Number | Name | Date | Kind |
---|---|---|---|
4189342 | Kock | Feb 1980 | A |
4935803 | Kalfus et al. | Jun 1990 | A |
5218231 | Kudo | Jun 1993 | A |
5266834 | Nishi et al. | Nov 1993 | A |
5521429 | Aono et al. | May 1996 | A |
5544412 | Romero et al. | Aug 1996 | A |
5665996 | Williams et al. | Sep 1997 | A |
5814884 | Davis et al. | Sep 1998 | A |
5977613 | Takata et al. | Nov 1999 | A |
5977630 | Woodworth et al. | Nov 1999 | A |
6040626 | Cheah et al. | Mar 2000 | A |
6143981 | Glenn | Nov 2000 | A |
6229200 | Mclellan et al. | May 2001 | B1 |
6256200 | Lam et al. | Jul 2001 | B1 |
Number | Date | Country |
---|---|---|
0720225 | Mar 1996 | EP |
0720234 | Mar 1996 | EP |
60-116239 | Aug 1985 | JP |
8-64634 | Mar 1996 | JP |
Entry |
---|
Vishay Siliconix Press Release, http://www.siliconix.com/www/200/pr98/4430.html, Dec. 9, 1998, pp. 1-3. |
Glenn et al., “Exposed Copper Strap In A Semiconductor Package,” U.S. patent application No. 09/733,148, filed Dec. 7, 2000, pp. 1-15 and 5 sheets of figures. |
Crowley et al., “Packaging High Power Integrated Circuit Devices,” U.S. patent application No. 09/587,136, filed Jun. 2, 2000, pp. 1-26 and 4 sheets of figures. |
Crowley et al., “Attaching Semiconductor Dies To Substrates With Conductive Straps,” U.S. patent application No. 09/536,236, filed Mar. 27, 2000, pp. 1-22 and 4 sheets of figures. |