MAGNETIC CORE INDUCTOR AND METHOD OF...
- Publication number 20190051454
- Publication date Feb 14, 2019
- Peng Suo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR WAFER LEVEL PACKAGING
- Publication number 20190006223
- Publication date Jan 3, 2019
- GUAN HUEI SEE
- H01 - BASIC ELECTRIC ELEMENTS

Arvind SUNDARRAJAN

Person

Patents Grantslast 30 patents

Methods for forming microwave tunable composited thin-film dielectr...

Methods and apparatus for processing a substrate

Methods of TSV formation for advanced packaging

Semiconductor substrate having magnetic core inductor

Methods and apparatus for controlling warpage in wafer level packag...

Methods of forming through-silicon vias in substrates for advanced...

Method of forming a magnetic core on a substrate

Methods for bonding substrates

Substrate vacuum transport and storage apparatus

Methods and apparatus for backside via reveal processing

Methods and apparatus for processing a substrate

Adhesive-less substrate bonding to carrier plate

Methods and apparatus for wafer-level die bridge

Methods for forming vias in polymer layers

Multi-cassette carrying case

Method and apparatus for backside cleaning of substrates

Methods and apparatus for semiconductor package processing

Methods and apparatus for 3D MIM capacitor package processing

Substrate transfer chamber

Slurry for polishing of integrated circuit packaging

Method and apparatus for wafer level packaging

Method of redistribution layer formation for advanced packaging app...

Method of reconstituted substrate formation for advanced packaging...

Methods and apparatus for transferring a substrate

Methods for chemical mechanical polishing (CMP) processing with ozone

Method and apparatus for backside cleaning of substrates

Methods for reducing copper overhang in a feature of a substrate

Structure and method of fabricating three-dimensional (3D) metal-in...

Methods of enhancing polymer adhesion to copper

Step coverage dielectric

Patents Applicationslast 30 patents

Method of Multi-layer Die Stacking with Die-to-Wafer Bonding

Silicon (Si) Dry Etch for Die-to-Wafer Thinning

METHODS OF TSV FORMATION FOR ADVANCED PACKAGING

METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE

WATER VAPOR PLASMA TO ENHANCE SURFACE HYDROPHILICITY

SELF-ALIGNED WIDE BACKSIDE POWER RAIL CONTACTS TO MULTIPLE TRANSIST...

BACKSIDE POWER RAIL TO DEEP VIAS

METHOD OF ULTRA THINNING OF WAFER

METHODS OF TSV FORMATION FOR ADVANCED PACKAGING

METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE

METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE

METHODS OF FORMING THROUGH-SILICON VIAS IN SUBSTRATES FOR ADVANCED...

METHODS AND APPARATUS FOR BACKSIDE VIA REVEAL PROCESSING

SEMICONDUCTOR SUBSTRATE HAVING MAGNETIC CORE INDUCTOR AND METHOD OF...

METHODS AND APPARATUS FOR WAFER-LEVEL PACKAGING USING DIRECT WRITING

METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE

METHODS AND APPARATUS FOR CONTACTLESS SUBSTRATE WARPAGE CORRECTION

METHODS AND APPARATUS FOR SUBSTRATE WARPAGE CORRECTION

METHODS AND APPARATUS FOR REMOVING ABRASIVE PARTICLES

ADHESIVE-LESS SUBSTRATE BONDING TO CARRIER PLATE

METHODS FOR FORMING MICROWAVE TUNABLE COMPOSITED THIN-FILM DIELECTR...

METHODS FOR BONDING SUBSTRATES

METHODS AND APPARATUS FOR CONTROLLING WARPAGE IN WAFER LEVEL PACKAG...

SUBSTRATE TRANSFER CHAMBER

MULTI-CASSETTE CARRYING CASE

METHODS AND APPARATUS FOR EMBEDDED ANTIFUSES

METHOD OF RECONSTITUTED SUBSTRATE FORMATION FOR ADVANCED PACKAGING...

METHODS AND APPARATUS FOR WAFER-LEVEL DIE BRIDGE

SEMICONDUCTOR SUBSTRATE HAVING MAGNETIC CORE INDUCTOR AND METHOD OF...

METHOD AND APPARATUS FOR WAFER LEVEL PACKAGING