Claims
- 1. An integrated circuit package that houses an integrated circuit, comprising:
- a conductive plate;
- a first insulative layer that is adjacent to said conductive plate;
- a first conductive layer that is adjacent to said first insulative layer;
- a lead frame having a plurality of conductive leads;
- a layer of polyimide located between said first conductive layer and said lead frame;
- a via that extends through said lead frame and said polyimide layer said via containing an electrically conductive material which electrically connects said lead frame to said first conductive layer;
- a passive element located on said first insulative layer and coupled to said first conductive layer; and,
- first connector means for electrically coupling said conductive plate with said lead frame.
- 2. The package as recited in claim 1, further comprising second connector means for coupling the integrated circuit with said conductive plate, said first conductive layer and said lead frame.
- 3. The package as recited in claim 2, further comprising a plastic shell that encapsulates the integrated circuit, said conductive plate, said first and second insulative layers, said first conductive layer, said lead frame and said first and second connector means.
- 4. The package as recited in claim 1, wherein said first conductive layer has at least one power plane.
- 5. The package as recited in claim 1, wherein said first conductive layer has at least one signal line.
- 6. The package as recited in claim 5, wherein said first conductive layer has at least one resistor integrally connected to said signal line and electrically coupled to the integrated circuit.
- 7. The package as recited in claim 5, wherein said first conductive layer has at least one capacitor integrally connected to said signal line and electrically coupled to the integrated circuit.
- 8. The package as recited in claim 1, wherein said first connector means includes at least one tab extending from said conductive plate, that is attached to said lead frame.
- 9. The package as recited in claim 1, wherein said first connector means is at least one via within said first insulative layer that electrically couples said conductive plate to said first conductive layer.
- 10. The package as recited in claim 9, further comprising at least one third insulative layer that separates at least one second conductive layer from said first conductive layer and separates consecutive second conductive layers from each other, wherein there is at least one via that electrically couples said conductive layers.
Parent Case Info
This is a continuation of application Ser. No. 08/108,766 filed Aug. 18, 1993 now abandoned, which is a continuation of Ser. No. 07/837,285 filed Feb. 18, 1992 now abandoned.
US Referenced Citations (8)
Foreign Referenced Citations (7)
Number |
Date |
Country |
3626151A1 |
Feb 1988 |
DEX |
0278227 |
Apr 1990 |
DEX |
WO9106978 |
May 1991 |
WOX |
0457593A2 |
Nov 1991 |
WOX |
0459179A1 |
Dec 1991 |
WOX |
0474469A1 |
Mar 1992 |
WOX |
0484257A1 |
May 1992 |
WOX |
Non-Patent Literature Citations (3)
Entry |
IBM Technical Disclosure Bulletin, R. O. Lussow, "Internal Capacitors and Resistors for Multilayer Ceramic Modules", vol. 20, No. 9, pp. 3436-3437, Feb. 1978. |
Sixth IEEE/CHMT International Electronic Manufacturing Technology Symposium, "Proceedings 1989 Japan IEMT Symposium", pp. 220-229. Apr. 26-28, 1989. |
Abstracts of Japan, M. Fujimoto, "Semiconductor Integrated Device", vol. 11, No. 73, Mar. 5, 1987. |
Continuations (2)
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Number |
Date |
Country |
Parent |
108766 |
Aug 1993 |
|
Parent |
837285 |
Feb 1992 |
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