Bryan L. Buckalew

Person

Tualatin, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Cross flow conduit for foaming prevention in high convection platin...
- Patent number 12,157,949
- Issue date Dec 3, 2024
- Lam Research Corporation
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus for an inert anode plating cell
- Patent number 12,134,831
- Issue date Nov 5, 2024
- Lam Research Corporation
- Gregory Kearns
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Removing bubbles from plating cells
- Patent number 11,746,435
- Issue date Sep 5, 2023
- Lam Research Corporation
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electrodeposition sequence for the filling of cobalt lined f...
- Patent number 11,699,590
- Issue date Jul 11, 2023
- Lam Research Corporation
- Jeyavel Velmurugan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Flow assisted dynamic seal for high-convection, continuous-rotation...
- Patent number 11,655,556
- Issue date May 23, 2023
- Lam Research Corporation
- Aaron Berke
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cross flow conduit for foaming prevention in high convection platin...
- Patent number 11,585,007
- Issue date Feb 21, 2023
- Lam Research Corporation
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus for an inert anode plating cell
- Patent number 11,560,642
- Issue date Jan 24, 2023
- Lam Research Corporation
- Gregory Kearns
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus for tailored uniformity profile
- Patent number 11,549,192
- Issue date Jan 10, 2023
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Alternative integration for redistribution layer process
- Patent number 11,450,631
- Issue date Sep 20, 2022
- Lam Research Corporation
- Justin Oberst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removing bubbles from plating cell
- Patent number 11,214,887
- Issue date Jan 4, 2022
- Lam Research Corporation
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electrodeposition on cobalt lined features
- Patent number 11,168,407
- Issue date Nov 9, 2021
- Lam Research Comporation
- Jeyavel Velmurugan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Dynamic modulation of cross flow manifold during elecroplating
- Patent number 11,047,059
- Issue date Jun 29, 2021
- Lam Research Corporation
- Kari Thorkelsson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods and apparatus for flow isolation and focusing during electr...
- Patent number 11,001,934
- Issue date May 11, 2021
- Lam Research Corporation
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wetting wave front control for reduced air entrapment during wafer...
- Patent number 10,968,531
- Issue date Apr 6, 2021
- Novellus Systems, Inc.
- Manish Ranjan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatuses for electroplating nickel using sulfur-free...
- Patent number 10,954,604
- Issue date Mar 23, 2021
- Lam Research Corporation
- Bryan L Buckalew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electrodeposition sequence for the filling of cobalt lined f...
- Patent number 10,930,511
- Issue date Feb 23, 2021
- Lam Research Corporation
- Jeyavel Velmurugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for electrodeposition of metals with the use o...
- Patent number 10,923,340
- Issue date Feb 16, 2021
- Lam Research Corporation
- Burhanuddin Kagajwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplating apparatus for tailored uniformity profile
- Patent number 10,920,335
- Issue date Feb 16, 2021
- Novellus Systems, Inc.
- Steven T. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for controlling delivery of cross flowing and...
- Patent number 10,781,527
- Issue date Sep 22, 2020
- Lam Research Corporation
- Stephen J. Banik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for synchronized pressure regulation of separa...
- Patent number 10,760,178
- Issue date Sep 1, 2020
- Lam Research Corporation
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Systems and methods for achieving uniformity across a redistributio...
- Patent number 10,714,436
- Issue date Jul 14, 2020
- Lam Research Corporation
- Bryan L. Buckalew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Enhancement of electrolyte hydrodynamics for efficient mass transfe...
- Patent number 10,662,545
- Issue date May 26, 2020
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Removing bubbles from plating cells
- Patent number 10,655,240
- Issue date May 19, 2020
- Lam Research Corporation
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electrodeposition on cobalt lined features
- Patent number 10,648,097
- Issue date May 12, 2020
- Lam Research Corporation
- Jeyavel Velmurugan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Flow assisted dynamic seal for high-convection, continuous-rotation...
- Patent number 10,612,151
- Issue date Apr 7, 2020
- Lam Research Corporation
- Aaron Berke
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Dynamic modulation of cross flow manifold during elecroplating
- Patent number 10,364,505
- Issue date Jul 30, 2019
- Lam Research Corporation
- Kari Thorkelsson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods and apparatus for wetting pretreatment for through resist m...
- Patent number 10,301,738
- Issue date May 28, 2019
- Novellus Systems, Inc.
- Bryan L. Buckalew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Dynamic modulation of cross flow manifold during electroplating
- Patent number 10,233,556
- Issue date Mar 19, 2019
- Lam Research Corporation
- Gabriel Hay Graham
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Systems and methods for fabrication of a redistribution layer to av...
- Patent number 10,211,052
- Issue date Feb 19, 2019
- Lam Research Corporation
- Bryan L. Buckalew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and methods for maintaining pH in nickel electroplating...
- Patent number 10,190,232
- Issue date Jan 29, 2019
- Lam Research Corporation
- Bryan L. Buckalew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
CROSS FLOW CONDUIT FOR FOAMING PREVENTION IN HIGH CONVECTION PLATIN...
- Publication number 20250051953
- Publication date Feb 13, 2025
- LAM RESEARCH CORPORATION
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS FOR AN INERT ANODE PLATING CELL
- Publication number 20250019857
- Publication date Jan 16, 2025
- LAM RESEARCH CORPORATION
- Gregory Kearns
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TEMPORARY CAPPING MATERIAL FOR OXIDE PREVENTION IN LOW TEMPERATURE...
- Publication number 20240312778
- Publication date Sep 19, 2024
- LAM RESEARCH CORPORATION
- Stephen J. BANIK
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
ELECTRODEPOSITION OF METALS USING AN IONICALLY RESISTIVE IONICALLY...
- Publication number 20240141541
- Publication date May 2, 2024
- LAM RESEARCH CORPORATION
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SPATIALLY AND DIMENSIONALLY NON-UNIFORM CHANNELLED PLATE FOR TAILOR...
- Publication number 20240076795
- Publication date Mar 7, 2024
- LAM RESEARCH CORPORATION
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PREPLATING EDGE DRY
- Publication number 20230366119
- Publication date Nov 16, 2023
- LAM RESEARCH CORPORATION
- Kari THORKELSSON
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ELECTRODEPOSITION SEQUENCE FOR THE FILLING OF COBALT LINED F...
- Publication number 20230298894
- Publication date Sep 21, 2023
- LAM RESEARCH CORPORATION
- Jeyavel Velmurugan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRO-OXIDATIVE METAL REMOVAL ACCOMPANIED BY PARTICLE CONTAMINATI...
- Publication number 20230230847
- Publication date Jul 20, 2023
- LAM RESEARCH CORPORATION
- Kari Thorkelsson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SURFACE PRETREATMENT FOR ELECTROPLATING NANOTWINNED COPPER
- Publication number 20230212773
- Publication date Jul 6, 2023
- LAM RESEARCH CORPORATION
- Justin OBERST
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
BLENDED CONTACT FINGERS FOR PREVENTING CRACKS DURING THIN SUBSTRATE...
- Publication number 20230175161
- Publication date Jun 8, 2023
- LAM RESEARCH CORPORATION
- Stephen J. BANIK
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CROSS FLOW CONDUIT FOR FOAMING PREVENTION IN HIGH CONVECTION PLATIN...
- Publication number 20230175162
- Publication date Jun 8, 2023
- LAM RESEARCH CORPORATION
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LIPSEAL EDGE EXCLUSION ENGINEERING TO MAINTAIN MATERIAL INTEGRITY A...
- Publication number 20230167571
- Publication date Jun 1, 2023
- LAM RESEARCH CORPORATION
- Justin Oberst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR AN INERT ANODE PLATING CELL
- Publication number 20230084072
- Publication date Mar 16, 2023
- LAM RESEARCH CORPORATION
- Gregory Kearns
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
EDGE REMOVAL FOR THROUGH-RESIST PLATING
- Publication number 20230012414
- Publication date Jan 12, 2023
- LAM RESEARCH CORPORATION
- Bryan L. Buckalew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIAL CONTRAST PLATING FOR ADVANCED PACKAGING APPLICATIONS
- Publication number 20220275531
- Publication date Sep 1, 2022
- LAM RESEARCH CORPORATION
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
GOLD THROUGH SILICON MASK PLATING
- Publication number 20220216104
- Publication date Jul 7, 2022
- LAM RESEARCH CORPORATION
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
REMOVING BUBBLES FROM PLATING CELLS
- Publication number 20220119977
- Publication date Apr 21, 2022
- LAM RESEARCH CORPORATION
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LOW TEMPERATURE DIRECT COPPER-COPPER BONDING
- Publication number 20220018036
- Publication date Jan 20, 2022
- LAM RESEARCH CORPORATION
- Stephen J. Banik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODEPOSITION OF NANOTWINNED COPPER STRUCTURES
- Publication number 20220010446
- Publication date Jan 13, 2022
- LAM RESEARCH CORPORATION
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CROSS FLOW CONDUIT FOR FOAMING PREVENTION IN HIGH CONVECTION PLATIN...
- Publication number 20210395913
- Publication date Dec 23, 2021
- LAM RESEARCH CORPORATION
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS FOR AN INERT ANODE PLATING CELL
- Publication number 20210340687
- Publication date Nov 4, 2021
- LAM RESEARCH CORPORATION
- Gregory Kearns
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ALTERNATIVE INTEGRATION FOR REDISTRIBUTION LAYER PROCESS
- Publication number 20210193514
- Publication date Jun 24, 2021
- LAM RESEARCH CORPORATION
- Justin Oberst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ELECTRODEPOSITION SEQUENCE FOR THE FILLING OF COBALT LINED F...
- Publication number 20210151322
- Publication date May 20, 2021
- LAM RESEARCH CORPORATION
- Jeyavel Velmurugan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING APPARATUS FOR TAILORED UNIFORMITY PROFILE
- Publication number 20210148001
- Publication date May 20, 2021
- Novellus Systems, Inc.
- Steven T. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVING BUBBLES FROM PLATING CELL
- Publication number 20200270759
- Publication date Aug 27, 2020
- LAM RESEARCH CORPORATION
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ELECTRODEPOSITION ON COBALT LINED FEATURES
- Publication number 20200255964
- Publication date Aug 13, 2020
- LAM RESEARCH CORPORATION
- Jeyavel Velmurugan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Flow Assisted Dynamic Seal for High-Convection, Continuous-Rotation...
- Publication number 20200232114
- Publication date Jul 23, 2020
- LAM RESEARCH CORPORATION
- Aaron Berke
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEM AND METHOD FOR CHEMICAL AND HEATED WETTING OF SUBSTRATES PRI...
- Publication number 20200035484
- Publication date Jan 30, 2020
- LAM RESEARCH CORPORATION
- Justin OBERST
- B08 - CLEANING
Information Patent Application
METHOD AND APPARATUS FOR SYNCHRONIZED PRESSURE REGULATION OF SEPARA...
- Publication number 20200017989
- Publication date Jan 16, 2020
- LAM RESEARCH CORPORATION
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
REMOVING BUBBLES FROM PLATING CELLS
- Publication number 20190338440
- Publication date Nov 7, 2019
- LAM RESEARCH CORPORATION
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Bryan L. Buckalew

Person

Patents Grantslast 30 patents

Cross flow conduit for foaming prevention in high convection platin...

Apparatus for an inert anode plating cell

Removing bubbles from plating cells

Copper electrodeposition sequence for the filling of cobalt lined f...

Flow assisted dynamic seal for high-convection, continuous-rotation...

Cross flow conduit for foaming prevention in high convection platin...

Apparatus for an inert anode plating cell

Electroplating apparatus for tailored uniformity profile

Alternative integration for redistribution layer process

Removing bubbles from plating cell

Copper electrodeposition on cobalt lined features

Dynamic modulation of cross flow manifold during elecroplating

Methods and apparatus for flow isolation and focusing during electr...

Wetting wave front control for reduced air entrapment during wafer...

Methods and apparatuses for electroplating nickel using sulfur-free...

Copper electrodeposition sequence for the filling of cobalt lined f...

Apparatus and method for electrodeposition of metals with the use o...

Electroplating apparatus for tailored uniformity profile

Methods and apparatus for controlling delivery of cross flowing and...

Method and apparatus for synchronized pressure regulation of separa...

Systems and methods for achieving uniformity across a redistributio...

Enhancement of electrolyte hydrodynamics for efficient mass transfe...

Removing bubbles from plating cells

Copper electrodeposition on cobalt lined features

Flow assisted dynamic seal for high-convection, continuous-rotation...

Dynamic modulation of cross flow manifold during elecroplating

Methods and apparatus for wetting pretreatment for through resist m...

Dynamic modulation of cross flow manifold during electroplating

Systems and methods for fabrication of a redistribution layer to av...

Apparatuses and methods for maintaining pH in nickel electroplating...

Patents Applicationslast 30 patents

CROSS FLOW CONDUIT FOR FOAMING PREVENTION IN HIGH CONVECTION PLATIN...

APPARATUS FOR AN INERT ANODE PLATING CELL

TEMPORARY CAPPING MATERIAL FOR OXIDE PREVENTION IN LOW TEMPERATURE...

ELECTRODEPOSITION OF METALS USING AN IONICALLY RESISTIVE IONICALLY...

SPATIALLY AND DIMENSIONALLY NON-UNIFORM CHANNELLED PLATE FOR TAILOR...

PREPLATING EDGE DRY

COPPER ELECTRODEPOSITION SEQUENCE FOR THE FILLING OF COBALT LINED F...

ELECTRO-OXIDATIVE METAL REMOVAL ACCOMPANIED BY PARTICLE CONTAMINATI...

SURFACE PRETREATMENT FOR ELECTROPLATING NANOTWINNED COPPER

BLENDED CONTACT FINGERS FOR PREVENTING CRACKS DURING THIN SUBSTRATE...

CROSS FLOW CONDUIT FOR FOAMING PREVENTION IN HIGH CONVECTION PLATIN...

LIPSEAL EDGE EXCLUSION ENGINEERING TO MAINTAIN MATERIAL INTEGRITY A...

APPARATUS FOR AN INERT ANODE PLATING CELL

EDGE REMOVAL FOR THROUGH-RESIST PLATING

DIFFERENTIAL CONTRAST PLATING FOR ADVANCED PACKAGING APPLICATIONS

GOLD THROUGH SILICON MASK PLATING

REMOVING BUBBLES FROM PLATING CELLS

LOW TEMPERATURE DIRECT COPPER-COPPER BONDING

ELECTRODEPOSITION OF NANOTWINNED COPPER STRUCTURES

CROSS FLOW CONDUIT FOR FOAMING PREVENTION IN HIGH CONVECTION PLATIN...

APPARATUS FOR AN INERT ANODE PLATING CELL

ALTERNATIVE INTEGRATION FOR REDISTRIBUTION LAYER PROCESS

COPPER ELECTRODEPOSITION SEQUENCE FOR THE FILLING OF COBALT LINED F...

ELECTROPLATING APPARATUS FOR TAILORED UNIFORMITY PROFILE

REMOVING BUBBLES FROM PLATING CELL

COPPER ELECTRODEPOSITION ON COBALT LINED FEATURES

Flow Assisted Dynamic Seal for High-Convection, Continuous-Rotation...

SYSTEM AND METHOD FOR CHEMICAL AND HEATED WETTING OF SUBSTRATES PRI...

METHOD AND APPARATUS FOR SYNCHRONIZED PRESSURE REGULATION OF SEPARA...

REMOVING BUBBLES FROM PLATING CELLS