Chen-Chung Wang

Person

Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,224,183
- Issue date Feb 11, 2025
- Chipbond Technology Corporation
- Shrane-Ning Jenq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and testing method
- Patent number 12,216,157
- Issue date Feb 4, 2025
- Advanced Semiconductor Engineering, Inc.
- Chen-Chao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gradient protection layer in MTJ manufacturing
- Patent number 12,219,879
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tai-Yen Peng
Information Patent Grant
Package structure for a semiconductor element
- Patent number D1059315
- Issue date Jan 28, 2025
- GaNrich Semiconductor Corporation
- Jia-Tay Kuo
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Image sensor having a gate dielectric structure for improved device...
- Patent number 12,191,336
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Jui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,191,557
- Issue date Jan 7, 2025
- Pegatron Corporation
- Chien-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated voltage regulator device and...
- Patent number 12,176,305
- Issue date Dec 24, 2024
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Styrene-isoprene/butadiene diblock copolymer, hydrogenated block co...
- Patent number 12,146,049
- Issue date Nov 19, 2024
- LCY CHEMICAL CORP.
- Yi-Cheng Wan
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor package structure
- Patent number 12,132,006
- Issue date Oct 29, 2024
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate all around structure with additional silicon layer and method...
- Patent number 12,119,404
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air spacer formation with a spin-on dielectric material
- Patent number 12,094,952
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,095,146
- Issue date Sep 17, 2024
- Pegatron Corporation
- Chien-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,095,179
- Issue date Sep 17, 2024
- Pegatron Corporation
- Chien-Yi Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,075,707
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jiann-Horng Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Device crack-stop structure to prevent damage due to dicing crack
- Patent number 12,057,412
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tung-Ting Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor imaging device having improved dark current performance
- Patent number 12,040,336
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Seiji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for pipeline control
- Patent number 12,014,176
- Issue date Jun 18, 2024
- Realtek Semiconductor Corp.
- Kuan-Lin Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of reducing undesired light influence in extreme ultraviolet...
- Patent number 12,013,641
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Tsung Shih
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Magnetic tunnel junction device
- Patent number 11,968,908
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tai-Yen Peng
- G11 - INFORMATION STORAGE
Information Patent Grant
Electronic device and method of starting the same
- Patent number RE49940
- Issue date Apr 23, 2024
- GETAC HOLDINGS CORPORATION
- Chen-Ping Wang
Information Patent Grant
Low thermal budget dielectric for semiconductor devices
- Patent number 11,942,358
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal Abhijith Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method of the same
- Patent number 11,944,017
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tai-Yen Peng
Information Patent Grant
Combination notebook computer with auxiliary lighting fixture
- Patent number D1015323
- Issue date Feb 20, 2024
- Compal Electronics, Inc.
- Po-Yang Chien
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,901,245
- Issue date Feb 13, 2024
- Advanced Semiconductor Engineering, Inc.
- Chen-Chao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bilayer seal material for air gaps in semiconductor devices
- Patent number 11,901,220
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Notebook computer
- Patent number D1010639
- Issue date Jan 9, 2024
- Compal Electronics, Inc.
- Po-Yang Chien
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
Semiconductor arrangement with capacitor
- Patent number 11,856,750
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Chern-Yow Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate and method for manufacturing the same
- Patent number 11,856,694
- Issue date Dec 26, 2023
- National Taiwan University of Science and Technology
- Chen-Hao Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gradient protection layer in MTJ manufacturing
- Patent number 11,856,865
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tai-Yen Peng
Information Patent Grant
Methods for manufacturing semiconductor devices with tunable low-k...
- Patent number 11,848,238
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250054877
- Publication date Feb 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE
- Publication number 20240413136
- Publication date Dec 12, 2024
- UNITED MICROELECTRONICS CORP.
- Tsung-Kai Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MANUFACTURING AN INTERCONNECT STRUCTURE
- Publication number 20240387358
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- KHADERBAD MRUNAL ABHIJITH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR SPACER FORMATION WITH A SPIN-ON DIELECTRIC MATERIAL
- Publication number 20240363722
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ting CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE CRACK-STOP STRUCTURE TO PREVENT DAMAGE DUE TO DICING CRACK
- Publication number 20240355764
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Ting Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND STRUCTURE HAVING SHIELDING STRUCTURES FOR STACKED IC CHIPS
- Publication number 20240355859
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYMMETRIC BOND SIGNAL INTEGRITY PRESERVATION STRUCTURE AND METHOD
- Publication number 20240347576
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ZIG-ZAG SIGNAL SHIELDING FOR PIXEL ARRAY
- Publication number 20240339467
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsien Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL SHIELDING FOR INTEGRATED CIRCUITS
- Publication number 20240339475
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND STRUCTURES HAVING SHIELDING STRUCTURES FOR STACKED CHIPS
- Publication number 20240332333
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR IMAGING DEVICE HAVING IMPROVED DARK CURRENT PERFORMANCE
- Publication number 20240313010
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Seiji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REDUCING UNDESIRED LIGHT INFLUENCE IN EXTREME ULTRAVIOLET...
- Publication number 20240295820
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Tsung SHIH
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PIXEL WITH DUAL-PD LAYOUT
- Publication number 20240290810
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsien Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR INTEGRATED CHIP STRUCTURE
- Publication number 20240290811
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsien Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH AND METHOD FOR CONNECTION OF A PLURALITY OF...
- Publication number 20240266371
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Wei Fong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONTSIDE DEEP TRENCH ISOLATION (FDTI) STRUCTURE FOR CMOS IMAGE SENSOR
- Publication number 20240266375
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Te Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240250098
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsien Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEREST TOKEN PROCESSING SYSTEM INTEGRATED WITH BLOCKCHAIN AND MET...
- Publication number 20240233005
- Publication date Jul 11, 2024
- Skychain CO., LTD.
- Chen-Hsuan WANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MAGNETIC TUNNEL JUNCTION DEVICES
- Publication number 20240237551
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tai-Yen Peng
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240194646
- Publication date Jun 13, 2024
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240186193
- Publication date Jun 6, 2024
- Advanced Semiconductor Engineering, Inc.
- Chen-Chao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW THERMAL BUDGET DIELECTRIC FOR SEMICONDUCTOR DEVICES
- Publication number 20240170323
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mrunal Abhijith KHADERBAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER WITH TEST STRUCTURE AND METHOD OF DICING WAFER
- Publication number 20240170332
- Publication date May 23, 2024
- UNITED MICROELECTRONICS CORP.
- Wei-Ren Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BILAYER SEAL MATERIAL FOR AIR GAPS IN SEMICONDUCTOR DEVICES
- Publication number 20240162083
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CONTACT IN WAFER BACKSIDE
- Publication number 20240145498
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPING FREE CONNECTION STRUCTURES AND METHODS
- Publication number 20240145298
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN PACKAGE AND FABRICATING METHOD OF THE SAME
- Publication number 20240128168
- Publication date Apr 18, 2024
- UNITED MICROELECTRONICS CORP.
- Chiu-Feng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRUCIFORM BONDING STRUCTURE FOR 3D-IC
- Publication number 20240128216
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240105664
- Publication date Mar 28, 2024
- Chipbond Technology Corporation
- Yu-Chung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRADIENT PROTECTION LAYER IN MTJ MANUFACTURING
- Publication number 20240099150
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-Yen Peng

Chen-Chung Wang

Person

Patents Grantslast 30 patents

Method of manufacturing semiconductor device

Package structure and testing method

Gradient protection layer in MTJ manufacturing

Package structure for a semiconductor element

Image sensor having a gate dielectric structure for improved device...

Electronic device

Semiconductor package with integrated voltage regulator device and...

Styrene-isoprene/butadiene diblock copolymer, hydrogenated block co...

Semiconductor package structure

Gate all around structure with additional silicon layer and method...

Air spacer formation with a spin-on dielectric material

Electronic device

Electronic device

Semiconductor structure and method for forming the same

Device crack-stop structure to prevent damage due to dicing crack

Semiconductor imaging device having improved dark current performance

Apparatus and method for pipeline control

Method of reducing undesired light influence in extreme ultraviolet...

Magnetic tunnel junction device

Electronic device and method of starting the same

Low thermal budget dielectric for semiconductor devices

Semiconductor structure and manufacturing method of the same

Combination notebook computer with auxiliary lighting fixture

Semiconductor package structure and method for manufacturing the same

Bilayer seal material for air gaps in semiconductor devices

Notebook computer

Semiconductor arrangement with capacitor

Circuit substrate and method for manufacturing the same

Gradient protection layer in MTJ manufacturing

Methods for manufacturing semiconductor devices with tunable low-k...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE STRUCTURE

THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE

METHODS FOR MANUFACTURING AN INTERCONNECT STRUCTURE

AIR SPACER FORMATION WITH A SPIN-ON DIELECTRIC MATERIAL

DEVICE CRACK-STOP STRUCTURE TO PREVENT DAMAGE DUE TO DICING CRACK

BOND STRUCTURE HAVING SHIELDING STRUCTURES FOR STACKED IC CHIPS

SYMMETRIC BOND SIGNAL INTEGRITY PRESERVATION STRUCTURE AND METHOD

ZIG-ZAG SIGNAL SHIELDING FOR PIXEL ARRAY

SIGNAL SHIELDING FOR INTEGRATED CIRCUITS

BOND STRUCTURES HAVING SHIELDING STRUCTURES FOR STACKED CHIPS

SEMICONDUCTOR IMAGING DEVICE HAVING IMPROVED DARK CURRENT PERFORMANCE

METHOD OF REDUCING UNDESIRED LIGHT INFLUENCE IN EXTREME ULTRAVIOLET...

PIXEL WITH DUAL-PD LAYOUT

IMAGE SENSOR INTEGRATED CHIP STRUCTURE

INTEGRATED CIRCUIT WITH AND METHOD FOR CONNECTION OF A PLURALITY OF...

FRONTSIDE DEEP TRENCH ISOLATION (FDTI) STRUCTURE FOR CMOS IMAGE SENSOR

IMAGE SENSOR DEVICE AND METHOD OF MANUFACTURING THE SAME

INTEREST TOKEN PROCESSING SYSTEM INTEGRATED WITH BLOCKCHAIN AND MET...

MAGNETIC TUNNEL JUNCTION DEVICES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

LOW THERMAL BUDGET DIELECTRIC FOR SEMICONDUCTOR DEVICES

WAFER WITH TEST STRUCTURE AND METHOD OF DICING WAFER

BILAYER SEAL MATERIAL FOR AIR GAPS IN SEMICONDUCTOR DEVICES

SUBSTRATE CONTACT IN WAFER BACKSIDE

DOPING FREE CONNECTION STRUCTURES AND METHODS

QFN PACKAGE AND FABRICATING METHOD OF THE SAME

CRUCIFORM BONDING STRUCTURE FOR 3D-IC

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

GRADIENT PROTECTION LAYER IN MTJ MANUFACTURING