Bao Le

Person

Santa Ana, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Dynamic contact and fiber optic termini cavity to wire removable seals
- Patent number 11,435,530
- Issue date Sep 6, 2022
- Aptiv Technologies Limited
- Eric James Smoll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector with dielectric properties suitable for high s...
- Patent number 10,644,421
- Issue date May 5, 2020
- APTIV TECHNOLOGIES LIMITED
- Eric J. Smoll
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector assembly
- Patent number 10,396,485
- Issue date Aug 27, 2019
- Delphi Technologies, LLC
- Eric J. Smoll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit with micro-sized probe tips and a method of making...
- Patent number 7,504,839
- Issue date Mar 17, 2009
- Delphi Technologies, Inc.
- Haim Feigenbaum
- G01 - MEASURING TESTING
Information Patent Grant
Stress relief bend useful in an integrated circuit redistribution p...
- Patent number 6,617,510
- Issue date Sep 9, 2003
- Delphi Technologies, Inc.
- Chris M. Schreiber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Column grid array for flip-chip devices
- Patent number 6,449,840
- Issue date Sep 17, 2002
- Delphi Technologies, Inc.
- Bao Le
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress relief bend useful in an integrated circuit redistribution p...
- Patent number 6,313,402
- Issue date Nov 6, 2001
- Packard Hughes Interconnect Company
- Chris M. Schreiber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a flexible circuit with raised features protruding...
- Patent number 6,085,414
- Issue date Jul 11, 2000
- Packard Hughes Interconnect Company
- David Bryan Swarbrick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Switch having raised contact features and a deflectable substrate
- Patent number 5,856,641
- Issue date Jan 5, 1999
- Packard Hughes Interconnect Company
- Chris M. Schreiber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making contact pad having metallically anchored elastomer...
- Patent number 5,855,063
- Issue date Jan 5, 1999
- Packard Hughes Interconnect Company
- Chris M. Schreiber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integral copper column with solder bump flip chip
- Patent number 5,790,377
- Issue date Aug 4, 1998
- Packard Hughes Interconnect Company
- Chris M. Schreiber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad having metallically anchored elastomeric electrical con...
- Patent number 5,738,530
- Issue date Apr 14, 1998
- Packard Hughes Interconnect Company
- Chris M. Schreiber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Puncture-resistant electrostatic chuck with flat surface and method...
- Patent number 5,708,557
- Issue date Jan 13, 1998
- Packard Hughes Interconnect Company
- Haim Feigenbaum
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Alignment means for integrated circuit chips
- Patent number 5,657,207
- Issue date Aug 12, 1997
- Packard Hughes Interconnect Company
- Chris M. Schreiber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector assembly for microelectronic multi-chip-module
- Patent number 5,435,733
- Issue date Jul 25, 1995
- Hughes Aircraft Company
- Gerald P. Chernicky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact system unit for personal computers
- Patent number 5,038,308
- Issue date Aug 6, 1991
- AST Research, Inc.
- Bao G. Le
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
DYNAMIC CONTACT AND FIBER OPTIC TERMINI CAVITY TO WIRE REMOVABLE SEALS
- Publication number 20220179155
- Publication date Jun 9, 2022
- Aptiv Technologies Limited
- Eric James Smoll
- G02 - OPTICS
Information Patent Application
ELECTRICAL CONNECTOR WITH DIELECTRIC PROPERTIES SUITABLE FOR HIGH S...
- Publication number 20200006878
- Publication date Jan 2, 2020
- Delphi Technologies, LLC
- Eric J. Smoll
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRICAL ASSEMBLY BY OVERPRINTING MATE...
- Publication number 20190319436
- Publication date Oct 17, 2019
- Delphi Technologies, LLC
- Eric J. Smoll
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
HERMETICALLY SEALED WIRE CONNECTOR ASSEMBLY AND METHOD OF MAKING SAME
- Publication number 20140238741
- Publication date Aug 28, 2014
- Delphi Technologies, Inc.
- STEVEN WILLING
- F02 - COMBUSTION ENGINES HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
Information Patent Application
WIRE CONNECTOR ASSEMBLY INCLUDING SPLICE ELEMENTS FOR FLUID ENVIRON...
- Publication number 20130140082
- Publication date Jun 6, 2013
- Delphi Technologies, Inc.
- STEVEN WILLING
- F02 - COMBUSTION ENGINES HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
Information Patent Application
WIRE CONNECTOR ASSEMBLY INCLUDING SPLICE ELEMENTS FOR FLUID ENVIRON...
- Publication number 20130032395
- Publication date Feb 7, 2013
- Delphi Technologies, Inc.
- ERIC J. SMOLL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible circuit with micro-sized probe tips and a method of making...
- Publication number 20060071677
- Publication date Apr 6, 2006
- Haim Feigenbaum
- G01 - MEASURING TESTING
Information Patent Application
Stress relief bend useful in an integrated circuit redistribution p...
- Publication number 20020053464
- Publication date May 9, 2002
- Chris M. Schreiber
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Dynamic contact and fiber optic termini cavity to wire removable seals

Electrical connector with dielectric properties suitable for high s...

Electrical connector assembly

Flexible circuit with micro-sized probe tips and a method of making...

Stress relief bend useful in an integrated circuit redistribution p...

Column grid array for flip-chip devices

Stress relief bend useful in an integrated circuit redistribution p...

Method of making a flexible circuit with raised features protruding...

Switch having raised contact features and a deflectable substrate

Method of making contact pad having metallically anchored elastomer...

Integral copper column with solder bump flip chip

Contact pad having metallically anchored elastomeric electrical con...

Puncture-resistant electrostatic chuck with flat surface and method...

Alignment means for integrated circuit chips

Connector assembly for microelectronic multi-chip-module

Compact system unit for personal computers

Patents Applicationslast 30 patents

DYNAMIC CONTACT AND FIBER OPTIC TERMINI CAVITY TO WIRE REMOVABLE SEALS

ELECTRICAL CONNECTOR WITH DIELECTRIC PROPERTIES SUITABLE FOR HIGH S...

METHOD OF MANUFACTURING AN ELECTRICAL ASSEMBLY BY OVERPRINTING MATE...

HERMETICALLY SEALED WIRE CONNECTOR ASSEMBLY AND METHOD OF MAKING SAME

WIRE CONNECTOR ASSEMBLY INCLUDING SPLICE ELEMENTS FOR FLUID ENVIRON...

WIRE CONNECTOR ASSEMBLY INCLUDING SPLICE ELEMENTS FOR FLUID ENVIRON...

Flexible circuit with micro-sized probe tips and a method of making...

Stress relief bend useful in an integrated circuit redistribution p...