Number | Name | Date | Kind |
---|---|---|---|
4249302 | Crepeau | Feb 1981 | A |
4412642 | Fisher, Jr. | Nov 1983 | A |
4590411 | Reimann | May 1986 | A |
4663479 | Reimann | May 1987 | A |
4780177 | Wojnarowski et al. | Oct 1988 | A |
4862588 | MacKay | Sep 1989 | A |
4991290 | MacKay | Feb 1991 | A |
5046238 | Daigle et al. | Sep 1991 | A |
5129142 | Bindra et al. | Jul 1992 | A |
5136359 | Takayama et al. | Aug 1992 | A |
5233157 | Schreiber et al. | Aug 1993 | A |
5374469 | Hino et al. | Dec 1994 | A |
5432677 | Mowatt et al. | Jul 1995 | A |
5497545 | Watanabe et al. | Mar 1996 | A |
5497546 | Kubo et al. | Mar 1996 | A |
5699612 | Inoue et al. | Dec 1997 | A |
5800723 | Juskey et al. | Sep 1998 | A |
5895581 | Grunwald | Apr 1999 | A |
5983492 | Fjelstad | Nov 1999 | A |
Entry |
---|
Photofabrication Methods with Kodak Photoresists, Pub. No. G-184, Eastman Kodak Co., 1979 pp. 1-32. |
C4 Product Design Manual—Chapters 1 and 2—(Dates unknown). |
Stanley Hirsch, “Tin-Lead, Lead and Tin Plating”, Harstan Chemical Div., Chemtech Indus., Inc., Brooklyn, NY (Dates unknown), pp. 280-284. |
Brzozowski et al, “Printed-Wiring Boards”, Chapter 2, pp. 2.1-2.8, (Dates unknown). |
Lithography and Photofabrication, pp. 10.19-10.30, (Dates unknown) Chapter Ten. |