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Bradley D. Boland
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Gilbert, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Power semiconductor package with strap
Patent number
6,873,041
Issue date
Mar 29, 2005
Amkor Technology, Inc.
Sean T. Crowley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Making two lead surface mounting high power microleadframe semicond...
Patent number
6,756,658
Issue date
Jun 29, 2004
Amkor Technology, Inc.
Blake A. Gillett
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including metal strap electrically coupled bet...
Patent number
6,707,138
Issue date
Mar 16, 2004
Amkor Technology, Inc.
Sean T. Crowley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power semiconductor package with strap
Patent number
6,630,726
Issue date
Oct 7, 2003
Amkor Technology, Inc.
Sean T. Crowley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaging high power integrated circuit devices
Patent number
6,521,982
Issue date
Feb 18, 2003
Amkor Technology, Inc.
Sean T. Crowley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having multiple dies with independently biase...
Patent number
6,396,130
Issue date
May 28, 2002
Amkor Technology, Inc.
Sean T. Crowley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thin leadframe-type semiconductor package having heat sink with rec...
Patent number
6,198,163
Issue date
Mar 6, 2001
Amkor Technology, Inc.
Sean Timothy Crowley
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Packaging high power integrated circuit devices
Publication number
20030075785
Publication date
Apr 24, 2003
Amkor Technology, Inc.
Sean T. Crowley
H01 - BASIC ELECTRIC ELEMENTS