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Charles E. Williams
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Austin, TX, US
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Patents Grants
last 30 patents
Information
Patent Grant
Integrated circuit with bonding layer over active circuitry
Patent number
6,683,380
Issue date
Jan 27, 2004
Texas Instruments Incorporated
Taylor R. Efland
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package lead plating method and apparatus
Patent number
6,315,189
Issue date
Nov 13, 2001
Texas Instruments Incorporated
Charles E. Williams
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit with bonding layer over active circuitry
Patent number
6,144,100
Issue date
Nov 7, 2000
Texas Instruments Incorporated
Chi-Cheong Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Plastic encapsulation for integrated circuits having plated copper...
Patent number
6,140,702
Issue date
Oct 31, 2000
Texas Instruments Incorporated
Taylor R. Efland
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Plastic encapsulation for integrated circuits having plated copper...
Patent number
6,140,150
Issue date
Oct 31, 2000
Texas Instruments Incorporated
Taylor R. Efland
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming improved thick plated copper interconnect and ass...
Patent number
6,025,275
Issue date
Feb 15, 2000
Texas Instruments Incorporated
Taylor R. Efland
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thick plated interconnect and associated auxillary interconnect
Patent number
6,020,640
Issue date
Feb 1, 2000
Texas Instruments Incorporated
Taylor R. Efland
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bond pad for integrated circuit
Patent number
5,905,308
Issue date
May 18, 1999
Texas Instruments Incorporated
Taylor R. Efland
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laser bond header
Patent number
5,545,846
Issue date
Aug 13, 1996
Texas Instruments Incorporated
Charles E. Williams
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High-density package
Patent number
4,943,844
Issue date
Jul 24, 1990
Texas Instruments Incorporated
Alex A. Oscilowski
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip carrier with interconnects on lid
Patent number
4,903,120
Issue date
Feb 20, 1990
Texas Instruments Incorporated
Gary L. Beene
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
A chip carrier and mounting structure connected to the chip carrier
Patent number
4,890,194
Issue date
Dec 26, 1989
Texas Instruments Incorporated
Lesli A. Derryberry
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board with a chip carrier and mounting structure connected...
Patent number
4,750,089
Issue date
Jun 7, 1988
Texas Instruments Incorporated
Lesli A. Derryberry
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Photovoltaic solar arrays using silicon microparticles
Patent number
4,614,835
Issue date
Sep 30, 1986
Texas Instruments Incorporated
Kent R. Carson
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Integrated circuit with bonding layer over active circuitry
Publication number
20030036256
Publication date
Feb 20, 2003
Taylor R. Efland
H01 - BASIC ELECTRIC ELEMENTS