Charles G. Woychik

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated interposer solutions for 2D and 3D IC packaging
- Patent number 11,302,616
- Issue date Apr 12, 2022
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits protected by substrates with cavities, and meth...
- Patent number 11,205,600
- Issue date Dec 21, 2021
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded graphite heat spreader for 3DIC
- Patent number 10,586,785
- Issue date Mar 10, 2020
- Invensas Corporation
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic components with features wrapping around protrusion...
- Patent number 10,522,457
- Issue date Dec 31, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structures for heat dissipating interposers
- Patent number 10,475,733
- Issue date Nov 12, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits protected by substrates with cavities, and meth...
- Patent number 10,446,456
- Issue date Oct 15, 2019
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposers with electrically conductive features having different...
- Patent number 10,440,822
- Issue date Oct 8, 2019
- Invensas Corporation
- Bong-Sub Lee
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of fabricating low CTE interposer without TSV structure
- Patent number 10,396,114
- Issue date Aug 27, 2019
- Invensas Corporation
- Charles G. Woychik
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure and method for integrated circuits packaging with increas...
- Patent number 10,381,326
- Issue date Aug 13, 2019
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid 3D/2.5D interposer
- Patent number 10,325,880
- Issue date Jun 18, 2019
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BVA interposer
- Patent number 10,297,582
- Issue date May 21, 2019
- Invensas Corporation
- Terrence Caskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated interposer solutions for 2D and 3D IC packaging
- Patent number 10,256,177
- Issue date Apr 9, 2019
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a carrier-less silicon interposer
- Patent number 10,181,411
- Issue date Jan 15, 2019
- Invensas Corporation
- Michael Newman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic components with features wrapping around protrusion...
- Patent number 10,177,086
- Issue date Jan 8, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid 3D/2.5D interposer
- Patent number 10,177,114
- Issue date Jan 8, 2019
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structures for heat dissipating interposers
- Patent number 10,103,094
- Issue date Oct 16, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die integrated circuit
- Patent number 9,991,231
- Issue date Jun 5, 2018
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Demountable interconnect structure
- Patent number 9,953,910
- Issue date Apr 24, 2018
- General Electric Company
- Charles Gerard Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded graphite heat spreader for 3DIC
- Patent number 9,953,957
- Issue date Apr 24, 2018
- Invensas Corporation
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic components with features wrapping around protrusion...
- Patent number 9,947,618
- Issue date Apr 17, 2018
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit assemblies with multiple interposer substrates, and methods...
- Patent number 9,905,507
- Issue date Feb 27, 2018
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits protected by substrates with cavities, and meth...
- Patent number 9,899,281
- Issue date Feb 20, 2018
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable device assembly
- Patent number 9,893,030
- Issue date Feb 13, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assemblies with reinforcement frames, and method...
- Patent number 9,887,166
- Issue date Feb 6, 2018
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost hybrid high density package
- Patent number 9,875,955
- Issue date Jan 23, 2018
- Tessera, Inc.
- Kishor Desai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer member based interconnect
- Patent number 9,865,548
- Issue date Jan 9, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures to repair device warpage
- Patent number 9,859,234
- Issue date Jan 2, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assemblies with rigid layers used for protection...
- Patent number 9,824,974
- Issue date Nov 21, 2017
- Invensas Corporation
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies with cavities, and methods of fabrication
- Patent number 9,812,406
- Issue date Nov 7, 2017
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tunable composite interposer
- Patent number 9,780,042
- Issue date Oct 3, 2017
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUITS PROTECTED BY SUBSTRATES WITH CAVITIES, AND METH...
- Publication number 20200043817
- Publication date Feb 6, 2020
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED INTERPOSER SOLUTIONS FOR 2D AND 3D IC PACKAGING
- Publication number 20190198435
- Publication date Jun 27, 2019
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC COMPONENTS WITH FEATURES WRAPPING AROUND PROTRUSION...
- Publication number 20190157199
- Publication date May 23, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURES FOR HEAT DISSIPATING INTERPOSERS
- Publication number 20190139878
- Publication date May 9, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID 3D/2.5D INTERPOSER
- Publication number 20190096849
- Publication date Mar 28, 2019
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC COMPONENTS WITH FEATURES WRAPPING AROUND PROTRUSION...
- Publication number 20180233447
- Publication date Aug 16, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED GRAPHITE HEAT SPREADER FOR 3DIC
- Publication number 20180219001
- Publication date Aug 2, 2018
- Invensas Corporation
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS PROTECTED BY SUBSTRATES WITH CAVITIES, AND METH...
- Publication number 20180130717
- Publication date May 10, 2018
- Invensas Corporation
- Hong SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposers And Fabrication Methods That Use Nanoparticle Inks And...
- Publication number 20170374738
- Publication date Dec 28, 2017
- Invensas Corporation
- Bong-Sub Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURES FOR HEAT DISSIPATING INTERPOSERS
- Publication number 20170365546
- Publication date Dec 21, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED INTERPOSER SOLUTIONS FOR 2D AND 3D IC PACKAGING
- Publication number 20170317019
- Publication date Nov 2, 2017
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC COMPONENTS WITH FEATURES WRAPPING AROUND PROTRUSION...
- Publication number 20170278787
- Publication date Sep 28, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING LOW CTE INTERPOSER WITHOUT TSV STRUCTURE
- Publication number 20170194373
- Publication date Jul 6, 2017
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID 3D/2.5D INTERPOSER
- Publication number 20170148763
- Publication date May 25, 2017
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSERS AND FABRICATION METHODS THAT USE NANOPARTICLE INKS AND...
- Publication number 20170099733
- Publication date Apr 6, 2017
- Invensas Corporation
- Bong-Sub Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLIES WITH RIGID LAYERS USED FOR PROTECTION...
- Publication number 20170084539
- Publication date Mar 23, 2017
- Invensas Corporation
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low cost hybrid high density package
- Publication number 20170077018
- Publication date Mar 16, 2017
- Tessera, Inc.
- Kishor Desai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS PROTECTED BY SUBSTRATES WITH CAVITIES, AND METH...
- Publication number 20170040237
- Publication date Feb 9, 2017
- Invensas Corporation
- Hong SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES TO REPAIR DEVICE WARPAGE
- Publication number 20170040270
- Publication date Feb 9, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE INTEGRATED CIRCUIT
- Publication number 20170033088
- Publication date Feb 2, 2017
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH CAVITIES, AND METHODS OF FABRICATION
- Publication number 20170018510
- Publication date Jan 19, 2017
- Invensas Corporation
- Hong SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reliable Device Assembly
- Publication number 20160329290
- Publication date Nov 10, 2016
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC COMPONENTS WITH FEATURES WRAPPING AROUND PROTRUSION...
- Publication number 20160315047
- Publication date Oct 27, 2016
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT ASSEMBLIES WITH MULTIPLE INTERPOSER SUBSTRATES, AND METHODS...
- Publication number 20160293534
- Publication date Oct 6, 2016
- Invensas Corporation
- Hong SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNABLE COMPOSITE INTERPOSER
- Publication number 20160276296
- Publication date Sep 22, 2016
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLIES WITH REINFORCEMENT FRAMES, AND METHOD...
- Publication number 20160276294
- Publication date Sep 22, 2016
- Invensas Corporation
- Rajesh KATKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER MEMBER BASED INTERCONNECT
- Publication number 20160268205
- Publication date Sep 15, 2016
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED GRAPHITE HEAT SPREADER FOR 3DIC
- Publication number 20160260687
- Publication date Sep 8, 2016
- Invensas Corporation
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR LOCALIZED UNDERFILL
- Publication number 20160254205
- Publication date Sep 1, 2016
- Invensas Corporation
- Liang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSERS AND FABRICATION METHODS THAT USE NANOPARTICLE INKS AND...
- Publication number 20160218057
- Publication date Jul 28, 2016
- Invensas Corporation
- Bong-Sub Lee
- H01 - BASIC ELECTRIC ELEMENTS

Charles G. Woychik

Person

Patents Grantslast 30 patents

Integrated interposer solutions for 2D and 3D IC packaging

Integrated circuits protected by substrates with cavities, and meth...

Embedded graphite heat spreader for 3DIC

Microelectronic components with features wrapping around protrusion...

Method and structures for heat dissipating interposers

Integrated circuits protected by substrates with cavities, and meth...

Interposers with electrically conductive features having different...

Method of fabricating low CTE interposer without TSV structure

Structure and method for integrated circuits packaging with increas...

Hybrid 3D/2.5D interposer

BVA interposer

Integrated interposer solutions for 2D and 3D IC packaging

Method for fabricating a carrier-less silicon interposer

Microelectronic components with features wrapping around protrusion...

Hybrid 3D/2.5D interposer

Method and structures for heat dissipating interposers

Stacked die integrated circuit

Demountable interconnect structure

Embedded graphite heat spreader for 3DIC

Microelectronic components with features wrapping around protrusion...

Circuit assemblies with multiple interposer substrates, and methods...

Integrated circuits protected by substrates with cavities, and meth...

Reliable device assembly

Integrated circuit assemblies with reinforcement frames, and method...

Low cost hybrid high density package

Polymer member based interconnect

Methods and structures to repair device warpage

Integrated circuit assemblies with rigid layers used for protection...

Microelectronic assemblies with cavities, and methods of fabrication

Tunable composite interposer

Patents Applicationslast 30 patents

INTEGRATED CIRCUITS PROTECTED BY SUBSTRATES WITH CAVITIES, AND METH...

INTEGRATED INTERPOSER SOLUTIONS FOR 2D AND 3D IC PACKAGING

MICROELECTRONIC COMPONENTS WITH FEATURES WRAPPING AROUND PROTRUSION...

METHOD AND STRUCTURES FOR HEAT DISSIPATING INTERPOSERS

HYBRID 3D/2.5D INTERPOSER

MICROELECTRONIC COMPONENTS WITH FEATURES WRAPPING AROUND PROTRUSION...

EMBEDDED GRAPHITE HEAT SPREADER FOR 3DIC

INTEGRATED CIRCUITS PROTECTED BY SUBSTRATES WITH CAVITIES, AND METH...

Interposers And Fabrication Methods That Use Nanoparticle Inks And...

METHOD AND STRUCTURES FOR HEAT DISSIPATING INTERPOSERS

INTEGRATED INTERPOSER SOLUTIONS FOR 2D AND 3D IC PACKAGING

MICROELECTRONIC COMPONENTS WITH FEATURES WRAPPING AROUND PROTRUSION...

METHOD OF FABRICATING LOW CTE INTERPOSER WITHOUT TSV STRUCTURE

HYBRID 3D/2.5D INTERPOSER

INTERPOSERS AND FABRICATION METHODS THAT USE NANOPARTICLE INKS AND...

INTEGRATED CIRCUIT ASSEMBLIES WITH RIGID LAYERS USED FOR PROTECTION...

Low cost hybrid high density package

INTEGRATED CIRCUITS PROTECTED BY SUBSTRATES WITH CAVITIES, AND METH...

METHODS AND STRUCTURES TO REPAIR DEVICE WARPAGE

STACKED DIE INTEGRATED CIRCUIT

MICROELECTRONIC ASSEMBLIES WITH CAVITIES, AND METHODS OF FABRICATION

Reliable Device Assembly

MICROELECTRONIC COMPONENTS WITH FEATURES WRAPPING AROUND PROTRUSION...

CIRCUIT ASSEMBLIES WITH MULTIPLE INTERPOSER SUBSTRATES, AND METHODS...

TUNABLE COMPOSITE INTERPOSER

INTEGRATED CIRCUIT ASSEMBLIES WITH REINFORCEMENT FRAMES, AND METHOD...

POLYMER MEMBER BASED INTERCONNECT

EMBEDDED GRAPHITE HEAT SPREADER FOR 3DIC

DEVICE AND METHOD FOR LOCALIZED UNDERFILL

INTERPOSERS AND FABRICATION METHODS THAT USE NANOPARTICLE INKS AND...