Chen-Tai Peng

Person

Hsin-Chu Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Sensor package structure and sensing module thereof
- Patent number 11,133,348
- Issue date Sep 28, 2021
- KINGPAK TECHNOLOGY INC.
- Li-Chun Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 10,868,062
- Issue date Dec 15, 2020
- KINGPAK TECHNOLOGY INC.
- Chien-Chen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package base core and sensor package structure
- Patent number 10,600,829
- Issue date Mar 24, 2020
- KINGPAK TECHNOLOGY INC.
- Chung-Hsin Hsin
- G01 - MEASURING TESTING
Information Patent Grant
Sensor package structure
- Patent number 10,411,055
- Issue date Sep 10, 2019
- KINGPAK TECHNOLOGY INC.
- Chun-Hua Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing tilt of optical unit during manufacture of imag...
- Patent number 9,184,331
- Issue date Nov 10, 2015
- Kingpak Technology Inc.
- Chun-Hua Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing tilt of transparent window during manufacturing...
- Patent number 8,450,137
- Issue date May 28, 2013
- Kingpak Technology Inc.
- Chun-Hua Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor structure and integrated lens module thereof
- Patent number 8,004,602
- Issue date Aug 23, 2011
- Kingpak Technology Inc.
- Chung-Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor module package structure with supporting element
- Patent number 7,598,580
- Issue date Oct 6, 2009
- Kingpak Technology Inc.
- Chung-Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor module with air escape hole and a method for manufactu...
- Patent number 7,554,599
- Issue date Jun 30, 2009
- Kingpak Technology, Inc.
- Hsiu wen Tu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor module with a protection layer and a method for manufa...
- Patent number 7,423,334
- Issue date Sep 9, 2008
- Kingpak Technology Inc.
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having a resistant layer for stopping fl...
- Patent number 7,235,869
- Issue date Jun 26, 2007
- Kingpak Technology Inc.
- Pierre Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for releasing pressure in a vacuum exhaust system of semi...
- Patent number 7,172,731
- Issue date Feb 6, 2007
- United Microelectronics Corp.
- Chen-Tai Peng
- A62 - LIFE-SAVING FIRE-FIGHTING
Information Patent Grant
Method for manufacturing a package structure of integrated circuits
- Patent number 6,642,137
- Issue date Nov 4, 2003
- Kingpak Technology Inc.
- Nai Hua Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory module structure
- Patent number 6,642,554
- Issue date Nov 4, 2003
- Kingpak Technology, Inc.
- Nai Hua Yeh
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package structure having central leads and method for...
- Patent number 6,501,187
- Issue date Dec 31, 2002
- Nai Hua Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked structure for memory chips
- Patent number 6,472,736
- Issue date Oct 29, 2002
- Kingpak Technology Inc.
- Nai Hua Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked structure of semiconductor means and method for manufacturi...
- Patent number 6,400,007
- Issue date Jun 4, 2002
- Kingpak Technology Inc.
- Jichen Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20220254752
- Publication date Aug 11, 2022
- Kingpak Technology Inc.
- CHIEN-CHEN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE AND SENSING MODULE THEREOF
- Publication number 20200350357
- Publication date Nov 5, 2020
- Kingpak Technology Inc.
- LI-CHUN HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20200105809
- Publication date Apr 2, 2020
- Kingpak Technology Inc.
- CHIEN-CHEN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20190074310
- Publication date Mar 7, 2019
- Kingpak Technology Inc.
- CHUN-HUA CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE BASE CORE AND SENSOR PACKAGE STRUCTURE
- Publication number 20180068912
- Publication date Mar 8, 2018
- Kingpak Technology Inc.
- CHUNG-HSIEN HSIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING TILT OF OPTICAL UNIT DURING MANUFACTURE OF IMAG...
- Publication number 20130149805
- Publication date Jun 13, 2013
- KINGPAK TECHNOLOGY INC.
- Chun-Hua CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING TILT OF TRANSPARENT WINDOW DURING MANUFACTURING...
- Publication number 20120220065
- Publication date Aug 30, 2012
- KINGPAK TECHNOLOGY INC.
- Chun-Hua CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor structure and integrated lens module thereof
- Publication number 20090283809
- Publication date Nov 19, 2009
- Kingpak Technology Inc.
- Chung-Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20090045476
- Publication date Feb 19, 2009
- KINGPAK TECHNOLOGY INC.
- Chen Pin PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor package structure and method for manufacturing the same
- Publication number 20080067334
- Publication date Mar 20, 2008
- Jason Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor package
- Publication number 20080036025
- Publication date Feb 14, 2008
- Chung Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor module with air escape hole and a method for manufactu...
- Publication number 20070206109
- Publication date Sep 6, 2007
- Hsiu wen Tu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Image sensor module package
- Publication number 20070138586
- Publication date Jun 21, 2007
- Chung Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor package
- Publication number 20070138585
- Publication date Jun 21, 2007
- Chung Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor with a compound structure
- Publication number 20070108544
- Publication date May 17, 2007
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor module with a protection layer and a method for manufa...
- Publication number 20070108577
- Publication date May 17, 2007
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor module structure and a method for manufacturing the same
- Publication number 20070096280
- Publication date May 3, 2007
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor package structure
- Publication number 20070090284
- Publication date Apr 26, 2007
- Mon Nan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package having central leads
- Publication number 20050098866
- Publication date May 12, 2005
- Pierre Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gas-exploding apparatus for releasing pressure in a vacuum exhaust...
- Publication number 20040115103
- Publication date Jun 17, 2004
- Chen-Tai Peng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Image sensor structure
- Publication number 20030116817
- Publication date Jun 26, 2003
- Nai Hua Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked structure of a ball grid array (BGA) integrated circuit pac...
- Publication number 20030116846
- Publication date Jun 26, 2003
- Nai Hua Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory module structure
- Publication number 20030094628
- Publication date May 22, 2003
- Nai Hua Yeh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Stacked semiconductor package structure having films and method for...
- Publication number 20020151102
- Publication date Oct 17, 2002
- Jichen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing a package structure of integrated circuits
- Publication number 20020130391
- Publication date Sep 19, 2002
- Nai Hua Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked structure of integrated circuits
- Publication number 20020096754
- Publication date Jul 25, 2002
- Wen Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package structure of integrated circuits and method for packaging t...
- Publication number 20020096766
- Publication date Jul 25, 2002
- Wen Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS

Chen-Tai Peng

Person

Patents Grantslast 30 patents

Sensor package structure and sensing module thereof

Sensor package structure

Package base core and sensor package structure

Sensor package structure

Method for reducing tilt of optical unit during manufacture of imag...

Method for reducing tilt of transparent window during manufacturing...

Image sensor structure and integrated lens module thereof

Image sensor module package structure with supporting element

Image sensor module with air escape hole and a method for manufactu...

Image sensor module with a protection layer and a method for manufa...

Integrated circuit package having a resistant layer for stopping fl...

Apparatus for releasing pressure in a vacuum exhaust system of semi...

Method for manufacturing a package structure of integrated circuits

Memory module structure

Semiconductor package structure having central leads and method for...

Stacked structure for memory chips

Stacked structure of semiconductor means and method for manufacturi...

Patents Applicationslast 30 patents

SENSOR PACKAGE STRUCTURE

SENSOR PACKAGE STRUCTURE AND SENSING MODULE THEREOF

SENSOR PACKAGE STRUCTURE

SENSOR PACKAGE STRUCTURE

PACKAGE BASE CORE AND SENSOR PACKAGE STRUCTURE

METHOD FOR REDUCING TILT OF OPTICAL UNIT DURING MANUFACTURE OF IMAG...

METHOD FOR REDUCING TILT OF TRANSPARENT WINDOW DURING MANUFACTURING...

Image sensor structure and integrated lens module thereof

IMAGE SENSOR PACKAGE AND METHOD FOR FORMING THE SAME

Image sensor package structure and method for manufacturing the same

Image sensor package

Image sensor module with air escape hole and a method for manufactu...

Image sensor module package

Image sensor package

Image sensor with a compound structure

Image sensor module with a protection layer and a method for manufa...

Image sensor module structure and a method for manufacturing the same

Image sensor package structure

Integrated circuit package having central leads

Gas-exploding apparatus for releasing pressure in a vacuum exhaust...

Image sensor structure

Stacked structure of a ball grid array (BGA) integrated circuit pac...

Memory module structure

Stacked semiconductor package structure having films and method for...

Method for manufacturing a package structure of integrated circuits

Stacked structure of integrated circuits

Package structure of integrated circuits and method for packaging t...