Cheng-Eng Daniel Chen

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Richardson, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Multi-via interconnect structure and method of manufacture
- Patent number 9,425,150
- Issue date Aug 23, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Fei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicided structures having openings therein
- Patent number 5,166,770
- Issue date Nov 24, 1992
- Texas Instruments Incorporated
- Thomas E. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
NMOS transistor having inversion layer source/drain contacts
- Patent number 5,047,361
- Issue date Sep 10, 1991
- Texas Instruments Incorporated
- Mishel Matloubian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MOS transistor with improved radiation hardness
- Patent number 5,026,656
- Issue date Jun 25, 1991
- Texas Instruments Incorporated
- Mishel Matloubian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MOS transistor with improved radiation hardness
- Patent number 4,974,051
- Issue date Nov 27, 1990
- Texas Instruments Incorporated
- Mishel Matloubian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dram cell and method
- Patent number 4,864,375
- Issue date Sep 5, 1989
- Texas Instruments Incorporated
- Clarence W. Teng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-VIA INTERCONNECT STRUCTURE AND METHOD OF MANUFACTURE
- Publication number 20150228584
- Publication date Aug 13, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Fei Huang
- H01 - BASIC ELECTRIC ELEMENTS