Brandon Marin

Person

West Covina, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Minimizing package impedance discontinuity through dielectric struc...
- Patent number 12,125,777
- Issue date Oct 22, 2024
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structural elements for application specific electronic device pack...
- Patent number 12,074,102
- Issue date Aug 27, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrates having embedded inductors
- Patent number 12,057,252
- Issue date Aug 6, 2024
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively roughened copper architectures for low insertion loss c...
- Patent number 12,033,930
- Issue date Jul 9, 2024
- Intel Corporation
- Jieying Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive route patterning for electronic substrates
- Patent number 12,027,466
- Issue date Jul 2, 2024
- Intel Corporation
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractive etch resolution implementing a functional thin metal re...
- Patent number 11,948,848
- Issue date Apr 2, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitors with nanoislands on conductive plates
- Patent number 11,855,125
- Issue date Dec 26, 2023
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive route patterning for electronic substrates
- Patent number 11,817,349
- Issue date Nov 14, 2023
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Core-shell particles for magnetic packaging
- Patent number 11,804,420
- Issue date Oct 31, 2023
- Intel Corporation
- Brandon Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming embedded grounding planes on interconnect layers
- Patent number 11,791,228
- Issue date Oct 17, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having conductive structures with differ...
- Patent number 11,737,208
- Issue date Aug 22, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic material having coated ferromagnetic filler particles
- Patent number 11,728,077
- Issue date Aug 15, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of embedded thin-film resistors for semiconduc...
- Patent number 11,728,265
- Issue date Aug 15, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating multiplexed hollow waveguides of variable ty...
- Patent number 11,721,650
- Issue date Aug 8, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin dielectric films using photo up-conversion for applicati...
- Patent number 11,670,504
- Issue date Jun 6, 2023
- Intel Corporation
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package including a capacitor
- Patent number 11,652,071
- Issue date May 16, 2023
- Intel Corporation
- Brandon C Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sandwich-molded cores for high-inductance architectures
- Patent number 11,622,448
- Issue date Apr 4, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating an RF filter on a semiconductor package using selective...
- Patent number 11,605,867
- Issue date Mar 14, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual side de-bonding in component carriers using photoablation
- Patent number 11,462,432
- Issue date Oct 4, 2022
- Intel Corporation
- Frank Truong
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Package-integrated vertical capacitors and methods of assembling same
- Patent number 11,296,186
- Issue date Apr 5, 2022
- Intel Corporation
- Brandon C Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless-catalyst doped-mold materials for integrated-circuit di...
- Patent number 11,227,849
- Issue date Jan 18, 2022
- Intel Corporation
- Brandon C Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic material having coated ferromagnetic filler particles
- Patent number 11,158,444
- Issue date Oct 26, 2021
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating an RF filter on a semiconductor package using selective...
- Patent number 11,081,768
- Issue date Aug 3, 2021
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package including a capacitor
- Patent number 10,923,443
- Issue date Feb 16, 2021
- Intel Corporation
- Brandon C Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package with reduced thickness variation
- Patent number 10,910,327
- Issue date Feb 2, 2021
- Intel Corporation
- Yonggang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-integrated vertical capacitors and methods of assembling same
- Patent number 10,546,916
- Issue date Jan 28, 2020
- Intel Corporation
- Brandon C Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective metallization of an integrated circuit (IC) substrate
- Patent number 10,290,557
- Issue date May 14, 2019
- Intel Corporation
- Brandon C. Marin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
IN-SITU MICRO-FLUIDIC CHANNELS FOR HEAT DISSIPATION IN GLASS SUBSTRATE
- Publication number 20240395661
- Publication date Nov 28, 2024
- Intel Corporation
- Numair Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH INTEGRATED GLASS-BASED ANTENNA UNITS
- Publication number 20240363995
- Publication date Oct 31, 2024
- Intel Corporation
- Bai Nie
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DISAGGREGATED PACKAGE SUBSTRATES WITH GLASS CORES
- Publication number 20240355749
- Publication date Oct 24, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO REDUCE STRESS BETWEEN SOCKETS AND ASSOCIAT...
- Publication number 20240355758
- Publication date Oct 24, 2024
- Intel Corporation
- Steven Adam Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO REDUCE DELAMINATION IN HYBRID CORES
- Publication number 20240347402
- Publication date Oct 17, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTE...
- Publication number 20240339381
- Publication date Oct 10, 2024
- Intel Corporation
- Hiroki TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED INTERCONNECT BRIDGE WITH INDUCTOR FOR POWER DELIVERY
- Publication number 20240339412
- Publication date Oct 10, 2024
- Intel Corporation
- Cary KULIASHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTORLESS CIRCUITS FOR CURRENT-VOLTAGE CONTROL AND REGULATION IN...
- Publication number 20240332322
- Publication date Oct 3, 2024
- Intel Corporation
- Srinivasan Raman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPRAY-COATED PHOTORESIST AND PHOTOIMAGEABLE DIELECTRICS TO ENABLE T...
- Publication number 20240332195
- Publication date Oct 3, 2024
- Intel Corporation
- Naiya SOETAN-DODD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING REPLACEABLE FIBER CO...
- Publication number 20240329339
- Publication date Oct 3, 2024
- Intel Corporation
- Jeremy Ecton
- G02 - OPTICS
Information Patent Application
ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS
- Publication number 20240331921
- Publication date Oct 3, 2024
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE SUBSTRATE WITH LGA NOTCH
- Publication number 20240321656
- Publication date Sep 26, 2024
- Intel Corporation
- Gang DUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURES IN BONDED GLASS SUBSTRATES
- Publication number 20240312853
- Publication date Sep 19, 2024
- Intel Corporation
- Sashi S. KANDANUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURES IN BONDED GLASS SUBSTRATES
- Publication number 20240312888
- Publication date Sep 19, 2024
- Intel Corporation
- Sashi S. KANDANUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPERLESS REGIONS TO CONTROL PLATING GROWTH
- Publication number 20240243088
- Publication date Jul 18, 2024
- Intel Corporation
- Brandon C. MARIN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRO-OPTICAL CIRCUITS WITH LOW-COST SWITCHABLE PHOTONIC INTERFACE
- Publication number 20240219633
- Publication date Jul 4, 2024
- Intel Corporation
- Suddhasattwa Nad
- G02 - OPTICS
Information Patent Application
STACKED MULTICHIP IC DEVICE PACKAGES INCLUDING A GLASS SUBSTRATE
- Publication number 20240224543
- Publication date Jul 4, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE STRUCTURES WITH SOLDER JOINT ASSEMBLIES HAV...
- Publication number 20240222139
- Publication date Jul 4, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDED DIE-LAST INTERCONNECT ARCHITECTURES
- Publication number 20240222286
- Publication date Jul 4, 2024
- Intel Corporation
- Mohammad Mamunur RAHMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRO-OPTICAL CIRCUITS WITH LOW-VOLTAGE SWITCHABLE PHOTONIC INTER...
- Publication number 20240219645
- Publication date Jul 4, 2024
- Intel Corporation
- Suddhasattwa Nad
- G02 - OPTICS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240219655
- Publication date Jul 4, 2024
- Intel Corporation
- Haobo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECTLY BONDED MULTICHIP IC DEVICE PACKAGES
- Publication number 20240222320
- Publication date Jul 4, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURES WITH HETEROGENEOUS INTEGRATION OF VARIOUS DEV...
- Publication number 20240222219
- Publication date Jul 4, 2024
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENABLING COPPER RECESS FLATTENING THROUGH BLOCKED COPPER ETCHING PR...
- Publication number 20240222130
- Publication date Jul 4, 2024
- Intel Corporation
- Shaojiang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE DEVICE WITH PLATED THROUGH HOLES
- Publication number 20240222257
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR VERTICALLY INTERCONNECTED GLASS CORE ARCHITECTURE
- Publication number 20240222279
- Publication date Jul 4, 2024
- Intel Corporation
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR DIE RECYCLING FOR HIGH YIELD PACKAGING
- Publication number 20240222298
- Publication date Jul 4, 2024
- Intel Corporation
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARCHITECTURES AND METHODS FOR METAL LAMINATION ON A GLASS LAYER
- Publication number 20240222248
- Publication date Jul 4, 2024
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE PACKAGE SUBSTRATES WITH GLASS CORE LAYER...
- Publication number 20240222249
- Publication date Jul 4, 2024
- Intel Corporation
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE EMBEDDED MULTI-LAYERED IN VIA CAPACITORS
- Publication number 20240222035
- Publication date Jul 4, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS

Brandon Marin

Person

Patents Grantslast 30 patents

Minimizing package impedance discontinuity through dielectric struc...

Structural elements for application specific electronic device pack...

Electronic substrates having embedded inductors

Selectively roughened copper architectures for low insertion loss c...

Conductive route patterning for electronic substrates

Subtractive etch resolution implementing a functional thin metal re...

Capacitors with nanoislands on conductive plates

Conductive route patterning for electronic substrates

Core-shell particles for magnetic packaging

Method for forming embedded grounding planes on interconnect layers

Microelectronic assemblies having conductive structures with differ...

Magnetic material having coated ferromagnetic filler particles

Selective deposition of embedded thin-film resistors for semiconduc...

Method for fabricating multiplexed hollow waveguides of variable ty...

Ultra-thin dielectric films using photo up-conversion for applicati...

Electronic device package including a capacitor

Sandwich-molded cores for high-inductance architectures

Fabricating an RF filter on a semiconductor package using selective...

Dual side de-bonding in component carriers using photoablation

Package-integrated vertical capacitors and methods of assembling same

Electroless-catalyst doped-mold materials for integrated-circuit di...

Magnetic material having coated ferromagnetic filler particles

Fabricating an RF filter on a semiconductor package using selective...

Electronic device package including a capacitor

Electronic device package with reduced thickness variation

Package-integrated vertical capacitors and methods of assembling same

Selective metallization of an integrated circuit (IC) substrate

Patents Applicationslast 30 patents

IN-SITU MICRO-FLUIDIC CHANNELS FOR HEAT DISSIPATION IN GLASS SUBSTRATE

MICROELECTRONIC ASSEMBLIES WITH INTEGRATED GLASS-BASED ANTENNA UNITS

DISAGGREGATED PACKAGE SUBSTRATES WITH GLASS CORES

METHODS AND APPARATUS TO REDUCE STRESS BETWEEN SOCKETS AND ASSOCIAT...

METHODS AND APPARATUS TO REDUCE DELAMINATION IN HYBRID CORES

AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTE...

EMBEDDED INTERCONNECT BRIDGE WITH INDUCTOR FOR POWER DELIVERY

INDUCTORLESS CIRCUITS FOR CURRENT-VOLTAGE CONTROL AND REGULATION IN...

SPRAY-COATED PHOTORESIST AND PHOTOIMAGEABLE DIELECTRICS TO ENABLE T...

PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING REPLACEABLE FIBER CO...

ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS

GLASS CORE SUBSTRATE WITH LGA NOTCH

VIA STRUCTURES IN BONDED GLASS SUBSTRATES

VIA STRUCTURES IN BONDED GLASS SUBSTRATES

COPPERLESS REGIONS TO CONTROL PLATING GROWTH

ELECTRO-OPTICAL CIRCUITS WITH LOW-COST SWITCHABLE PHOTONIC INTERFACE

STACKED MULTICHIP IC DEVICE PACKAGES INCLUDING A GLASS SUBSTRATE

MICROELECTRONIC PACKAGE STRUCTURES WITH SOLDER JOINT ASSEMBLIES HAV...

HYBRID BONDED DIE-LAST INTERCONNECT ARCHITECTURES

ELECTRO-OPTICAL CIRCUITS WITH LOW-VOLTAGE SWITCHABLE PHOTONIC INTER...

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

DIRECTLY BONDED MULTICHIP IC DEVICE PACKAGES

PACKAGE ARCHITECTURES WITH HETEROGENEOUS INTEGRATION OF VARIOUS DEV...

ENABLING COPPER RECESS FLATTENING THROUGH BLOCKED COPPER ETCHING PR...

GLASS SUBSTRATE DEVICE WITH PLATED THROUGH HOLES

TECHNOLOGIES FOR VERTICALLY INTERCONNECTED GLASS CORE ARCHITECTURE

TECHNOLOGIES FOR DIE RECYCLING FOR HIGH YIELD PACKAGING

ARCHITECTURES AND METHODS FOR METAL LAMINATION ON A GLASS LAYER

INTEGRATED CIRCUIT DEVICE PACKAGE SUBSTRATES WITH GLASS CORE LAYER...

PACKAGE SUBSTRATE EMBEDDED MULTI-LAYERED IN VIA CAPACITORS