Chin Hui Chong

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional bonding scheme and associated systems and methods
- Patent number 12,148,736
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for reducing the size of a semiconductor assembly
- Patent number 11,942,460
- Issue date Mar 26, 2024
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit wire bonded to a multi-layer substrate having an...
- Patent number 11,929,351
- Issue date Mar 12, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates for semiconductor packages, including hybrid substrates...
- Patent number 11,894,289
- Issue date Feb 6, 2024
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount device bonded to an inner layer of a multi-layer subs...
- Patent number 11,723,150
- Issue date Aug 8, 2023
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies with systems and methods for managing high...
- Patent number 11,710,722
- Issue date Jul 25, 2023
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with multiple substrates and die stacks
- Patent number 11,562,987
- Issue date Jan 24, 2023
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates for semiconductor packages, including hybrid substrates...
- Patent number 11,527,459
- Issue date Dec 13, 2022
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Build-up package for integrated circuit devices, and methods of mak...
- Patent number 11,367,667
- Issue date Jun 21, 2022
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit wire bonded to a multi-layer substrate having an...
- Patent number 11,282,811
- Issue date Mar 22, 2022
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 11,239,128
- Issue date Feb 1, 2022
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-encapsulated lead frames for microelectronic device packages, a...
- Patent number 11,189,548
- Issue date Nov 30, 2021
- Micron Technology, Inc.
- Ai-Chie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device packages, stacked microelectronic device pac...
- Patent number 10,861,824
- Issue date Dec 8, 2020
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Build-up package for integrated circuit devices, and methods of mak...
- Patent number 10,593,607
- Issue date Mar 17, 2020
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device assemblies including conductive vias having two o...
- Patent number 10,448,509
- Issue date Oct 15, 2019
- Micron Technology, Inc.
- David J. Corisis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 10,431,513
- Issue date Oct 1, 2019
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 10,211,114
- Issue date Feb 19, 2019
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device packages, stacked microelectronic device pac...
- Patent number 10,153,254
- Issue date Dec 11, 2018
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
- Patent number 10,008,468
- Issue date Jun 26, 2018
- Micron Technology, Inc.
- Choon Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 9,768,121
- Issue date Sep 19, 2017
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-encapsulated lead frames for microelectronic device packages, a...
- Patent number 9,721,874
- Issue date Aug 1, 2017
- Micron Technology, Inc.
- Ai Chie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microelectronic devices
- Patent number 9,640,458
- Issue date May 2, 2017
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device packages, stacked microelectronic device pac...
- Patent number 9,583,476
- Issue date Feb 28, 2017
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
- Patent number 9,530,748
- Issue date Dec 27, 2016
- Micron Technology, Inc.
- Choon Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked packaged integrated circuit devices, and methods of making...
- Patent number 9,362,260
- Issue date Jun 7, 2016
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 9,362,141
- Issue date Jun 7, 2016
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Build-up package for integrated circuit devices, and methods of mak...
- Patent number 9,355,994
- Issue date May 31, 2016
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land grid array semiconductor device packages
- Patent number 9,355,992
- Issue date May 31, 2016
- Micron Technology, Inc.
- Lee Choon Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device packages, stacked microelectronic device pac...
- Patent number 9,299,684
- Issue date Mar 29, 2016
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies with multi-level substrates and associated...
- Patent number 9,271,403
- Issue date Feb 23, 2016
- Micron Technology, Inc.
- Chin Hui Chong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MOLDED COMPOUND PATTERNS ON PACKAGE BALL SIDE TO MITIGATE COPLANARI...
- Publication number 20240332216
- Publication date Oct 3, 2024
- Micron Technology, Inc.
- See Hiong LEOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH CROSS-STACK STRUCTURES, AND AS...
- Publication number 20240312890
- Publication date Sep 19, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICE PACKAGES AND ELE...
- Publication number 20240304598
- Publication date Sep 12, 2024
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEGGED SUPPORT STRUCTURE TO MITIGATE STACKED DIE OVERHANG DEFLECTION
- Publication number 20240268132
- Publication date Aug 8, 2024
- Micron Technology, Inc.
- See Hiong LEOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR REDUCING THE SIZE OF A SEMICONDUCTOR ASSEMBLY
- Publication number 20240203963
- Publication date Jun 20, 2024
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH A CIRCULAR SEGMENTED PACKAGE EDGE
- Publication number 20240203842
- Publication date Jun 20, 2024
- Micron Technology, Inc.
- Seng Kim YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES FOR SEMICONDUCTOR PACKAGES, INCLUDING HYBRID SUBSTRATES...
- Publication number 20240128163
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC INTERPOSER WITH ELECTRICAL-CONNECTION CUT-IN
- Publication number 20240128182
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR SYSTEMS IN PACKAGES, AND ASSOCIATED DEVICES, SYSTEMS, AND M...
- Publication number 20240072024
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE WITH ENHANCED CONDUCTIVE LAYER ADHESION
- Publication number 20240071886
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE FOR A SEMICONDUCTOR DEVICE
- Publication number 20240071880
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH BALANCED WIRES, AND ASSOCIATED...
- Publication number 20240071979
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CAPACITORS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS...
- Publication number 20240072022
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NESTED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MAKING THE SAME
- Publication number 20240047423
- Publication date Feb 8, 2024
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING ALIGNED FRONT-END INTERFACE CONTACTS A...
- Publication number 20230395569
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL SEMICONDUCTOR TRACE LENGTH MATCHING AND ASSOCIATE...
- Publication number 20230378043
- Publication date Nov 23, 2023
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSS STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS
- Publication number 20230378128
- Publication date Nov 23, 2023
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS
- Publication number 20230378129
- Publication date Nov 23, 2023
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH SYSTEMS AND METHODS FOR MANAGING HIGH...
- Publication number 20230369291
- Publication date Nov 16, 2023
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNT DEVICE BONDED TO AN INNER LAYER OF A MULTI-LAYER SUBS...
- Publication number 20230345639
- Publication date Oct 26, 2023
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH SYSTEMS AND METHODS FOR USING AN INTE...
- Publication number 20230282588
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-ROLE SEMICONDUCTOR DEVICE SUBSTRATES, SEMICONDUCTOR DEVICE AS...
- Publication number 20230282559
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING DIRECT-CONTACT HEAT PATHS AND METHODS OF MANUFA...
- Publication number 20230066375
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL BONDING SCHEME AND ASSOCIATED SYSTEMS AND METHODS
- Publication number 20230069476
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES FOR SEMICONDUCTOR PACKAGES, INCLUDING HYBRID SUBSTRATES...
- Publication number 20230056648
- Publication date Feb 23, 2023
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAK...
- Publication number 20230005802
- Publication date Jan 5, 2023
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES FOR SEMICONDUCTOR PACKAGES, INCLUDING HYBRID SUBSTRATES...
- Publication number 20220352052
- Publication date Nov 3, 2022
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH MULTIPLE SUBSTRATES AND DIE STACKS
- Publication number 20220336417
- Publication date Oct 20, 2022
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH SYSTEMS AND METHODS FOR MANAGING HIGH...
- Publication number 20220336419
- Publication date Oct 20, 2022
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR REDUCING THE SIZE OF A SEMICONDUCTOR ASSEMBLY
- Publication number 20220208744
- Publication date Jun 30, 2022
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS

Chin Hui Chong

Person

Patents Grantslast 30 patents

Three-dimensional bonding scheme and associated systems and methods

Systems and methods for reducing the size of a semiconductor assembly

Integrated circuit wire bonded to a multi-layer substrate having an...

Substrates for semiconductor packages, including hybrid substrates...

Surface mount device bonded to an inner layer of a multi-layer subs...

Semiconductor assemblies with systems and methods for managing high...

Semiconductor devices with multiple substrates and die stacks

Substrates for semiconductor packages, including hybrid substrates...

Build-up package for integrated circuit devices, and methods of mak...

Integrated circuit wire bonded to a multi-layer substrate having an...

Microelectronic devices, stacked microelectronic devices, and metho...

Pre-encapsulated lead frames for microelectronic device packages, a...

Microelectronic device packages, stacked microelectronic device pac...

Build-up package for integrated circuit devices, and methods of mak...

Electronic device assemblies including conductive vias having two o...

Microelectronic devices, stacked microelectronic devices, and metho...

Microelectronic devices, stacked microelectronic devices, and metho...

Microelectronic device packages, stacked microelectronic device pac...

Packaged microelectronic devices and methods for manufacturing pack...

Microelectronic devices, stacked microelectronic devices, and metho...

Pre-encapsulated lead frames for microelectronic device packages, a...

Stacked microelectronic devices

Microelectronic device packages, stacked microelectronic device pac...

Packaged microelectronic devices and methods for manufacturing pack...

Stacked packaged integrated circuit devices, and methods of making...

Microelectronic devices, stacked microelectronic devices, and metho...

Build-up package for integrated circuit devices, and methods of mak...

Land grid array semiconductor device packages

Microelectronic device packages, stacked microelectronic device pac...

Semiconductor assemblies with multi-level substrates and associated...

Patents Applicationslast 30 patents

MOLDED COMPOUND PATTERNS ON PACKAGE BALL SIDE TO MITIGATE COPLANARI...

SEMICONDUCTOR DEVICE ASSEMBLIES WITH CROSS-STACK STRUCTURES, AND AS...

MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICE PACKAGES AND ELE...

LEGGED SUPPORT STRUCTURE TO MITIGATE STACKED DIE OVERHANG DEFLECTION

SYSTEMS AND METHODS FOR REDUCING THE SIZE OF A SEMICONDUCTOR ASSEMBLY

SEMICONDUCTOR DEVICE ASSEMBLY WITH A CIRCULAR SEGMENTED PACKAGE EDGE

SUBSTRATES FOR SEMICONDUCTOR PACKAGES, INCLUDING HYBRID SUBSTRATES...

DIELECTRIC INTERPOSER WITH ELECTRICAL-CONNECTION CUT-IN

MODULAR SYSTEMS IN PACKAGES, AND ASSOCIATED DEVICES, SYSTEMS, AND M...

MULTI-CHIP PACKAGE WITH ENHANCED CONDUCTIVE LAYER ADHESION

PACKAGE SUBSTRATE FOR A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE ASSEMBLIES WITH BALANCED WIRES, AND ASSOCIATED...

STACKED CAPACITORS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS...

NESTED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MAKING THE SAME

SEMICONDUCTOR DEVICES HAVING ALIGNED FRONT-END INTERFACE CONTACTS A...

THREE DIMENSIONAL SEMICONDUCTOR TRACE LENGTH MATCHING AND ASSOCIATE...

CROSS STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS

THROUGH STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS

SEMICONDUCTOR ASSEMBLIES WITH SYSTEMS AND METHODS FOR MANAGING HIGH...

SURFACE MOUNT DEVICE BONDED TO AN INNER LAYER OF A MULTI-LAYER SUBS...

SEMICONDUCTOR ASSEMBLIES WITH SYSTEMS AND METHODS FOR USING AN INTE...

MULTI-ROLE SEMICONDUCTOR DEVICE SUBSTRATES, SEMICONDUCTOR DEVICE AS...

APPARATUS INCLUDING DIRECT-CONTACT HEAT PATHS AND METHODS OF MANUFA...

THREE-DIMENSIONAL BONDING SCHEME AND ASSOCIATED SYSTEMS AND METHODS

SUBSTRATES FOR SEMICONDUCTOR PACKAGES, INCLUDING HYBRID SUBSTRATES...

BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAK...

SUBSTRATES FOR SEMICONDUCTOR PACKAGES, INCLUDING HYBRID SUBSTRATES...

SEMICONDUCTOR DEVICES WITH MULTIPLE SUBSTRATES AND DIE STACKS

SEMICONDUCTOR ASSEMBLIES WITH SYSTEMS AND METHODS FOR MANAGING HIGH...

SYSTEMS AND METHODS FOR REDUCING THE SIZE OF A SEMICONDUCTOR ASSEMBLY