Claims
- 1. A product comprising:
a metallic trace having a first and a second substantially planar potion and a raised portion extending from the first substantially planar portion and secured to a first component, a stress relief bend formed in the metallic trace adjacent the secured raised portion, the stress relief bend extending from and surrounded by the first and the second substantially planar portion of the metallic trace, and at least a portion of the metallic trace being encapsulated by a dielectric material.
- 2. A product as set forth in claim 1 wherein the component comprises a semi-conductor device.
- 3. A product as set forth in claim 1 wherein the component comprises a heat generating component.
- 4. A product as set forth in claim 1 wherein the raised feature has a conical shape.
- 5. A product as defined in claim 1 wherein the stress relief bend is encapsulated by the dielectric material.
- 6. A product as set forth in claim 1 wherein at least a portion of the metallic trace is encapsulated by a flexible substrate.
- 7. A product comprising:
an electrical trace having a planar portion and a raised portion extending from the planar portion and secured to an electrical component, and a stress relief bend adjacent the secured raised portion and extending from the planar portion, the raised portion having a conical or hemispherical shape.
- 8. A product as set forth in claim 9 wherein the electrical component comprises a semi-conductor device.
RELATED APPLICATION
[0001] This is a continuation of U.S. patent application Ser. No. 08/959,837 filed Oct. 29, 1997.
Continuations (1)
|
Number |
Date |
Country |
Parent |
08959837 |
Oct 1997 |
US |
Child |
09955215 |
Sep 2001 |
US |