Integrated circuit package having central leads

Abstract

An integrated circuit package having central leads comprises a substrate has an upper surface, a lower surface, and a long slot penetrating the upper surface to the lower surface. The lower surface is forming with wiring regions arranged at the two sides of the long slot, and the wiring regions are forming with a plurality of connected points. A glue layer is coated on the upper surface of the substrate and is arranged at the periphery of the long slot. The integrated circuit has a first surface forming with a plurality of bonding pads, which is adhered to the glue layer. The wires, each of which is arranged within the long slot of the substrate and is electrically connected the bonding pad of the integrated circuit to the connected point of the substrate; and The first compound layer is filled within the long slot of the substrate for protecting the each wire.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an integrated circuit package having central leads, and more particularly to an integrated circuit package which may be conveniently manufactured with reduced manufacturing costs.

2. Description of the Related Art

Referring to FIG. 1, a conventional integrate circuit package having central leads includes a substrate 10, a glue layer 12, an integrated circuit 14, a plurality of wires 16, and a compound layer 18. The substrate 10 has an upper surface 20, a lower surface 22 and a long slot 24 penetrating from the upper surface 20 the lower surface 22, the lower surface 22 of the substrate 10 is formed with wiring region 26 arranged at the two sides of the long slot 24, and the wiring region 26 is formed with connected points 28. The glue layer 12 is coated on the upper surface 20 of the substrate 10, and is located at the periphery of the long slot 24. The integrate circuit 14 has a first surface 30 and a second surface 32, the central portion of the first surface 30 of the integrate circuit 14 is formed with bonding pads 34, while the first surface 30 of the substrate 10 is adhered to the glue layer 12, so as to the bonding pads 34 of the substrate 10 are exposed from the long slot 24 The wires are arranged within long slot 24 of the substrate 10, and are electrically connected the bonding pads 34 of the integrated circuit 14 to the connected points 28 of the substrate 10. The compound layer 18 is filled within the long slot 24 for protecting the wires.

However, the above-mentioned integrated circuit image has the following drawbacks. When the glue layer 12 is coated on the upper surface 20 of the substrate 10, the flowed glue of the glue layer 12 is covered on the wiring region 26 through the long slot 24 of the substrate 10, so that the connected point 28 which are arranged at the wiring region 26, are covered by the flowed glue.

SUMMARY OF THE INVENTION

An object of the present invention is to provide an integrated circuit package, which is capable of preventing the flowed glue of the glue layer covered the wiring region, so that the wire bonding is easy.

Another object of the present invention is to provide an integrated circuit package having central leads, which may conveniently manufactured with reduced manufacturing costs.

To achieve the above-mentioned objects, the present invention provides an integrated circuit package having central leads includes a substrate, a glue layer, an integrated circuit, a plurality of wires, and a first compound layer. The substrate has an upper surface, a lower surface, and a long slot penetrating from the upper to the lower surface, the lower surface is forming with wiring regions arranged at the two sides of the long slot, and the wiring regions are forming with a plurality of connected points. The resistant layer is coated on the lower surface of the substrate, and is located between the long slot and wiring region. The glue layer is coated on the upper surface of the substrate and arranged at the periphery of the long slot. The integrated circuit has a first surface forming with a plurality of bonding pads and a second surface, the first surface is adhered to the glue layer, then the bonding pads are exposed from the long slot of the substrate. The wires, each of which is arranged within the long slot of the substrate, and is electrically connected the bonding pad of the integrated circuit to the connected point of the substrate. The first compound layer is filled within the long slot of the substrate for protecting the each wire.

Utilizing the resistant layer to prevent the flowed glue covered yje connected points may easily achieve the objects and functions of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic illustration showing a conventional integrated circuit package having central leads.

FIG. 2 is a cross-sectional view showing an integrated circuit package having central leads of the present invention.

FIG. 3 is a top-view of the substrate of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

Referring to FIG. 2, an integrated circuit package having central leads of the present invention includes a substrate 40, a resistant layer 42, a glue layer 44, an integrated circuit 46, a plurality of wires 47, a first compound layer 48, and a second compound layer 50.

The substrate 40 has an upper surface 52, a lower surface 54, and a long slot 56 penetrating from the upper 52 to the lower surface 54. The lower surface 54 of the substrate 40 is formed with wiring regions 58 arranged at the two sides of the long slot 56, and the wiring regions 58 are formed with a plurality of connected points 60, each of which is formed with ball grid array. Please referring to FIG. 3, the length of the wiring region 60 is shorter than the long slot 56 of the substrate 40. Therefore, while the long slot 56 of the substrate is drilled, the periphery of the long slot 56 may be cracked, so that the flowed glue of the glue layer 44 can not flow to the wiring regions 58 via the cracked.

The resistant layer 42 is coated on the lower surface 54 of the substrate 40, and is located between the long slot 56 and wiring region 58. In preferred the embodiment, the resistant layer 42 is made of green.

The glue layer 44 is coated on the upper surface 52 of the substrate 40, and is located at the periphery of the long slot 56.

The integrated circuit 46 has a first surface 62 on which a plurality of bonding pads 66 are formed, and a second surface 64. The first surface 62 is adhered to the glue layer 44, thus, the bonding pads 66 are exposed from the long slot 56 of the substrate 40.

The plurality of wires 47, each of which is arranged within the long slot 56 of the substrate 40 and is electrically connected the bonding pad 66 of the integrated circuit 46 to the connected point 60 of the substrate 40.

The first compound layer 48 is filled within the long slot 56 of the substrate 40 for protecting the each wire 47, respectively.

The second compound layer 50 is covered on the upper surface 52 of the substrate 40 to prevent the integrated circuit 46.

The invention has the following advantages.

• • 1. Since if the flowed glue of the glue layer 44 is flowed to the lower surface 54 of the substrate 40 through the long slot 56, the flowed glue can be prevented by the resistant layer 42 to flow to the wiring regions 58, so that the connected points 60 may not covered by the flowed glue.
  • 2. Since the length of the wiring regions 58 are shorter than the long slot 56, so that, while drilled the long slot 56, if the substrate 40 is cracked, which is can be not coupled to the wiring regions 58, thus the connected points 60 can be not covered by the flowed flue of the glue layer 44.

While the invention has been described by way of an example and in terms of a preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiment. To the contrary, it is intended to cover various modifications. Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications.

Claims

1. An integrated circuit package having central leads comprising: a substrate having an upper surface, a lower surface, and a long slot penetrating from the upper to the lower surface, the lower surface forming with wiring regions arranged at the two sides of the long slot, and the wiring regions forming with a plurality of connected points, the length of the wiring regions are smaller than long slot of the substrate; a resistant layer 42 is coated on the lower surface 54 of the substrate 40, and is located between the long slot 56 and wiring region 58a glue layer being coated on the upper surface of the substrate and being located at the periphery of the long slot; an integrated circuit having a first surface forming with a plurality of bonding pads and a second surface, the first surface being adhered to the glue layer, then the bonding pads being exposed from the long slot of the substrate; a plurality of wires, each of which is arranged within the long slot of the substrate and is electrically connected the bonding pad of the integrated circuit to the connected point of the substrate; and a first compound layer being filled within the long slot of the substrate for protecting the each wire.

2. The integrate circuit package having central leads according to claim 1, wherein the length of the wiring regions are shorter than the long slot of the substrate

3. The integrate circuit package having central leads according to claim 1, wherein the connected points of the lower surface of the substrate is formed with ball grid array (BGA).

4. The integrate circuit package having central leads according to claim 1, wherein further comprises a second compound layer, which is covered on the upper surface of the substrate.