Barbara Hasler

Person

Stockdorf, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit having a semiconductor substrate with barrier layer
- Patent number 8,581,405
- Issue date Nov 12, 2013
- Infineon Technologies AG
- Stephan Dertinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate with feedthrough and method for producing the same
- Patent number 8,263,491
- Issue date Sep 11, 2012
- Infineon Technologies AG
- Florian Binder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with feedthrough and method for producing the same
- Patent number 8,048,801
- Issue date Nov 1, 2011
- Infineon Technologies, AG
- Stephan Dertinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having a semiconductor substrate with a barrier...
- Patent number 7,977,798
- Issue date Jul 12, 2011
- Infineon Technologies AG
- Stephan Dertinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit and method of fabricating the same
- Patent number 7,973,417
- Issue date Jul 5, 2011
- Qimonda AG
- Alfred Martin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder contacts and methods of forming same
- Patent number 7,745,321
- Issue date Jun 29, 2010
- Qimonda AG
- Alfred Martin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing an electrically conducting connection
- Patent number 6,708,405
- Issue date Mar 23, 2004
- Infineon Technologies AG
- Barbara Hasler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SRAM cell arrangement and method for manufacturing same
- Patent number 6,309,930
- Issue date Oct 30, 2001
- Siemens Aktiengesellschaft
- Bernd Goebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SRAM cell arrangement and method for manufacturing same
- Patent number 6,222,753
- Issue date Apr 24, 2001
- Siemens Aktiengesellschaft
- Bernd Goebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically programmable memory cell configuration
- Patent number 6,118,159
- Issue date Sep 12, 2000
- Siemens Aktiengesellschaft
- Josef Willer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for etching integrated semiconductor circuits containing dou...
- Patent number 4,479,850
- Issue date Oct 30, 1984
- Siemens Aktiengesellschaft
- Willy Beinvogl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing polysilicon structure in the 1 .mu.m range on s...
- Patent number 4,380,489
- Issue date Apr 19, 1983
- Siemens Aktiengesellschaft
- Willy Beinvogl
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT HAVING A SEMICONDUCTOR SUBSTRATE WITH BARRIER LAYER
- Publication number 20110233630
- Publication date Sep 29, 2011
- INFINEON TECHNOLOGIES AG
- Stephan Dertinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF FABRICATING THE SAME
- Publication number 20090261480
- Publication date Oct 22, 2009
- Alfred Martin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER CONTACTS AND METHODS OF FORMING SAME
- Publication number 20090179333
- Publication date Jul 16, 2009
- Alfred Martin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate with Feedthrough and Method for Producing the Same
- Publication number 20080268638
- Publication date Oct 30, 2008
- INFINEON TECHNOLOGIES AG
- Stephan Dertinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH FEEDTHROUGH AND METHOD FOR PRODUCING THE SAME
- Publication number 20080217784
- Publication date Sep 11, 2008
- Florian Binder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing an electrically conducting connection
- Publication number 20020032962
- Publication date Mar 21, 2002
- Barbara Hasler
- H01 - BASIC ELECTRIC ELEMENTS

Barbara Hasler

Person

Patents Grantslast 30 patents

Integrated circuit having a semiconductor substrate with barrier layer

Substrate with feedthrough and method for producing the same

Substrate with feedthrough and method for producing the same

Integrated circuit having a semiconductor substrate with a barrier...

Integrated circuit and method of fabricating the same

Solder contacts and methods of forming same

Method for producing an electrically conducting connection

SRAM cell arrangement and method for manufacturing same

SRAM cell arrangement and method for manufacturing same

Electrically programmable memory cell configuration

Method for etching integrated semiconductor circuits containing dou...

Method of producing polysilicon structure in the 1 .mu.m range on s...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT HAVING A SEMICONDUCTOR SUBSTRATE WITH BARRIER LAYER

INTEGRATED CIRCUIT AND METHOD OF FABRICATING THE SAME

SOLDER CONTACTS AND METHODS OF FORMING SAME

Substrate with Feedthrough and Method for Producing the Same

SUBSTRATE WITH FEEDTHROUGH AND METHOD FOR PRODUCING THE SAME

Method for producing an electrically conducting connection