Number | Name | Date | Kind |
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5578869 | Hoffman et al. | Nov 1996 | |
5696666 | Miles et al. | Dec 1997 | |
5760478 | Bozso et al. | Jun 1998 | |
5869894 | Degani et al. | Feb 1999 | |
5949135 | Washida et al. | Sep 1999 | |
5963429 | Chen | Oct 1999 |
Number | Date | Country |
---|---|---|
2-126685 | May 1990 | JP |
Entry |
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“Reworkable Chip-On-Board Package”, IBM Technical Disclosure Bulletin, vol. 29, No. 3, Aug. 1986, pp. 1433 and 1444. |