Christopher Leitz

Person

Manchester, NH, US

People

Patents Grantslast 30 patents

Information Patent Grant
Rapid prototyping of single-photon-sensitive silicon avalanche phot...
- Patent number 11,372,119
- Issue date Jun 28, 2022
- Massachusetts Institute of Technology
- Brian F. Aull
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor surface passivation
- Patent number 10,825,950
- Issue date Nov 3, 2020
- Massachusetts Institute of Technology
- James Gregory
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor heterostructures having reduced dislocation pile-ups...
- Patent number 9,934,964
- Issue date Apr 3, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Leitz
- C30 - CRYSTAL GROWTH
Information Patent Grant
Thin film solder bond
- Patent number 9,590,130
- Issue date Mar 7, 2017
- Amberwave Inc.
- Anthony Lochtefeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Submicron gap thermophotovoltaic structure and fabrication method
- Patent number 9,349,891
- Issue date May 24, 2016
- MTPV Power Corporation
- Paul Greiff
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor heterostructures having reduced dislocation pile-ups...
- Patent number 9,309,607
- Issue date Apr 12, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Leitz
- C30 - CRYSTAL GROWTH
Information Patent Grant
Flexible monocrystalline thin silicon cell
- Patent number 9,178,105
- Issue date Nov 3, 2015
- Amberwave Inc.
- Anthony Lochtefeld
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Submicron gap thermophotovoltaic structure and method
- Patent number 8,822,813
- Issue date Sep 2, 2014
- MTPV Power Corporation
- Paul Greiff
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor heterostructures having reduced dislocation pile-ups...
- Patent number 8,823,056
- Issue date Sep 2, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Leitz
- C30 - CRYSTAL GROWTH
Information Patent Grant
Sub-micrometer gap thermophotovoltaic structure (MTPV) and fabricat...
- Patent number 8,633,373
- Issue date Jan 21, 2014
- MTPV Power Corporation
- Paul Greiff
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method and structure for providing a uniform micron/sub-micron gap...
- Patent number 8,450,598
- Issue date May 28, 2013
- MTPV Power Corporation
- Paul Greiff
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Structure and method for a high-speed semiconductor device having a...
- Patent number 8,436,336
- Issue date May 7, 2013
- Massachusetts Institute of Technology
- Minjoo L. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polycrystalline semiconductor layers and methods for forming the same
- Patent number 8,236,603
- Issue date Aug 7, 2012
- Solexant Corp.
- Leslie G. Fritzemeier
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor heterostructures having reduced dislocation pile-ups...
- Patent number 8,129,747
- Issue date Mar 6, 2012
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Richard Westhoff
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method and structure, using flexible membrane surfaces, for setting...
- Patent number 8,076,569
- Issue date Dec 13, 2011
- MTPV, LLC
- Paul Greiff
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor heterostructures having reduced dislocation pile-ups...
- Patent number 7,829,442
- Issue date Nov 9, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Richard Westhoff
- C30 - CRYSTAL GROWTH
Information Patent Grant
Methods of fabricating semiconductor devices having strained dual c...
- Patent number 7,566,606
- Issue date Jul 28, 2009
- AmberWave Systems Corporation
- Matthew T. Currie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for selective placement of dislocation arrays
- Patent number 7,494,881
- Issue date Feb 24, 2009
- AmberWave Systems Corporation
- Anthony J. Lochtefeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor heterostructures having reduced dislocation pile-ups
- Patent number 7,375,385
- Issue date May 20, 2008
- AmberWave Systems Corporation
- Richard Westhoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating semiconductor heterostructures
- Patent number 7,368,308
- Issue date May 6, 2008
- AmberWave Systems Corporation
- Christopher Vineis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures with structural homogeneity
- Patent number 7,332,417
- Issue date Feb 19, 2008
- AmberWave Systems Corporation
- Richard Westhoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for a high-speed semiconductor device having a...
- Patent number 7,301,180
- Issue date Nov 27, 2007
- Massachusetts Institute of Technology
- Minjoo L. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures with planar strained layers
- Patent number 7,141,820
- Issue date Nov 28, 2006
- AmberWave Systems Corporation
- Minjoo L. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having strained dual channel layers
- Patent number 7,138,310
- Issue date Nov 21, 2006
- AmberWave Systems Corporation
- Matthew T. Currie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor heterostructures and related methods
- Patent number 7,049,627
- Issue date May 23, 2006
- AmberWave Systems Corporation
- Christopher Vineis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhancement of P-type metal-oxide-semiconductor field effect transi...
- Patent number 6,916,727
- Issue date Jul 12, 2005
- Massachusetts Institute of Technology
- Christopher W. Leitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of planar strained layers
- Patent number 6,730,551
- Issue date May 4, 2004
- Massachusetts Institute of Technology
- Minjoo L. Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Rapid Prototyping of Single-Photon-Sensitive Silicon Avalanche Phot...
- Publication number 20200319355
- Publication date Oct 8, 2020
- Brian F. AULL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Surface Passivation
- Publication number 20190371855
- Publication date Dec 5, 2019
- Massachusetts Institute of Technology
- James Gregory
- G01 - MEASURING TESTING
Information Patent Application
Thin Film Solder Bond
- Publication number 20180226533
- Publication date Aug 9, 2018
- AMBERWAVE INC.
- Anthony Lochtefeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Heterostructures Having Reduced Dislocation Pile-Ups...
- Publication number 20160225609
- Publication date Aug 4, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Leitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible Monocrystalline Thin Silicon Cell
- Publication number 20160049535
- Publication date Feb 18, 2016
- AMBERWAVE, INC.
- Anthony Lochtefeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Heterostructures Having Reduced Dislocation Pile-Ups...
- Publication number 20140338589
- Publication date Nov 20, 2014
- Christopher Leitz
- C30 - CRYSTAL GROWTH
Information Patent Application
SUBMICRON GAP THERMOPHOTOVOLTAIC STRUCTURE AND FABRICATION METHOD
- Publication number 20140137921
- Publication date May 22, 2014
- MTPV Power Corporation
- Paul Greiff
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Submicron Gap Thermophotovoltaic Structure and Method
- Publication number 20130092212
- Publication date Apr 18, 2013
- MTPV Power Corporation
- Paul GREIFF
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Thin Film Solder Bond
- Publication number 20120273043
- Publication date Nov 1, 2012
- AMBERWAVE INC.
- Anthony Lochtefeld
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor Heterostructures Having Reduced Dislocation Pile-Ups...
- Publication number 20120104461
- Publication date May 3, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Leitz
- C30 - CRYSTAL GROWTH
Information Patent Application
Flexible Monocrystalline Thin Silicon Cell
- Publication number 20120067423
- Publication date Mar 22, 2012
- AMBERWAVE, INC.
- Anthony Lochtefeld
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD AND STRUCTURE FOR PROVIDING A UNIFORM MICRON/SUB-MICRON GAP...
- Publication number 20120060883
- Publication date Mar 15, 2012
- MTPV LLC
- Paul GREIFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Heterostructures Having Reduced Dislocation Pile-Ups...
- Publication number 20110012172
- Publication date Jan 20, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Leitz
- C30 - CRYSTAL GROWTH
Information Patent Application
Sub-micrometer gap thermophotovoltaic structure (MTPV) and fabricat...
- Publication number 20100319749
- Publication date Dec 23, 2010
- MTVP Corporation
- Paul Greiff
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CRYSTALLINE THIN-FILM PHOTOVOLTAIC STRUCTURES AND METHODS FOR FORMI...
- Publication number 20100270653
- Publication date Oct 28, 2010
- Christopher Leitz
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Method and structure, using flexible membrane surfaces, for setting...
- Publication number 20090277488
- Publication date Nov 12, 2009
- MTVP Corporation
- Paul Greiff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES WITH STRUCTURAL HOMOGENEITY
- Publication number 20080135830
- Publication date Jun 12, 2008
- AmberWave Systems Corporation
- Richard Westhoff
- C30 - CRYSTAL GROWTH
Information Patent Application
STRUCTURE AND METHOD FOR A HIGH-SPEED SEMICONDUCTOR DEVICE HAVING A...
- Publication number 20080128747
- Publication date Jun 5, 2008
- Minjoo L. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR HETEROSTRUCTURES HAVING REDUCED DISLOCATION PILE-UPS...
- Publication number 20080079024
- Publication date Apr 3, 2008
- Richard Westhoff
- C30 - CRYSTAL GROWTH
Information Patent Application
Methods for Selective Placement of Dislocation Arrays
- Publication number 20080070397
- Publication date Mar 20, 2008
- AmberWave Systems Corporation
- Anthony J. Lochtefeld
- C30 - CRYSTAL GROWTH
Information Patent Application
Structures with planar strained layers
- Publication number 20070072354
- Publication date Mar 29, 2007
- Massachusetts Institute of Technology
- Minjoo L. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices having strained dual channel layers
- Publication number 20070032009
- Publication date Feb 8, 2007
- AmberWave Systems Corporation
- Matthew T. Currie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of fabricating semiconductor heterostructures
- Publication number 20060009012
- Publication date Jan 12, 2006
- AmberWave Systems Corporation
- Christopher Leitz
- C30 - CRYSTAL GROWTH
Information Patent Application
Enhancement of p-type metal-oxide-semiconductor field effect transi...
- Publication number 20050151164
- Publication date Jul 14, 2005
- AmberWave Systems Corporation
- Christopher W. Leitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structures with structural homogeneity
- Publication number 20040214407
- Publication date Oct 28, 2004
- AmberWave Systems Corporation
- Richard Westhoff
- C30 - CRYSTAL GROWTH
Information Patent Application
Structures with planar strained layers
- Publication number 20040164318
- Publication date Aug 26, 2004
- Massachusetts Institute of Technology
- Minjoo L. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective placement of dislocation arrays
- Publication number 20040115916
- Publication date Jun 17, 2004
- AmberWave Systems Corporation
- Anthony J. Lochtefeld
- C30 - CRYSTAL GROWTH
Information Patent Application
Semiconductor heterostructures and related methods
- Publication number 20040087117
- Publication date May 6, 2004
- AmberWave Systems Corporation
- Christopher Leitz
- C30 - CRYSTAL GROWTH
Information Patent Application
Semiconductor heterostructures having reduced dislocation pile-ups...
- Publication number 20040075105
- Publication date Apr 22, 2004
- AmberWave Systems Corporation
- Christopher Leitz
- C30 - CRYSTAL GROWTH
Information Patent Application
Semiconductor devices having strained dual channel layers
- Publication number 20040026765
- Publication date Feb 12, 2004
- AmberWave Systems Corporation
- Matthew T. Currie
- H01 - BASIC ELECTRIC ELEMENTS

Christopher Leitz

Person

Patents Grantslast 30 patents

Rapid prototyping of single-photon-sensitive silicon avalanche phot...

Semiconductor surface passivation

Semiconductor heterostructures having reduced dislocation pile-ups...

Thin film solder bond

Submicron gap thermophotovoltaic structure and fabrication method

Semiconductor heterostructures having reduced dislocation pile-ups...

Flexible monocrystalline thin silicon cell

Submicron gap thermophotovoltaic structure and method

Semiconductor heterostructures having reduced dislocation pile-ups...

Sub-micrometer gap thermophotovoltaic structure (MTPV) and fabricat...

Method and structure for providing a uniform micron/sub-micron gap...

Structure and method for a high-speed semiconductor device having a...

Polycrystalline semiconductor layers and methods for forming the same

Semiconductor heterostructures having reduced dislocation pile-ups...

Method and structure, using flexible membrane surfaces, for setting...

Semiconductor heterostructures having reduced dislocation pile-ups...

Methods of fabricating semiconductor devices having strained dual c...

Methods for selective placement of dislocation arrays

Semiconductor heterostructures having reduced dislocation pile-ups

Methods of fabricating semiconductor heterostructures

Semiconductor structures with structural homogeneity

Structure and method for a high-speed semiconductor device having a...

Structures with planar strained layers

Semiconductor devices having strained dual channel layers

Semiconductor heterostructures and related methods

Enhancement of P-type metal-oxide-semiconductor field effect transi...

Formation of planar strained layers

Patents Applicationslast 30 patents

Rapid Prototyping of Single-Photon-Sensitive Silicon Avalanche Phot...

Semiconductor Surface Passivation

Thin Film Solder Bond

Semiconductor Heterostructures Having Reduced Dislocation Pile-Ups...

Flexible Monocrystalline Thin Silicon Cell

Semiconductor Heterostructures Having Reduced Dislocation Pile-Ups...

SUBMICRON GAP THERMOPHOTOVOLTAIC STRUCTURE AND FABRICATION METHOD

Submicron Gap Thermophotovoltaic Structure and Method

Thin Film Solder Bond

Semiconductor Heterostructures Having Reduced Dislocation Pile-Ups...

Flexible Monocrystalline Thin Silicon Cell

METHOD AND STRUCTURE FOR PROVIDING A UNIFORM MICRON/SUB-MICRON GAP...

Semiconductor Heterostructures Having Reduced Dislocation Pile-Ups...

Sub-micrometer gap thermophotovoltaic structure (MTPV) and fabricat...

CRYSTALLINE THIN-FILM PHOTOVOLTAIC STRUCTURES AND METHODS FOR FORMI...

Method and structure, using flexible membrane surfaces, for setting...

SEMICONDUCTOR STRUCTURES WITH STRUCTURAL HOMOGENEITY

STRUCTURE AND METHOD FOR A HIGH-SPEED SEMICONDUCTOR DEVICE HAVING A...

SEMICONDUCTOR HETEROSTRUCTURES HAVING REDUCED DISLOCATION PILE-UPS...

Methods for Selective Placement of Dislocation Arrays

Structures with planar strained layers

Semiconductor devices having strained dual channel layers

Methods of fabricating semiconductor heterostructures

Enhancement of p-type metal-oxide-semiconductor field effect transi...

Semiconductor structures with structural homogeneity

Structures with planar strained layers

Selective placement of dislocation arrays

Semiconductor heterostructures and related methods

Semiconductor heterostructures having reduced dislocation pile-ups...

Semiconductor devices having strained dual channel layers