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BIDYUT K. BHATTACHARYYA
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PHOENIX, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Integrated circuit die and/or package having a variable pitch conta...
Patent number
7,030,479
Issue date
Apr 18, 2006
Intel Corporation
William M. Siu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Integrated circuit die and/or package having a variable pitch conta...
Patent number
6,664,620
Issue date
Dec 16, 2003
Intel Corporation
William M. Siu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayer molded plastic package design
Patent number
5,777,265
Issue date
Jul 7, 1998
Intel Corporation
Bidyut K. Bhattacharyya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Anchor provisions to prevent mold delamination in an overmolded pla...
Patent number
5,773,895
Issue date
Jun 30, 1998
Intel Corporation
Altaf Hassan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Use of tantalum oxide capacitor on ceramic co-fired technology
Patent number
5,666,004
Issue date
Sep 9, 1997
Intel Corporation
Bidyut K. Bhattacharyya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High performance and high capacitance package with improved thermal...
Patent number
5,607,883
Issue date
Mar 4, 1997
Intel Corporation
Bidyut K. Bhattacharyya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High performance and high capacitance package with improved thermal...
Patent number
5,608,261
Issue date
Mar 4, 1997
Intel Corporation
Bidyut K. Bhattacharyya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Advance multilayer molded plastic package using mesic technology
Patent number
5,556,807
Issue date
Sep 17, 1996
Intel Corporation
Bidyut K. Bhattacharyya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer molded plastic package using mesic technology
Patent number
5,488,257
Issue date
Jan 30, 1996
Intel Corporation
Bidyut Bhattacharyya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power distribution lid for IC package
Patent number
5,475,565
Issue date
Dec 12, 1995
Intel Corporation
Bidyut K. Bhattacharyya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit having a two-dimensional lead grid array
Patent number
5,420,461
Issue date
May 30, 1995
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
De-coupling capacitor on the top of the silicon die by eutectic fli...
Patent number
5,369,545
Issue date
Nov 29, 1994
Intel Corporation
Bidyut K. Bhattacharyya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus of coupling a die to a lead frame with a tape...
Patent number
5,345,363
Issue date
Sep 6, 1994
Intel Corporation
Bidyut Bhattacharyya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead grid array integrated circuit
Patent number
5,210,939
Issue date
May 18, 1993
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Alumina multilayer wiring substrate provided with high dielectric m...
Patent number
5,099,388
Issue date
Mar 24, 1992
NGK Spark Plug Co., Ltd.
Masahiro Ogawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multiple resistivity wiring apparatus
Patent number
5,060,049
Issue date
Oct 22, 1991
NGK Spark Plug Co., Ltd.
Kozo Yamasaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-layer molded plastic IC package
Patent number
4,891,687
Issue date
Jan 2, 1990
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making a multilayer molded plastic IC package
Patent number
4,835,120
Issue date
May 30, 1989
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for bonding die to substrate using a gold/silicon seed
Patent number
4,810,671
Issue date
Mar 7, 1989
Intel Corporation
Bidyut K. Bhattacharyya
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Process of attaching a die to a substrate using gold/silicon seed
Patent number
4,771,018
Issue date
Sep 13, 1988
Intel Corporation
Bidyut K. Bhattacharyya
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Integrated circuit die and/or package having a variable pitch conta...
Publication number
20040061223
Publication date
Apr 1, 2004
William M. Siu
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
INTEGRATED CIRCUIT DIE AND/OR PACKAGE HAVING A VARIABLE PITCH CONTA...
Publication number
20010045633
Publication date
Nov 29, 2001
WILLIAM M. SIU
H01 - BASIC ELECTRIC ELEMENTS