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Chien-Hua Chen

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  • Corvallis, OR, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Coplanar modular printbars
    • Patent number 11,975,468
    • Issue date May 7, 2024
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Microfluidic devices with lid for loading fluid
    • Patent number 11,904,312
    • Issue date Feb 20, 2024
    • Hewlett-Packard Development Company, L.P.
    • Hilary Ely
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Applying mold chase structure to end portion of fluid ejection die
    • Patent number 11,827,021
    • Issue date Nov 28, 2023
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Three-dimensional features formed in molded panel
    • Patent number 11,807,523
    • Issue date Nov 7, 2023
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Fluid ejection devices
    • Patent number 11,780,226
    • Issue date Oct 10, 2023
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Molded structures with channels
    • Patent number 11,780,227
    • Issue date Oct 10, 2023
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Fluid ejection device with break(s) in cover layer
    • Patent number 11,745,507
    • Issue date Sep 5, 2023
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Circuit die alignment target
    • Patent number 11,721,636
    • Issue date Aug 8, 2023
    • Hewlett-Packard Development Company, L.P.
    • Anthony M. Fuller
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Uniform print head surface coating
    • Patent number 11,691,423
    • Issue date Jul 4, 2023
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Fluid circulation and ejection
    • Patent number 11,691,431
    • Issue date Jul 4, 2023
    • Hewlett-Packard Development Company, L.P.
    • Si-Lam Choy
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Sequential encapsulation of reagents
    • Patent number 11,673,107
    • Issue date Jun 13, 2023
    • Hewlett-Packard Development Company, L.P.
    • Viktor Shkolnikov
    • B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • Information Patent Grant

    Microfluidic package
    • Patent number 11,666,908
    • Issue date Jun 6, 2023
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • Information Patent Grant

    Fluidic ejection dies with enclosed cross-channels
    • Patent number 11,654,680
    • Issue date May 23, 2023
    • Hewlett-Packard Development Company, L.P.
    • Si-Iam Choy
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Fluid ejection device including fluid output channel
    • Patent number 11,642,885
    • Issue date May 9, 2023
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Microfluidic device with manifold
    • Patent number 11,597,646
    • Issue date Mar 7, 2023
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Fluid ejection polymeric recirculation channel
    • Patent number 11,597,204
    • Issue date Mar 7, 2023
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Microfluidic devices
    • Patent number 11,583,861
    • Issue date Feb 21, 2023
    • Hewlett-Packard Development Company, L.P.
    • Viktor Shkolnikov
    • B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • Information Patent Grant

    Molded panels
    • Patent number 11,577,456
    • Issue date Feb 14, 2023
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Thermally controlled reagent release
    • Patent number 11,577,252
    • Issue date Feb 14, 2023
    • Hewlett-Packard Development Company, L.P.
    • Viktor Shkolnikov
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Fluid ejection device with a portioning wall
    • Patent number 11,565,521
    • Issue date Jan 31, 2023
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Fluidic die with surface condition monitoring
    • Patent number 11,559,987
    • Issue date Jan 24, 2023
    • Hewlett-Packard Development Company, L.P.
    • Eric Martin
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Fluidic die assemblies with rigid bent substrates
    • Patent number 11,548,287
    • Issue date Jan 10, 2023
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Fluidic die with nozzle layer electrode for fluid control
    • Patent number 11,541,658
    • Issue date Jan 3, 2023
    • Hewlett-Packard Development Company, L.P.
    • Daryl E. Anderson
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Molded printhead
    • Patent number 11,541,659
    • Issue date Jan 3, 2023
    • Hewlett-Packard Development Company, L.P.
    • Silam J. Choy
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Microfluidic devices
    • Patent number 11,478,793
    • Issue date Oct 25, 2022
    • Hewlett-Packard Development Company, L.P.
    • Viktor Shkolnikov
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Plurality of filters
    • Patent number 11,440,009
    • Issue date Sep 13, 2022
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Movable mold insert adjuster
    • Patent number 11,433,571
    • Issue date Sep 6, 2022
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Conductive elements electrically coupled to fluidic dies
    • Patent number 11,433,670
    • Issue date Sep 6, 2022
    • Hewlett-Packard Development Company, L.P.
    • Michael W Cumbie
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Molding a fluid flow structure
    • Patent number 11,426,900
    • Issue date Aug 30, 2022
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Fluidic dies
    • Patent number 11,390,075
    • Issue date Jul 19, 2022
    • Hewlett-Packard Development Company, L.P.
    • Si-Lam Choy
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Patents Applicationslast 30 patents

  • Information Patent Application

    DIGITAL MICROFLUIDIC DEVICES WITH PARKING ELECTRODES
    • Publication number 20240116055
    • Publication date Apr 11, 2024
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
  • Information Patent Application

    FLUID-EJECTION DIE WITH STAMPED NANOCERAMIC LAYER
    • Publication number 20240100849
    • Publication date Mar 28, 2024
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    MOLDED STRUCTURES WITH CHANNELS
    • Publication number 20230391086
    • Publication date Dec 7, 2023
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua CHEN
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    FLUID EJECTION DEVICE WITH BREAK(S) IN COVER LAYER
    • Publication number 20230356527
    • Publication date Nov 9, 2023
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    MICROFLUIDIC PACKAGE
    • Publication number 20230264197
    • Publication date Aug 24, 2023
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • Information Patent Application

    MICROFLUIDIC DEVICES
    • Publication number 20230173495
    • Publication date Jun 8, 2023
    • Hewlett-Packard Development Company, L.P.
    • Viktor SHKOLNIKOV
    • B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • Information Patent Application

    THERMALLY CONTROLLED REAGENT RELEASE
    • Publication number 20230166264
    • Publication date Jun 1, 2023
    • Hewlett-Packard Development Company, L.P.
    • Viktor Shkolnikov
    • B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • Information Patent Application

    MOLDED PANELS
    • Publication number 20230150199
    • Publication date May 18, 2023
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    MOLDED PANELS
    • Publication number 20230150198
    • Publication date May 18, 2023
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    MOLDED MICROFLUIDIC SUBSTRATE HAVING MICROFLUIDIC CHANNEL
    • Publication number 20230143672
    • Publication date May 11, 2023
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua CHEN
    • B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • Information Patent Application

    THERMALLY CONTROLLED REAGENT RELEASE
    • Publication number 20230050391
    • Publication date Feb 16, 2023
    • Hewlett-Packard Development Company, L.P.
    • Viktor Shkolnikov
    • B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • Information Patent Application

    ARRAY DROPLET MANIPULATIONS
    • Publication number 20220410163
    • Publication date Dec 29, 2022
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • Information Patent Application

    VORTEX PARTICLE SEPARATION
    • Publication number 20220250070
    • Publication date Aug 11, 2022
    • Hewlett-Packard Development Company, L.P.
    • Viktor Shkolnikov
    • B03 - SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES O...
  • Information Patent Application

    DIGITAL MICROFLUIDICS DEVICE WITH DROPLET PROCESSING COMPONENTS
    • Publication number 20220250077
    • Publication date Aug 11, 2022
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    FLUID CIRCULATION AND EJECTION
    • Publication number 20220203696
    • Publication date Jun 30, 2022
    • Hewlett-Packard Development Company, L.P.
    • Si-Iam Choy
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    ORIFICE SHIELD
    • Publication number 20220184957
    • Publication date Jun 16, 2022
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    FLUID EJECTION FACE SELECTIVE COATING
    • Publication number 20220184949
    • Publication date Jun 16, 2022
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    FLUID PROPERTY SENSOR
    • Publication number 20220176707
    • Publication date Jun 9, 2022
    • Hewlett-Packard Development Company, L.P.
    • Anthony D. STUDER
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    FLUID EJECTION HEAD SERVICE WITH NON-WETTING LAYER
    • Publication number 20220143980
    • Publication date May 12, 2022
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    UNIFORM PRINT HEAD SURFACE COATING
    • Publication number 20220143978
    • Publication date May 12, 2022
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    COPLANAR MODULAR PRINTBARS
    • Publication number 20220143883
    • Publication date May 12, 2022
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    MOLDED STRUCTURES WITH CHANNELS
    • Publication number 20220126577
    • Publication date Apr 28, 2022
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua CHEN
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    FLUID PROPELLING APPARATUS INCLUDING A HEAT SINK
    • Publication number 20220111645
    • Publication date Apr 14, 2022
    • Hewlett-Packard Development Company, L.P.
    • Garrett E. Clark
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    MOLDED STRUCTURES WITH CHANNELS
    • Publication number 20220111647
    • Publication date Apr 14, 2022
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua CHEN
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    FLUID EJECTION POLYMERIC RECIRCULATION CHANNEL
    • Publication number 20220105725
    • Publication date Apr 7, 2022
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    FLUID EJECTION DEVICE WITH BREAK(S) IN COVER LAYER
    • Publication number 20220072858
    • Publication date Mar 10, 2022
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    CURVED FLUID EJECTION DEVICES
    • Publication number 20220032626
    • Publication date Feb 3, 2022
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    APPLYING MOLD CHASE STRUCTURE TO END PORTION OF FLUID EJECTION DIE
    • Publication number 20220009231
    • Publication date Jan 13, 2022
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua CHEN
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    THREE-DIMENSIONAL FEATURES FORMED IN MOLDED PANEL
    • Publication number 20220002149
    • Publication date Jan 6, 2022
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    CIRCUIT DIE ALIGNMENT TARGET
    • Publication number 20210402782
    • Publication date Dec 30, 2021
    • Hewlett-Packard Development Company, L.P.
    • Anthony M. Fuller
    • H01 - BASIC ELECTRIC ELEMENTS