Brandon Marin

Person

West Covina, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
In-plane inductors in IC packages
- Patent number 12,336,197
- Issue date Jun 17, 2025
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate core having an embedded laser stop to control...
- Patent number 12,327,814
- Issue date Jun 10, 2025
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate optical vias
- Patent number 12,313,890
- Issue date May 27, 2025
- Intel Corporation
- Pooya Tadayon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass interposer optical resonator device and method
- Patent number 12,306,480
- Issue date May 20, 2025
- Intel Corporation
- Hiroki Tanaka
- G02 - OPTICS
Information Patent Grant
Converting multiple light signals into and out of a single waveleng...
- Patent number 12,282,174
- Issue date Apr 22, 2025
- Intel Corporation
- Kaveh Hosseini
- G02 - OPTICS
Information Patent Grant
Airgap structures for high speed signal integrity
- Patent number 12,255,130
- Issue date Mar 18, 2025
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate having an embedded etch stop to control cavity...
- Patent number 12,255,147
- Issue date Mar 18, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magneto-optical Kerr effect interconnects for photonic packaging
- Patent number 12,253,722
- Issue date Mar 18, 2025
- Intel Corporation
- Hiroki Tanaka
- G02 - OPTICS
Information Patent Grant
Package substrate z-disaggregation with liquid metal interconnects
- Patent number 12,230,564
- Issue date Feb 18, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic inductor device and method
- Patent number 12,224,253
- Issue date Feb 11, 2025
- Intel Corporation
- Xin Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Angled inductor with small form factor
- Patent number 12,224,103
- Issue date Feb 11, 2025
- Intel Corporation
- Brandon Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Minimizing package impedance discontinuity through dielectric struc...
- Patent number 12,125,777
- Issue date Oct 22, 2024
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structural elements for application specific electronic device pack...
- Patent number 12,074,102
- Issue date Aug 27, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrates having embedded inductors
- Patent number 12,057,252
- Issue date Aug 6, 2024
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively roughened copper architectures for low insertion loss c...
- Patent number 12,033,930
- Issue date Jul 9, 2024
- Intel Corporation
- Jieying Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive route patterning for electronic substrates
- Patent number 12,027,466
- Issue date Jul 2, 2024
- Intel Corporation
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractive etch resolution implementing a functional thin metal re...
- Patent number 11,948,848
- Issue date Apr 2, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitors with nanoislands on conductive plates
- Patent number 11,855,125
- Issue date Dec 26, 2023
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive route patterning for electronic substrates
- Patent number 11,817,349
- Issue date Nov 14, 2023
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Core-shell particles for magnetic packaging
- Patent number 11,804,420
- Issue date Oct 31, 2023
- Intel Corporation
- Brandon Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming embedded grounding planes on interconnect layers
- Patent number 11,791,228
- Issue date Oct 17, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having conductive structures with differ...
- Patent number 11,737,208
- Issue date Aug 22, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic material having coated ferromagnetic filler particles
- Patent number 11,728,077
- Issue date Aug 15, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of embedded thin-film resistors for semiconduc...
- Patent number 11,728,265
- Issue date Aug 15, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating multiplexed hollow waveguides of variable ty...
- Patent number 11,721,650
- Issue date Aug 8, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin dielectric films using photo up-conversion for applicati...
- Patent number 11,670,504
- Issue date Jun 6, 2023
- Intel Corporation
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package including a capacitor
- Patent number 11,652,071
- Issue date May 16, 2023
- Intel Corporation
- Brandon C Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sandwich-molded cores for high-inductance architectures
- Patent number 11,622,448
- Issue date Apr 4, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating an RF filter on a semiconductor package using selective...
- Patent number 11,605,867
- Issue date Mar 14, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual side de-bonding in component carriers using photoablation
- Patent number 11,462,432
- Issue date Oct 4, 2022
- Intel Corporation
- Frank Truong
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH SELECTIVE METALLIZATION FOR GLASS C...
- Publication number 20250210495
- Publication date Jun 26, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH STRENGTHENED GLASS CORES
- Publication number 20250210426
- Publication date Jun 26, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED DEPTH CAVITY FOR EMBEDDED BRIDGE STRUCTURES
- Publication number 20250210469
- Publication date Jun 26, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR EMBEDDING DEEP TRENCH CAPACITOR (DTC) COM...
- Publication number 20250201787
- Publication date Jun 19, 2025
- Intel Corporation
- Marcel M. Said
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH CRACK-HEALING MATERIALS FOR GLASS C...
- Publication number 20250201732
- Publication date Jun 19, 2025
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH PRE-SINGULATION EDGE FEATURES IN GL...
- Publication number 20250192069
- Publication date Jun 12, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH POST-SINGULATION EDGE FEATURES IN G...
- Publication number 20250192070
- Publication date Jun 12, 2025
- Intel Corporation
- Jesse C. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BRIDGE WITH THROUGH SILICON VIA BONDING ARCHITECTURES
- Publication number 20250192059
- Publication date Jun 12, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING FOR EMBEDDED BRIDGES WITH VIAS
- Publication number 20250183180
- Publication date Jun 5, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE STRUCTURES IN EMBEDDED BRIDGE ARCHITECTURES
- Publication number 20250183179
- Publication date Jun 5, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH THROUGH-GLASS VIA STRESS ALLEVIATIO...
- Publication number 20250183182
- Publication date Jun 5, 2025
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING GLASS-CORED SUBSTRATES WITH S...
- Publication number 20250149455
- Publication date May 8, 2025
- Intel Corporation
- Nicholas Haehn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORES WITH EMBEDDED POWER DELIVERY COMPONENTS
- Publication number 20250132264
- Publication date Apr 24, 2025
- Intel Corporation
- Huong Thu Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Publication number 20250126814
- Publication date Apr 17, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT S...
- Publication number 20250125307
- Publication date Apr 17, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Publication number 20250125201
- Publication date Apr 17, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Publication number 20250125202
- Publication date Apr 17, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Publication number 20250120102
- Publication date Apr 10, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR A COAXIAL INDUCTOR IN A GLASS CORE
- Publication number 20250112179
- Publication date Apr 3, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY
- Publication number 20250112100
- Publication date Apr 3, 2025
- Intel Corporation
- Robert May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING
- Publication number 20250112124
- Publication date Apr 3, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES
- Publication number 20250112175
- Publication date Apr 3, 2025
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS
- Publication number 20250112136
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DI...
- Publication number 20250112162
- Publication date Apr 3, 2025
- Intel Corporation
- Zheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES
- Publication number 20250112085
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING SUBSTRATE BUMP HEIGHT
- Publication number 20250112164
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND REL...
- Publication number 20250112165
- Publication date Apr 3, 2025
- Intel Corporation
- Brandon Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTORS FOR SEMICONDUCTOR PACKAGE SUBSTRATES
- Publication number 20250107112
- Publication date Mar 27, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE COUPLED TO A GLAS...
- Publication number 20250105156
- Publication date Mar 27, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED MET...
- Publication number 20250105074
- Publication date Mar 27, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS

Brandon Marin

Person

Patents Grantslast 30 patents

In-plane inductors in IC packages

Electronic substrate core having an embedded laser stop to control...

Through-substrate optical vias

Glass interposer optical resonator device and method

Converting multiple light signals into and out of a single waveleng...

Airgap structures for high speed signal integrity

Electronic substrate having an embedded etch stop to control cavity...

Magneto-optical Kerr effect interconnects for photonic packaging

Package substrate z-disaggregation with liquid metal interconnects

Magnetic inductor device and method

Angled inductor with small form factor

Minimizing package impedance discontinuity through dielectric struc...

Structural elements for application specific electronic device pack...

Electronic substrates having embedded inductors

Selectively roughened copper architectures for low insertion loss c...

Conductive route patterning for electronic substrates

Subtractive etch resolution implementing a functional thin metal re...

Capacitors with nanoislands on conductive plates

Conductive route patterning for electronic substrates

Core-shell particles for magnetic packaging

Method for forming embedded grounding planes on interconnect layers

Microelectronic assemblies having conductive structures with differ...

Magnetic material having coated ferromagnetic filler particles

Selective deposition of embedded thin-film resistors for semiconduc...

Method for fabricating multiplexed hollow waveguides of variable ty...

Ultra-thin dielectric films using photo up-conversion for applicati...

Electronic device package including a capacitor

Sandwich-molded cores for high-inductance architectures

Fabricating an RF filter on a semiconductor package using selective...

Dual side de-bonding in component carriers using photoablation

Patents Applicationslast 30 patents

MICROELECTRONIC ASSEMBLIES WITH SELECTIVE METALLIZATION FOR GLASS C...

MICROELECTRONIC ASSEMBLIES WITH STRENGTHENED GLASS CORES

MIXED DEPTH CAVITY FOR EMBEDDED BRIDGE STRUCTURES

APPARATUS AND METHODS FOR EMBEDDING DEEP TRENCH CAPACITOR (DTC) COM...

MICROELECTRONIC ASSEMBLIES WITH CRACK-HEALING MATERIALS FOR GLASS C...

MICROELECTRONIC ASSEMBLIES WITH PRE-SINGULATION EDGE FEATURES IN GL...

MICROELECTRONIC ASSEMBLIES WITH POST-SINGULATION EDGE FEATURES IN G...

EMBEDDED BRIDGE WITH THROUGH SILICON VIA BONDING ARCHITECTURES

DIRECT BONDING FOR EMBEDDED BRIDGES WITH VIAS

PASSIVE STRUCTURES IN EMBEDDED BRIDGE ARCHITECTURES

MICROELECTRONIC ASSEMBLIES WITH THROUGH-GLASS VIA STRESS ALLEVIATIO...

INTEGRATED CIRCUIT PACKAGES INCLUDING GLASS-CORED SUBSTRATES WITH S...

GLASS CORES WITH EMBEDDED POWER DELIVERY COMPONENTS

PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES

MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT S...

PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES

PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES

PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES

TECHNOLOGIES FOR A COAXIAL INDUCTOR IN A GLASS CORE

DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY

DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING

MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES

GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS

DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DI...

APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES

CONTROLLING SUBSTRATE BUMP HEIGHT

ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND REL...

INDUCTORS FOR SEMICONDUCTOR PACKAGE SUBSTRATES

INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE COUPLED TO A GLAS...

GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED MET...