Claims
- 1. An integrated circuit package, comprising:
- a package that has a first outer surface and an opposite second outer surface, said package further containing a surface pad located on a bonding shelf and a center opening;
- a capacitor that is mounted to said first outer surface of said package;
- an integrated circuit that is mounted and electrically connected to said capacitor through said center opening of said package; and,
- a bond wire that couples said integrated circuit to said surface pad.
- 2. The package as recited in claim 1, wherein said ceramic package has a pin that extends from said second outer surface and is electrically coupled to said surface pad.
- 3. The package as recited in claim 1, wherein said capacitor has a first electrode connected to said integrated circuit and a second electrode connected to said package.
Parent Case Info
This is a Continuation Application of application Ser. No. 08/561,170, filed Nov. 21,1995, which in turn is a continuation of application Ser. No. 08/315,125, filed Sep. 28,1994. Both now abandoned.
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Continuations (2)
|
Number |
Date |
Country |
Parent |
561170 |
Nov 1995 |
|
Parent |
315125 |
Sep 1994 |
|