Number | Name | Date | Kind |
---|---|---|---|
4541003 | Otsuka et al. | Sep 1985 |
Number | Date | Country |
---|---|---|
0061046 | May 1980 | JPX |
0031046 | Feb 1984 | JPX |
0044851 | Mar 1984 | JPX |
0010764 | Jan 1985 | JPX |
0117763 | Jun 1985 | JPX |
1139345 | Jan 1969 | GBX |
Entry |
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"Directly Attached IC Circuit Lead Frame"-DeBoskey IBM Technical Disclsure Bullentin-vol. 15, No. 10, June 1972, p. 307. |
"Cooling and Minimizing Temperature Gradient in Stacked Modules"-Audi-IBM Technical Disclosure Bulletin-vol. 19, No. 2-Jul. 1976, p. 414. |