Bongsub LEE

Person

Mountain View, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Offset pads over TSV
- Patent number 12,243,851
- Issue date Mar 4, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Bongsub Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV as pad
- Patent number 12,205,926
- Issue date Jan 21, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for bonding elements including conductive interface feat...
- Patent number 11,955,393
- Issue date Apr 9, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pads over TSV
- Patent number 11,955,445
- Issue date Apr 9, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV as pad
- Patent number 11,749,645
- Issue date Sep 5, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset pads over TSV
- Patent number 11,728,313
- Issue date Aug 15, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Bongsub Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Large metal pads over TSV
- Patent number 11,393,779
- Issue date Jul 19, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 11,004,757
- Issue date May 11, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset pads over TSV
- Patent number 10,998,292
- Issue date May 4, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Bongsub Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanoscale interconnect array for stacked dies
- Patent number 10,600,761
- Issue date Mar 24, 2020
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanoscale interconnect array for stacked dies
- Patent number 10,304,803
- Issue date May 28, 2019
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging using wire bond wires in place of a redistrib...
- Patent number 10,008,469
- Issue date Jun 26, 2018
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures to repair device warpage
- Patent number 9,859,234
- Issue date Jan 2, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer-level packaging using metal foil lamination
- Patent number 9,847,238
- Issue date Dec 19, 2017
- Invensas Corporation
- Xuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer-level packaging using metal foil lamination
- Patent number 9,646,946
- Issue date May 9, 2017
- Invensas Corporation
- Xuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packages with mechanically decoupled fan-in and fan-out...
- Patent number 9,543,277
- Issue date Jan 10, 2017
- Invensas Corporation
- Bongsub Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging using wire bond wires in place of a redistrib...
- Patent number 9,502,372
- Issue date Nov 22, 2016
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ORGANIC-TO-INORGANIC BONDING METHODS AND STRUCTURES
- Publication number 20250185163
- Publication date Jun 5, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Oliver Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURES FOR BONDING ELEMENTS INCLUDING CONDUCTIVE INTERFACE FEAT...
- Publication number 20240249985
- Publication date Jul 25, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECTLY BONDED METAL STRUCTURES HAVING ALUMINUM FEATURES AND METHO...
- Publication number 20240217210
- Publication date Jul 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Oliver Zhao
- B32 - LAYERED PRODUCTS
Information Patent Application
METAL PADS OVER TSV
- Publication number 20240194625
- Publication date Jun 13, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV AS PAD
- Publication number 20240088101
- Publication date Mar 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET PADS OVER TSV
- Publication number 20240006383
- Publication date Jan 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Bongsub Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANSION CONTROLLED STRUCTURE FOR DIRECT BONDING AND METHOD OF FOR...
- Publication number 20230343734
- Publication date Oct 26, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEQUENCES AND EQUIPMENT FOR DIRECT BONDING
- Publication number 20230067677
- Publication date Mar 2, 2023
- INVENSAS BONDING TECHNOLOGIES, INC.
- Bongsub Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL PADS OVER TSV
- Publication number 20220302058
- Publication date Sep 22, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR BONDING ELEMENTS
- Publication number 20210265227
- Publication date Aug 26, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET PADS OVER TSV
- Publication number 20210257341
- Publication date Aug 19, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Bongsub LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV AS PAD
- Publication number 20190385935
- Publication date Dec 19, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET PADS OVER TSV
- Publication number 20190385982
- Publication date Dec 19, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Bongsub LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE METAL PADS OVER TSV
- Publication number 20190385966
- Publication date Dec 19, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR BONDING ELEMENTS
- Publication number 20190348336
- Publication date Nov 14, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSCALE INTERCONNECT ARRAY FOR STACKED DIES
- Publication number 20190237437
- Publication date Aug 1, 2019
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nanoscale Interconnect Array for Stacked Dies
- Publication number 20170323867
- Publication date Nov 9, 2017
- Invensas Corporatoin
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Wafer-Level Packaging Using Metal Foil Lamination
- Publication number 20170170031
- Publication date Jun 15, 2017
- Invensas Corporation
- Xuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WAFER-LEVEL PACKAGING USING METAL FOIL LAMINATION
- Publication number 20170103957
- Publication date Apr 13, 2017
- Invensas Corporation
- Xuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGING USING WIRE BOND WIRES IN PLACE OF A REDISTRIB...
- Publication number 20170069591
- Publication date Mar 9, 2017
- Invensas Corporation
- Rajesh KATKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES TO REPAIR DEVICE WARPAGE
- Publication number 20170040270
- Publication date Feb 9, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGING USING WIRE BOND WIRES IN PLACE OF A REDISTRIB...
- Publication number 20160322326
- Publication date Nov 3, 2016
- Invensas Corporation
- Rajesh KATKAR
- H01 - BASIC ELECTRIC ELEMENTS

Bongsub LEE

Person

Patents Grantslast 30 patents

Offset pads over TSV

TSV as pad

Structures for bonding elements including conductive interface feat...

Metal pads over TSV

TSV as pad

Offset pads over TSV

Large metal pads over TSV

Bonded structures

Offset pads over TSV

Nanoscale interconnect array for stacked dies

Nanoscale interconnect array for stacked dies

Wafer-level packaging using wire bond wires in place of a redistrib...

Methods and structures to repair device warpage

Fan-out wafer-level packaging using metal foil lamination

Fan-out wafer-level packaging using metal foil lamination

Wafer level packages with mechanically decoupled fan-in and fan-out...

Wafer-level packaging using wire bond wires in place of a redistrib...

Patents Applicationslast 30 patents

ORGANIC-TO-INORGANIC BONDING METHODS AND STRUCTURES

STRUCTURES FOR BONDING ELEMENTS INCLUDING CONDUCTIVE INTERFACE FEAT...

DIRECTLY BONDED METAL STRUCTURES HAVING ALUMINUM FEATURES AND METHO...

METAL PADS OVER TSV

TSV AS PAD

OFFSET PADS OVER TSV

EXPANSION CONTROLLED STRUCTURE FOR DIRECT BONDING AND METHOD OF FOR...

SEQUENCES AND EQUIPMENT FOR DIRECT BONDING

METAL PADS OVER TSV

STRUCTURES FOR BONDING ELEMENTS

OFFSET PADS OVER TSV

TSV AS PAD

OFFSET PADS OVER TSV

LARGE METAL PADS OVER TSV

STRUCTURES FOR BONDING ELEMENTS

NANOSCALE INTERCONNECT ARRAY FOR STACKED DIES

Nanoscale Interconnect Array for Stacked Dies

Fan-Out Wafer-Level Packaging Using Metal Foil Lamination

FAN-OUT WAFER-LEVEL PACKAGING USING METAL FOIL LAMINATION

WAFER-LEVEL PACKAGING USING WIRE BOND WIRES IN PLACE OF A REDISTRIB...

METHODS AND STRUCTURES TO REPAIR DEVICE WARPAGE

WAFER-LEVEL PACKAGING USING WIRE BOND WIRES IN PLACE OF A REDISTRIB...