Claims
- 1. An integrated circuit package adapted to be coupled to a printed circuit board which has a mounting surface, comprising:
- a module having a plurality of contact pads on a first surface of said module that faces the mounting surface of the printed circuit board when said module is coupled to the printed circuit board, each of said contact pads having a first edge and an opposite second edge; and,
- a plurality of leads, each of said leads having a first end that is attached to said first edge of one of said contact pads, an arcuate shaped foot portion which extends from said first end across one of said contact pads and a second end that is not attached to one of said contact pads but is adjacent to said second edge of one of said contact pad such that said second end of each of said leads comes into contact with one of said contact pads when said module is pressed onto the printed circuit board.
- 2. The package as recited in claim 1, wherein said contact pads and leads are arranged in a two dimensional array along said first surface.
- 3. The package as recited in claim 2, wherein said module has at least two alignment studs extending from said first surface.
Parent Case Info
This is a continuation of application Ser. No. 08/012,031, filed Feb. 1, 1993, now abandoned, which is a divisional of application Ser. No. 07/870,542, filed Apr. 17, 1992, now U.S. Pat. No. 5,210,939.
US Referenced Citations (13)
Divisions (1)
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Number |
Date |
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Parent |
870542 |
Apr 1992 |
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Continuations (1)
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12031 |
Feb 1993 |
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