Chin-Tzu Chiu

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Wire bond pad design for compact stacked-die package
- Patent number 12,051,660
- Issue date Jul 30, 2024
- Western Digital Technologies, Inc.
- Xuyi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric semiconductor device and method of making same
- Patent number 11,901,260
- Issue date Feb 13, 2024
- Western Digital Technologies, Inc.
- Jiandi Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scraper
- Patent number 11,872,714
- Issue date Jan 16, 2024
- Goodly-CH Enterprise Co., Ltd.
- Chin-Shun Chiu
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Semiconductor device including conductive bumps to improve EMI/RFI...
- Patent number 11,784,135
- Issue date Oct 10, 2023
- Western Digital Technologies, Inc.
- Jiandi Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including vertical wire bonds
- Patent number 11,749,647
- Issue date Sep 5, 2023
- Western Digital Technologies, Inc.
- Xiaofeng Di
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electronic element module, semiconductor package, and me...
- Patent number 11,456,279
- Issue date Sep 27, 2022
- Western Digital Technologies, Inc.
- Cong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric semiconductor device and method of making same
- Patent number 11,444,001
- Issue date Sep 13, 2022
- Western Digital Technologies, Inc.
- Jiandi Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Side contact pads for high-speed memory card
- Patent number 11,425,817
- Issue date Aug 23, 2022
- Western Digital Technologies, Inc.
- Shineng Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including reinforced corner supports
- Patent number 11,393,735
- Issue date Jul 19, 2022
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die and semiconductor package
- Patent number 11,355,485
- Issue date Jun 7, 2022
- Western Digital Technologies, Inc.
- Yazhou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including vertically stacked semiconductor dies
- Patent number 11,302,673
- Issue date Apr 12, 2022
- Western Digital Technologies, Inc.
- Xuyi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High capacity semiconductor device including bifurcated memory module
- Patent number 11,276,669
- Issue date Mar 15, 2022
- Western Digital Technologies, Inc.
- Xuyi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-module integrated interposer and semiconductor device formed...
- Patent number 11,257,785
- Issue date Feb 22, 2022
- Western Digital Technologies, Inc.
- Cong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond pad design for compact stacked-die package
- Patent number 11,189,582
- Issue date Nov 30, 2021
- WESTERN DIGITAL TECHNOLOGIES. INC.
- Xuyi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including control switches to reduce pin capac...
- Patent number 11,177,239
- Issue date Nov 16, 2021
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Shineng Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including high speed heterogeneous integrated...
- Patent number 11,031,378
- Issue date Jun 8, 2021
- Western Digital Technologies, Inc.
- Yazhou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating semiconductor package
- Patent number 11,031,371
- Issue date Jun 8, 2021
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Chin Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including dummy pull-down wire bonds
- Patent number 11,031,372
- Issue date Jun 8, 2021
- Western Digital Technologies, Inc.
- Han-Shiao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through vias in molded columns
- Patent number 10,872,856
- Issue date Dec 22, 2020
- Western Digital Technologies, Inc.
- Yazhou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Datacenter 3D solid state drives with matrix cooling
- Patent number 10,818,575
- Issue date Oct 27, 2020
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,811,386
- Issue date Oct 20, 2020
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Chin Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including optically connected wafer stack
- Patent number 10,734,354
- Issue date Aug 4, 2020
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous fan-out structures for memory devices
- Patent number 10,607,955
- Issue date Mar 31, 2020
- SanDisk Semiconductor (Shanghai) Co. Ltd.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Angled die semiconductor device
- Patent number 10,490,529
- Issue date Nov 26, 2019
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clamping device
- Patent number 10,411,445
- Issue date Sep 10, 2019
- Chin-Hung Chiu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Vertical semiconductor device having a stacked die block
- Patent number 10,325,881
- Issue date Jun 18, 2019
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Suresh Upadhyayula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including stacked die with continuous integral...
- Patent number 10,304,816
- Issue date May 28, 2019
- Western Digital Technologies, Inc.
- Shiv Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including interconnected package on package
- Patent number 10,242,965
- Issue date Mar 26, 2019
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including vertically integrated groups of semi...
- Patent number 10,236,276
- Issue date Mar 19, 2019
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Utility knife
- Patent number 10,213,927
- Issue date Feb 26, 2019
- Goodly-CH Enterprise Co., Ltd.
- Chin-Chang Chiu
- B26 - HAND CUTTING TOOLS CUTTING SEVERING

Patents Applicationslast 30 patents

Information Patent Application
SCRAPER
- Publication number 20250017437
- Publication date Jan 16, 2025
- GOODLY-CH ENTERPRISE CO., LTD.
- Chin-Chang CHIU
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Application
SEMICONDUCTOR WAFER AND SEMICONDUCTOR DIES FORMED THEREFROM INCLUDI...
- Publication number 20230282594
- Publication date Sep 7, 2023
- Western Digital Technologies, Inc.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC SEMICONDUCTOR DEVICE AND METHOD OF MAKING SAME
- Publication number 20220415750
- Publication date Dec 29, 2022
- Western Digital Technologies, Inc.
- Jiandi Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VERTICAL CONTACT FINGERS
- Publication number 20220406724
- Publication date Dec 22, 2022
- Western Digital Technologies, Inc.
- Zhongli Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE BUMPS TO IMPROVE EMI/RFI...
- Publication number 20220406726
- Publication date Dec 22, 2022
- Western Digital Technologies, Inc.
- Jiandi Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND PAD DESIGN FOR COMPACT STACKED-DIE PACKAGE
- Publication number 20220052002
- Publication date Feb 17, 2022
- Western Digital Technologies, Inc.
- Xuyi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDE CONTACT PADS FOR HIGH-SPEED MEMORY CARD
- Publication number 20210400811
- Publication date Dec 23, 2021
- Western Digital Technologies, Inc.
- SHINENG MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VERTICAL WIRE BONDS
- Publication number 20210366875
- Publication date Nov 25, 2021
- Western Digital Technologies, Inc.
- Xiaofeng Di
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND PAD DESIGN FOR COMPACT STACKED-DIE PACKAGE
- Publication number 20210151399
- Publication date May 20, 2021
- Western Digital Technologies, Inc.
- Xuyi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRONIC ELEMENT MODULE, SEMICONDUCTOR PACKAGE, AND ME...
- Publication number 20210043602
- Publication date Feb 11, 2021
- Western Digital Technologies, Inc.
- Cong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING HIGH SPEED HETEROGENEOUS INTEGRATED...
- Publication number 20200411479
- Publication date Dec 31, 2020
- Western Digital Technologies, Inc.
- Yazhou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE AND SEMICONDUCTOR PACKAGE
- Publication number 20200411496
- Publication date Dec 31, 2020
- Western Digital Technologies, Inc.
- Yazhou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CAPACITY SEMICONDUCTOR DEVICE INCLUDING BIFURCATED MEMORY MODULE
- Publication number 20200411480
- Publication date Dec 31, 2020
- Western Digital Technologies, Inc.
- Xuyi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VERTICALLY STACKED SEMICONDUCTOR DIES
- Publication number 20200411481
- Publication date Dec 31, 2020
- Western Digital Technologies, Inc.
- Xuyi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-MODULE INTEGRATED INTERPOSER AND SEMICONDUCTOR DEVICE FORMED...
- Publication number 20200365554
- Publication date Nov 19, 2020
- Western Digital Technologies, Inc.
- Cong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING REINFORCED CORNER SUPPORTS
- Publication number 20200006184
- Publication date Jan 2, 2020
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PRODUCT SUBSTRATE INCLUDING STRESS RELIEF LAYER
- Publication number 20200006212
- Publication date Jan 2, 2020
- Western Digital Technologies, Inc.
- Rui Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH VIAS IN MOLDED COLUMNS
- Publication number 20200006221
- Publication date Jan 2, 2020
- Western Digital Technologies, Inc.
- Yazhou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING DUMMY PULL-DOWN WIRE BONDS
- Publication number 20190341366
- Publication date Nov 7, 2019
- Western Digital Technologies, Inc.
- Han-Shiao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING OPTICALLY CONNECTED WAFER STACK
- Publication number 20190198479
- Publication date Jun 27, 2019
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Chin-Tien Chiu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DATACENTER 3D SOLID STATE DRIVES WITH MATRIX COOLING
- Publication number 20190189536
- Publication date Jun 20, 2019
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE CUBE WITH ENHANCED SIDEWALL PLANARITY
- Publication number 20190189591
- Publication date Jun 20, 2019
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Yazhou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CONTROL SWITCHES TO REDUCE PIN CAPAC...
- Publication number 20190006320
- Publication date Jan 3, 2019
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Shineng Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANGLED DIE SEMICONDUCTOR DEVICE
- Publication number 20180342483
- Publication date Nov 29, 2018
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLAMPING DEVICE
- Publication number 20180309271
- Publication date Oct 25, 2018
- Chin-Hung Chiu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VERTICALLY INTEGRATED GROUPS OF SEMI...
- Publication number 20180294251
- Publication date Oct 11, 2018
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180114777
- Publication date Apr 26, 2018
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Chin Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20180114773
- Publication date Apr 26, 2018
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Chin Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SEMICONDUCTOR DEVICE
- Publication number 20180047706
- Publication date Feb 15, 2018
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Suresh Upadhyayula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF SEMICONDUCTOR...
- Publication number 20180019228
- Publication date Jan 18, 2018
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Cong Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Chin-Tzu Chiu

Person

Patents Grantslast 30 patents

Wire bond pad design for compact stacked-die package

Thermoelectric semiconductor device and method of making same

Scraper

Semiconductor device including conductive bumps to improve EMI/RFI...

Semiconductor device including vertical wire bonds

Integrated electronic element module, semiconductor package, and me...

Thermoelectric semiconductor device and method of making same

Side contact pads for high-speed memory card

Semiconductor device including reinforced corner supports

Semiconductor die and semiconductor package

Semiconductor device including vertically stacked semiconductor dies

High capacity semiconductor device including bifurcated memory module

Multi-module integrated interposer and semiconductor device formed...

Wire bond pad design for compact stacked-die package

Semiconductor device including control switches to reduce pin capac...

Semiconductor device including high speed heterogeneous integrated...

Semiconductor package and method of fabricating semiconductor package

Semiconductor device including dummy pull-down wire bonds

Semiconductor device including through vias in molded columns

Datacenter 3D solid state drives with matrix cooling

Semiconductor device

Semiconductor device including optically connected wafer stack

Heterogeneous fan-out structures for memory devices

Angled die semiconductor device

Clamping device

Vertical semiconductor device having a stacked die block

Semiconductor device including stacked die with continuous integral...

Semiconductor device including interconnected package on package

Semiconductor device including vertically integrated groups of semi...

Utility knife

Patents Applicationslast 30 patents

SCRAPER

SEMICONDUCTOR WAFER AND SEMICONDUCTOR DIES FORMED THEREFROM INCLUDI...

THERMOELECTRIC SEMICONDUCTOR DEVICE AND METHOD OF MAKING SAME

SEMICONDUCTOR DEVICE INCLUDING VERTICAL CONTACT FINGERS

SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE BUMPS TO IMPROVE EMI/RFI...

WIRE BOND PAD DESIGN FOR COMPACT STACKED-DIE PACKAGE

SIDE CONTACT PADS FOR HIGH-SPEED MEMORY CARD

SEMICONDUCTOR DEVICE INCLUDING VERTICAL WIRE BONDS

WIRE BOND PAD DESIGN FOR COMPACT STACKED-DIE PACKAGE

INTEGRATED ELECTRONIC ELEMENT MODULE, SEMICONDUCTOR PACKAGE, AND ME...

SEMICONDUCTOR DEVICE INCLUDING HIGH SPEED HETEROGENEOUS INTEGRATED...

SEMICONDUCTOR DIE AND SEMICONDUCTOR PACKAGE

HIGH CAPACITY SEMICONDUCTOR DEVICE INCLUDING BIFURCATED MEMORY MODULE

SEMICONDUCTOR DEVICE INCLUDING VERTICALLY STACKED SEMICONDUCTOR DIES

MULTI-MODULE INTEGRATED INTERPOSER AND SEMICONDUCTOR DEVICE FORMED...

SEMICONDUCTOR DEVICE INCLUDING REINFORCED CORNER SUPPORTS

SEMICONDUCTOR PRODUCT SUBSTRATE INCLUDING STRESS RELIEF LAYER

SEMICONDUCTOR DEVICE INCLUDING THROUGH VIAS IN MOLDED COLUMNS

SEMICONDUCTOR DEVICE INCLUDING DUMMY PULL-DOWN WIRE BONDS

SEMICONDUCTOR DEVICE INCLUDING OPTICALLY CONNECTED WAFER STACK

DATACENTER 3D SOLID STATE DRIVES WITH MATRIX COOLING

SEMICONDUCTOR STORAGE CUBE WITH ENHANCED SIDEWALL PLANARITY

SEMICONDUCTOR DEVICE INCLUDING CONTROL SWITCHES TO REDUCE PIN CAPAC...

ANGLED DIE SEMICONDUCTOR DEVICE

CLAMPING DEVICE

SEMICONDUCTOR DEVICE INCLUDING VERTICALLY INTEGRATED GROUPS OF SEMI...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

VERTICAL SEMICONDUCTOR DEVICE

FAN OUT SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF SEMICONDUCTOR...