Chee Seng Foong

Person

Putra Sg., MY

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit substrate and method of manufacturing same
- Patent number 9,474,162
- Issue date Oct 18, 2016
- FREESCALE SEMIOCNDUCTOR, INC.
- Chee Seng Foong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for alternative semiconductor die configurations
- Patent number 9,437,492
- Issue date Sep 6, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with organic interposer
- Patent number 9,401,345
- Issue date Jul 26, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible packaged integrated circuit
- Patent number 9,287,236
- Issue date Mar 15, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Teck Beng Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with overmolded vias
- Patent number 9,269,659
- Issue date Feb 23, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming pillar bump
- Patent number 9,209,147
- Issue date Dec 8, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with lead mounted power bar
- Patent number 9,209,120
- Issue date Dec 8, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Kong Bee Tiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-homogeneous molding of packaged semiconductor devices
- Patent number 9,202,770
- Issue date Dec 1, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Power bar design for lead frame-based packages
- Patent number 9,177,834
- Issue date Nov 3, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper pillar bump and flip chip package using same
- Patent number 9,159,682
- Issue date Oct 13, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die sensor package
- Patent number 9,134,193
- Issue date Sep 15, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Pillar bump formed using spot-laser
- Patent number 9,053,972
- Issue date Jun 9, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Side vented pressure sensor device
- Patent number 9,040,335
- Issue date May 26, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Low Boon Yew
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fluid cooled semiconductor die package
- Patent number 8,860,212
- Issue date Oct 14, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with redistributed contacts
- Patent number 8,810,020
- Issue date Aug 19, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Navas Khan Oratti Kalandar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader for center gate molding
- Patent number 8,643,172
- Issue date Feb 4, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame for semiconductor package
- Patent number 8,415,779
- Issue date Apr 9, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Tzu Ling Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader for semiconductor package
- Patent number 8,049,313
- Issue date Nov 1, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making solder pad
- Patent number 7,566,648
- Issue date Jul 28, 2009
- Freescale Semiconductor Inc.
- Heng Keong Yip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip and wire bond semiconductor package
- Patent number 7,554,185
- Issue date Jun 30, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor attachment method
- Patent number 7,452,750
- Issue date Nov 18, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of packaging semiconductor die without lead frame or substrate
- Patent number 7,432,130
- Issue date Oct 7, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Aminuddin Ismail
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged device and method of forming same
- Patent number 7,285,855
- Issue date Oct 23, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged device and method of forming same
- Patent number 7,179,682
- Issue date Feb 20, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device
- Patent number 6,900,531
- Issue date May 31, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH POWER PLATES
- Publication number 20160163671
- Publication date Jun 9, 2016
- FREESCALE SEMICONDUCTOR, INC.
- SHAILESH KUMAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR ALTERNATIVE SEMICONDUCTOR DIE CONFIGURATIONS
- Publication number 20160093533
- Publication date Mar 31, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH ORGANIC INTERPOSER
- Publication number 20160064356
- Publication date Mar 3, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PACKAGED INTEGRATED CIRCUIT
- Publication number 20160020189
- Publication date Jan 21, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Teck Beng Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOUSING FOR ELECTRONIC DEVICES
- Publication number 20150342069
- Publication date Nov 26, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD FRAMES HAVING METAL TRACES WITH METAL STUBS
- Publication number 20150311143
- Publication date Oct 29, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH LEAD MOUNTED POWER BAR
- Publication number 20150262924
- Publication date Sep 17, 2015
- Kong Bee Tiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER BAR DESIGN FOR LEAD FRAME-BASED PACKAGES
- Publication number 20150235924
- Publication date Aug 20, 2015
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE AND METHOD OF MANUFACTURING SAME
- Publication number 20150201489
- Publication date Jul 16, 2015
- Chee Seng Foong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER LEVEL PACKAGE WITH REDISTRIBUTION LAYER FORMED WITH METALLIC...
- Publication number 20150200177
- Publication date Jul 16, 2015
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER DICING BLADE
- Publication number 20150183131
- Publication date Jul 2, 2015
- Chee Seng Foong
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
STACKED DIE SENSOR PACKAGE
- Publication number 20150160087
- Publication date Jun 11, 2015
- Chee Seng Foong
- B60 - VEHICLES IN GENERAL
Information Patent Application
PILLAR BUMP FORMED USING SPOT-LASER
- Publication number 20150137354
- Publication date May 21, 2015
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDE VENTED PRESSURE SENSOR DEVICE
- Publication number 20150076630
- Publication date Mar 19, 2015
- Boon Yew Low
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COPPER PILLAR BUMP AND FLIP CHIP PACKAGE USING SAME
- Publication number 20150069603
- Publication date Mar 12, 2015
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE SENSOR DEVICE AND ASSEMBLY METHOD
- Publication number 20150054099
- Publication date Feb 26, 2015
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUID COOLED SEMICONDUCTOR DIE PACKAGE
- Publication number 20140306336
- Publication date Oct 16, 2014
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH LOW STAND-OFF INTERCONNECTIONS BETWEEN...
- Publication number 20140231977
- Publication date Aug 21, 2014
- Navas Khan Oratti Kalandar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTED CONTACTS
- Publication number 20130341796
- Publication date Dec 26, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Navas Khan Oratti Kalandar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME FOR SEMICONDUCTOR PACKAGE
- Publication number 20110248390
- Publication date Oct 13, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Tzu Ling WONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADER FOR CENTER GATE MOLDING
- Publication number 20080305584
- Publication date Dec 11, 2008
- Chee Seng Foong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING SOLDER PAD
- Publication number 20080258297
- Publication date Oct 23, 2008
- Heng Keong YIP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip Chip And Wire Bond Semiconductor Package
- Publication number 20080111248
- Publication date May 15, 2008
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADER FOR SEMICONDUCTOR PACKAGE
- Publication number 20080067645
- Publication date Mar 20, 2008
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitor attachment method
- Publication number 20070202632
- Publication date Aug 30, 2007
- Wai Yew Lo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of packaging semiconductor die
- Publication number 20070178626
- Publication date Aug 2, 2007
- Aminuddin Ismail
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making semiconductor package having exposed heat spreader
- Publication number 20070122943
- Publication date May 31, 2007
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DEVICE AND METHOD OF FORMING SAME
- Publication number 20070114664
- Publication date May 24, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged device and method of forming same
- Publication number 20060087038
- Publication date Apr 27, 2006
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package including rivet for bonding of lead posts
- Publication number 20060012055
- Publication date Jan 19, 2006
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS

Chee Seng Foong

Person

Patents Grantslast 30 patents

Circuit substrate and method of manufacturing same

Substrate for alternative semiconductor die configurations

Semiconductor device package with organic interposer

Flexible packaged integrated circuit

Interposer with overmolded vias

Method of forming pillar bump

Semiconductor package with lead mounted power bar

Non-homogeneous molding of packaged semiconductor devices

Power bar design for lead frame-based packages

Copper pillar bump and flip chip package using same

Stacked die sensor package

Pillar bump formed using spot-laser

Side vented pressure sensor device

Fluid cooled semiconductor die package

Semiconductor device with redistributed contacts

Heat spreader for center gate molding

Lead frame for semiconductor package

Heat spreader for semiconductor package

Method of making solder pad

Flip chip and wire bond semiconductor package

Capacitor attachment method

Method of packaging semiconductor die without lead frame or substrate

Packaged device and method of forming same

Packaged device and method of forming same

Image sensor device

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE WITH POWER PLATES

SUBSTRATE FOR ALTERNATIVE SEMICONDUCTOR DIE CONFIGURATIONS

SEMICONDUCTOR DEVICE PACKAGE WITH ORGANIC INTERPOSER

FLEXIBLE PACKAGED INTEGRATED CIRCUIT

HOUSING FOR ELECTRONIC DEVICES

LEAD FRAMES HAVING METAL TRACES WITH METAL STUBS

SEMICONDUCTOR PACKAGE WITH LEAD MOUNTED POWER BAR

POWER BAR DESIGN FOR LEAD FRAME-BASED PACKAGES

CIRCUIT SUBSTRATE AND METHOD OF MANUFACTURING SAME

WAFER LEVEL PACKAGE WITH REDISTRIBUTION LAYER FORMED WITH METALLIC...

SEMICONDUCTOR WAFER DICING BLADE

STACKED DIE SENSOR PACKAGE

PILLAR BUMP FORMED USING SPOT-LASER

SIDE VENTED PRESSURE SENSOR DEVICE

COPPER PILLAR BUMP AND FLIP CHIP PACKAGE USING SAME

PRESSURE SENSOR DEVICE AND ASSEMBLY METHOD

FLUID COOLED SEMICONDUCTOR DIE PACKAGE

SEMICONDUCTOR PACKAGES WITH LOW STAND-OFF INTERCONNECTIONS BETWEEN...

SEMICONDUCTOR DEVICE WITH REDISTRIBUTED CONTACTS

LEAD FRAME FOR SEMICONDUCTOR PACKAGE

HEAT SPREADER FOR CENTER GATE MOLDING

METHOD OF MAKING SOLDER PAD

Flip Chip And Wire Bond Semiconductor Package

HEAT SPREADER FOR SEMICONDUCTOR PACKAGE

Capacitor attachment method

Method of packaging semiconductor die

Method of making semiconductor package having exposed heat spreader

PACKAGED DEVICE AND METHOD OF FORMING SAME

Packaged device and method of forming same

Semiconductor package including rivet for bonding of lead posts