Brandon Marin

Person

West Covina, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Converting multiple light signals into and out of a single waveleng...
- Patent number 12,282,174
- Issue date Apr 22, 2025
- Intel Corporation
- Kaveh Hosseini
- G02 - OPTICS
Information Patent Grant
Airgap structures for high speed signal integrity
- Patent number 12,255,130
- Issue date Mar 18, 2025
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate having an embedded etch stop to control cavity...
- Patent number 12,255,147
- Issue date Mar 18, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magneto-optical Kerr effect interconnects for photonic packaging
- Patent number 12,253,722
- Issue date Mar 18, 2025
- Intel Corporation
- Hiroki Tanaka
- G02 - OPTICS
Information Patent Grant
Package substrate z-disaggregation with liquid metal interconnects
- Patent number 12,230,564
- Issue date Feb 18, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic inductor device and method
- Patent number 12,224,253
- Issue date Feb 11, 2025
- Intel Corporation
- Xin Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Angled inductor with small form factor
- Patent number 12,224,103
- Issue date Feb 11, 2025
- Intel Corporation
- Brandon Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Minimizing package impedance discontinuity through dielectric struc...
- Patent number 12,125,777
- Issue date Oct 22, 2024
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structural elements for application specific electronic device pack...
- Patent number 12,074,102
- Issue date Aug 27, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrates having embedded inductors
- Patent number 12,057,252
- Issue date Aug 6, 2024
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively roughened copper architectures for low insertion loss c...
- Patent number 12,033,930
- Issue date Jul 9, 2024
- Intel Corporation
- Jieying Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive route patterning for electronic substrates
- Patent number 12,027,466
- Issue date Jul 2, 2024
- Intel Corporation
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractive etch resolution implementing a functional thin metal re...
- Patent number 11,948,848
- Issue date Apr 2, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitors with nanoislands on conductive plates
- Patent number 11,855,125
- Issue date Dec 26, 2023
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive route patterning for electronic substrates
- Patent number 11,817,349
- Issue date Nov 14, 2023
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Core-shell particles for magnetic packaging
- Patent number 11,804,420
- Issue date Oct 31, 2023
- Intel Corporation
- Brandon Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming embedded grounding planes on interconnect layers
- Patent number 11,791,228
- Issue date Oct 17, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having conductive structures with differ...
- Patent number 11,737,208
- Issue date Aug 22, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic material having coated ferromagnetic filler particles
- Patent number 11,728,077
- Issue date Aug 15, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of embedded thin-film resistors for semiconduc...
- Patent number 11,728,265
- Issue date Aug 15, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating multiplexed hollow waveguides of variable ty...
- Patent number 11,721,650
- Issue date Aug 8, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin dielectric films using photo up-conversion for applicati...
- Patent number 11,670,504
- Issue date Jun 6, 2023
- Intel Corporation
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package including a capacitor
- Patent number 11,652,071
- Issue date May 16, 2023
- Intel Corporation
- Brandon C Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sandwich-molded cores for high-inductance architectures
- Patent number 11,622,448
- Issue date Apr 4, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating an RF filter on a semiconductor package using selective...
- Patent number 11,605,867
- Issue date Mar 14, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual side de-bonding in component carriers using photoablation
- Patent number 11,462,432
- Issue date Oct 4, 2022
- Intel Corporation
- Frank Truong
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Package-integrated vertical capacitors and methods of assembling same
- Patent number 11,296,186
- Issue date Apr 5, 2022
- Intel Corporation
- Brandon C Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless-catalyst doped-mold materials for integrated-circuit di...
- Patent number 11,227,849
- Issue date Jan 18, 2022
- Intel Corporation
- Brandon C Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic material having coated ferromagnetic filler particles
- Patent number 11,158,444
- Issue date Oct 26, 2021
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating an RF filter on a semiconductor package using selective...
- Patent number 11,081,768
- Issue date Aug 3, 2021
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
GLASS CORES WITH EMBEDDED POWER DELIVERY COMPONENTS
- Publication number 20250132264
- Publication date Apr 24, 2025
- Intel Corporation
- Huong Thu Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Publication number 20250126814
- Publication date Apr 17, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT S...
- Publication number 20250125307
- Publication date Apr 17, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Publication number 20250125201
- Publication date Apr 17, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Publication number 20250125202
- Publication date Apr 17, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Publication number 20250120102
- Publication date Apr 10, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY
- Publication number 20250112100
- Publication date Apr 3, 2025
- Intel Corporation
- Robert May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING
- Publication number 20250112124
- Publication date Apr 3, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES
- Publication number 20250112175
- Publication date Apr 3, 2025
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR A COAXIAL INDUCTOR IN A GLASS CORE
- Publication number 20250112179
- Publication date Apr 3, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS
- Publication number 20250112136
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DI...
- Publication number 20250112162
- Publication date Apr 3, 2025
- Intel Corporation
- Zheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES
- Publication number 20250112085
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING SUBSTRATE BUMP HEIGHT
- Publication number 20250112164
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND REL...
- Publication number 20250112165
- Publication date Apr 3, 2025
- Intel Corporation
- Brandon Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTORS FOR SEMICONDUCTOR PACKAGE SUBSTRATES
- Publication number 20250107112
- Publication date Mar 27, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE COUPLED TO A GLAS...
- Publication number 20250105156
- Publication date Mar 27, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED MET...
- Publication number 20250105074
- Publication date Mar 27, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL METAL INDUCTOR LOOPS AND ASSOCIATED METHODS
- Publication number 20250104911
- Publication date Mar 27, 2025
- Intel Corporation
- Jaeil Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...
- Publication number 20250105209
- Publication date Mar 27, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...
- Publication number 20250105222
- Publication date Mar 27, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION
- Publication number 20250106983
- Publication date Mar 27, 2025
- Intel Corporation
- Bohan SHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE OVER A GLASS PATCH
- Publication number 20250096053
- Publication date Mar 20, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH BRIDGE DIE AND SELECTIVE METALLIZATIO...
- Publication number 20250096143
- Publication date Mar 20, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH PACKAGE SUBSTRATE HAVING BLIND CAVITY WIT...
- Publication number 20250079266
- Publication date Mar 6, 2025
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH BRIDGE DIES HAVING AIR GAPS AROUND VIAS
- Publication number 20250062206
- Publication date Feb 20, 2025
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR EDGE PROTECTED GLASS CORES
- Publication number 20250022786
- Publication date Jan 16, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LIGHT EMITTING DIODE STRUCTURES FORMED IN A RECESS OF A TRANS...
- Publication number 20250022908
- Publication date Jan 16, 2025
- Intel Corporation
- Brandon Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORES INCLUDING MULTIPLE LAYERS AND RELATED METHODS
- Publication number 20250006570
- Publication date Jan 2, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU MICRO-FLUIDIC CHANNELS FOR HEAT DISSIPATION IN GLASS SUBSTRATE
- Publication number 20240395661
- Publication date Nov 28, 2024
- Intel Corporation
- Numair Ahmed
- H01 - BASIC ELECTRIC ELEMENTS

Brandon Marin

Person

Patents Grantslast 30 patents

Converting multiple light signals into and out of a single waveleng...

Airgap structures for high speed signal integrity

Electronic substrate having an embedded etch stop to control cavity...

Magneto-optical Kerr effect interconnects for photonic packaging

Package substrate z-disaggregation with liquid metal interconnects

Magnetic inductor device and method

Angled inductor with small form factor

Minimizing package impedance discontinuity through dielectric struc...

Structural elements for application specific electronic device pack...

Electronic substrates having embedded inductors

Selectively roughened copper architectures for low insertion loss c...

Conductive route patterning for electronic substrates

Subtractive etch resolution implementing a functional thin metal re...

Capacitors with nanoislands on conductive plates

Conductive route patterning for electronic substrates

Core-shell particles for magnetic packaging

Method for forming embedded grounding planes on interconnect layers

Microelectronic assemblies having conductive structures with differ...

Magnetic material having coated ferromagnetic filler particles

Selective deposition of embedded thin-film resistors for semiconduc...

Method for fabricating multiplexed hollow waveguides of variable ty...

Ultra-thin dielectric films using photo up-conversion for applicati...

Electronic device package including a capacitor

Sandwich-molded cores for high-inductance architectures

Fabricating an RF filter on a semiconductor package using selective...

Dual side de-bonding in component carriers using photoablation

Package-integrated vertical capacitors and methods of assembling same

Electroless-catalyst doped-mold materials for integrated-circuit di...

Magnetic material having coated ferromagnetic filler particles

Fabricating an RF filter on a semiconductor package using selective...

Patents Applicationslast 30 patents

GLASS CORES WITH EMBEDDED POWER DELIVERY COMPONENTS

PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES

MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT S...

PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES

PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES

PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES

DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY

DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING

MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES

TECHNOLOGIES FOR A COAXIAL INDUCTOR IN A GLASS CORE

GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS

DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DI...

APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES

CONTROLLING SUBSTRATE BUMP HEIGHT

ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND REL...

INDUCTORS FOR SEMICONDUCTOR PACKAGE SUBSTRATES

INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE COUPLED TO A GLAS...

GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED MET...

COAXIAL METAL INDUCTOR LOOPS AND ASSOCIATED METHODS

HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...

HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...

STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION

MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE OVER A GLASS PATCH

MICROELECTRONIC ASSEMBLY WITH BRIDGE DIE AND SELECTIVE METALLIZATIO...

PACKAGE ARCHITECTURE WITH PACKAGE SUBSTRATE HAVING BLIND CAVITY WIT...

PACKAGE ARCHITECTURE WITH BRIDGE DIES HAVING AIR GAPS AROUND VIAS

METHODS AND APPARATUS FOR EDGE PROTECTED GLASS CORES

MICRO LIGHT EMITTING DIODE STRUCTURES FORMED IN A RECESS OF A TRANS...

GLASS CORES INCLUDING MULTIPLE LAYERS AND RELATED METHODS

IN-SITU MICRO-FLUIDIC CHANNELS FOR HEAT DISSIPATION IN GLASS SUBSTRATE