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Molded can package
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Publication number 20130070424
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Publication date Mar 21, 2013
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Great Team Backend Foundry, Inc.
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Chung Hsing TZU
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B81 - MICRO-STRUCTURAL TECHNOLOGY
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Pre molded can package
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Publication number 20130070427
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Publication date Mar 21, 2013
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Great Team Backend Foundry, Inc.
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Chung Hsing TZU
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H01 - BASIC ELECTRIC ELEMENTS
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Chip Package
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Publication number 20120103668
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Publication date May 3, 2012
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Great Team Backend Foundry, Inc.
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Chung Hsing Tzu
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H01 - BASIC ELECTRIC ELEMENTS
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Muti Thickness Lead Frame
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Publication number 20110127658
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Publication date Jun 2, 2011
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Great Team Backend Foundry, Inc.
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Chung Hsing Tzu
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H01 - BASIC ELECTRIC ELEMENTS
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Stack chip package
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Publication number 20060138628
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Publication date Jun 29, 2006
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Domintech Co., Ltd.
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Chung-Hsing Tzu
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H01 - BASIC ELECTRIC ELEMENTS
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