Daeik Daniel Kim

Person

Del Mar, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
High performance inductors
- Patent number 11,024,454
- Issue date Jun 1, 2021
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor with embraced corner capture pad
- Patent number 10,978,240
- Issue date Apr 13, 2021
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low DC resistance and high RF resistance power amplifier choke indu...
- Patent number 10,832,848
- Issue date Nov 10, 2020
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive-on-glass (POG) device and method
- Patent number 10,607,980
- Issue date Mar 31, 2020
- QUALCOMM Incorporated
- Je-Hsiung Jeffrey Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D pillar inductor
- Patent number 10,553,671
- Issue date Feb 4, 2020
- QUALCOMM Incorporated
- Chengjie Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Segmented thermal and RF ground
- Patent number 10,511,268
- Issue date Dec 17, 2019
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-dimensional structure to form an embedded three-dimensional str...
- Patent number 10,490,348
- Issue date Nov 26, 2019
- QUALCOMM Incorporated
- Mario Francisco Velez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier with RF structure
- Patent number 10,431,511
- Issue date Oct 1, 2019
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land grid array (LGA) packaging of passive-on-glass (POG) structure
- Patent number 10,361,149
- Issue date Jul 23, 2019
- QUALCOMM Incorporated
- Chengjie Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Varying thickness inductor
- Patent number 10,354,795
- Issue date Jul 16, 2019
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits (ICs) on a glass substrate
- Patent number 10,332,911
- Issue date Jun 25, 2019
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solenoid inductor
- Patent number 10,332,671
- Issue date Jun 25, 2019
- QUALCOMM Incorporated
- Mario Francisco Velez
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Backside drill embedded die substrate
- Patent number 10,325,855
- Issue date Jun 18, 2019
- QUALCOMM Incorporated
- Daeik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate comprising an embedded inductor and a thin film magnetic...
- Patent number 10,290,414
- Issue date May 14, 2019
- QUALCOMM Incorporated
- Changhan Hobie Yun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Skewed co-spiral inductor structure
- Patent number 10,283,257
- Issue date May 7, 2019
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stepped-width co-spiral inductor structure
- Patent number 10,262,786
- Issue date Apr 16, 2019
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Stacked substrate inductor
- Patent number 10,249,580
- Issue date Apr 2, 2019
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compartment shielding in flip-chip (FC) module
- Patent number 10,242,957
- Issue date Mar 26, 2019
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tunable matching network
- Patent number 10,187,031
- Issue date Jan 22, 2019
- QUALCOMM Incorporated
- Yunfei Ma
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
RF multiplexer with integrated directional couplers
- Patent number 10,171,112
- Issue date Jan 1, 2019
- QUALCOMM Incorporated
- Yunfei Ma
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Passive device assembly for accurate ground plane control
- Patent number 10,154,591
- Issue date Dec 11, 2018
- QUALCOMM Incorporated
- Chengjie Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive components implemented on a plurality of stacked insulators
- Patent number 10,141,353
- Issue date Nov 27, 2018
- QUALCOMM Incorporated
- Changhan Hobie Yun
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Double-sided circuit
- Patent number 10,103,703
- Issue date Oct 16, 2018
- QUALCOMM Incorporated
- Changhan Hobie Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Open-passivation ball grid array pads
- Patent number 10,103,116
- Issue date Oct 16, 2018
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package (WLP) ball support using cavity structure
- Patent number 10,074,625
- Issue date Sep 11, 2018
- QUALCOMM Incorporated
- Mario Francisco Velez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulation of acoustic resonator devices
- Patent number 10,069,474
- Issue date Sep 4, 2018
- QUALCOMM Incorporated
- Changhan Hobie Yun
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Embedded layered inductor
- Patent number 10,051,741
- Issue date Aug 14, 2018
- QUALCOMM Incorporated
- Young Kyu Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nested through glass via transformer
- Patent number 10,049,815
- Issue date Aug 14, 2018
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus with 3D wirewound inductor integrated within a substrate
- Patent number 10,026,546
- Issue date Jul 17, 2018
- QUALCOMM Incorported
- Changhan Hobie Yun
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Augmented capacitor structure for high quality (Q)-factor radio fre...
- Patent number 9,966,426
- Issue date May 8, 2018
- QUALCOMM Incorporated
- Niranjan Sunil Mudakatte
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEGMENTED THERMAL AND RF GROUND
- Publication number 20190006999
- Publication date Jan 3, 2019
- QUALCOMM Incorporated
- Daeik Daniel KIM
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
LOW DC RESISTANCE AND HIGH RF RESISTANCE POWER AMPLIFIER CHOKE INDU...
- Publication number 20180374622
- Publication date Dec 27, 2018
- QUALCOMM Incorporated
- Daeik Daniel KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR WITH EMBRACED CORNER CAPTURE PAD
- Publication number 20180315540
- Publication date Nov 1, 2018
- QUALCOMM Incorporated
- Daeik Daniel KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER WITH RF STRUCTURE
- Publication number 20180316319
- Publication date Nov 1, 2018
- QUALCOMM Incorporated
- Daeik Daniel KIM
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
WIRE-BOND CAGE IN CONFORMAL SHIELDING
- Publication number 20180228016
- Publication date Aug 9, 2018
- QUALCOMM Incorporated
- Daeik Daniel KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PASSIVE DEVICE ASSEMBLY FOR ACCURATE GROUND PLANE CONTROL
- Publication number 20180177052
- Publication date Jun 21, 2018
- QUALCOMM Incorporated
- Chengjie Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE-ON-GLASS (POG) DEVICE AND METHOD
- Publication number 20180145062
- Publication date May 24, 2018
- Qualcomm Incorporated
- Je-Hsiung Jeffrey Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAND GRID ARRAY (LGA) PACKAGING OF PASSIVE-ON-GLASS (POG) STRUCTURE
- Publication number 20180047660
- Publication date Feb 15, 2018
- QUALCOMM Incorporated
- Chengjie Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY AND METHOD OF MAKING SAME
- Publication number 20180047687
- Publication date Feb 15, 2018
- QUALCOMM Incorporated
- Daeik Daniel KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STEPPED-WIDTH CO-SPIRAL INDUCTOR STRUCTURE
- Publication number 20180033537
- Publication date Feb 1, 2018
- QUALCOMM Incorporated
- Daeik Daniel KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INLINE KERF PROBING OF PASSIVE DEVICES
- Publication number 20170372975
- Publication date Dec 28, 2017
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-DIMENSIONAL STRUCTURE TO FORM AN EMBEDDED THREE-DIMENSIONAL STR...
- Publication number 20170372831
- Publication date Dec 28, 2017
- QUALCOMM Incorporated
- Mario Francisco VELEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPOSED SIDE-WALL AND LGA ASSEMBLY
- Publication number 20170372989
- Publication date Dec 28, 2017
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SUBSTRATE INDUCTOR
- Publication number 20170373025
- Publication date Dec 28, 2017
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE COMPRISING A SUBSTRATE THAT INCLUDES AN IRRADIATED PORTION O...
- Publication number 20170365570
- Publication date Dec 21, 2017
- QUALCOMM Incorporated
- Daeik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED CIRCUIT
- Publication number 20170338788
- Publication date Nov 23, 2017
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PASSIVE COMPONENTS IMPLEMENTED ON A PLURALITY OF STACKED INSULATORS
- Publication number 20170338255
- Publication date Nov 23, 2017
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS WITH 3D WIREWOUND INDUCTOR INTEGRATED WITHIN A SUBSTRATE
- Publication number 20170338034
- Publication date Nov 23, 2017
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNABLE MATCHING NETWORK
- Publication number 20170331445
- Publication date Nov 16, 2017
- QUALCOMM Incorporated
- Yunfei Ma
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
LC FILTER LAYER STACKING BY LAYER TRANSFER TO MAKE 3D MULTIPLEXER S...
- Publication number 20170288707
- Publication date Oct 5, 2017
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
RF MULTIPLEXER WITH INTEGRATED DIRECTIONAL COUPLERS
- Publication number 20170279469
- Publication date Sep 28, 2017
- QUALCOMM Incorporated
- Yunfei Ma
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PASSIVE DEVICE ASSEMBLY FOR ACCURATE GROUND PLANE CONTROL
- Publication number 20170280562
- Publication date Sep 28, 2017
- QUALCOMM Incorporated
- Chengjie Zuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKSIDE DRILL EMBEDDED DIE SUBSTRATE
- Publication number 20170271266
- Publication date Sep 21, 2017
- QUALCOMM Incorporated
- Daeik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPEN-PASSIVATION BALL GRID ARRAY PADS
- Publication number 20170221846
- Publication date Aug 3, 2017
- QUALCOMM Incorporated
- Daeik Daniel KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SKEWED CO-SPIRAL INDUCTOR STRUCTURE
- Publication number 20170200550
- Publication date Jul 13, 2017
- QUALCOMM Incorporated
- Daeik Daniel KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLEXER DESIGN USING A 2D PASSIVE ON GLASS FILTER INTEGRATED WI...
- Publication number 20170187345
- Publication date Jun 29, 2017
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIM CAPACITOR AND METHOD OF MAKING THE SAME
- Publication number 20170178810
- Publication date Jun 22, 2017
- QUALCOMM Incorporated
- David Francis Berdy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM MAGNET INDUCTOR STRUCTURE FOR HIGH QUALITY (Q)-FACTOR RAD...
- Publication number 20170140862
- Publication date May 18, 2017
- QUALCOMM Incorporated
- Changhan Hobie Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACOUSTIC RESONATOR DEVICES
- Publication number 20170141756
- Publication date May 18, 2017
- QUALCOMM Incorporated
- Changhan Hobie Yun
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METAL-INSULATOR-METAL (MIM) ARRAY FOR INTEGRATED RADIO FREQUENCY (R...
- Publication number 20170133996
- Publication date May 11, 2017
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS

Daeik Daniel Kim

Person

Patents Grantslast 30 patents

High performance inductors

Inductor with embraced corner capture pad

Low DC resistance and high RF resistance power amplifier choke indu...

Passive-on-glass (POG) device and method

3D pillar inductor

Segmented thermal and RF ground

Two-dimensional structure to form an embedded three-dimensional str...

Power amplifier with RF structure

Land grid array (LGA) packaging of passive-on-glass (POG) structure

Varying thickness inductor

Integrated circuits (ICs) on a glass substrate

Solenoid inductor

Backside drill embedded die substrate

Substrate comprising an embedded inductor and a thin film magnetic...

Skewed co-spiral inductor structure

Stepped-width co-spiral inductor structure

Stacked substrate inductor

Compartment shielding in flip-chip (FC) module

Tunable matching network

RF multiplexer with integrated directional couplers

Passive device assembly for accurate ground plane control

Passive components implemented on a plurality of stacked insulators

Double-sided circuit

Open-passivation ball grid array pads

Wafer level package (WLP) ball support using cavity structure

Encapsulation of acoustic resonator devices

Embedded layered inductor

Nested through glass via transformer

Apparatus with 3D wirewound inductor integrated within a substrate

Augmented capacitor structure for high quality (Q)-factor radio fre...

Patents Applicationslast 30 patents

SEGMENTED THERMAL AND RF GROUND

LOW DC RESISTANCE AND HIGH RF RESISTANCE POWER AMPLIFIER CHOKE INDU...

INDUCTOR WITH EMBRACED CORNER CAPTURE PAD

POWER AMPLIFIER WITH RF STRUCTURE

WIRE-BOND CAGE IN CONFORMAL SHIELDING

PASSIVE DEVICE ASSEMBLY FOR ACCURATE GROUND PLANE CONTROL

PASSIVE-ON-GLASS (POG) DEVICE AND METHOD

LAND GRID ARRAY (LGA) PACKAGING OF PASSIVE-ON-GLASS (POG) STRUCTURE

SEMICONDUCTOR ASSEMBLY AND METHOD OF MAKING SAME

STEPPED-WIDTH CO-SPIRAL INDUCTOR STRUCTURE

INLINE KERF PROBING OF PASSIVE DEVICES

TWO-DIMENSIONAL STRUCTURE TO FORM AN EMBEDDED THREE-DIMENSIONAL STR...

EXPOSED SIDE-WALL AND LGA ASSEMBLY

STACKED SUBSTRATE INDUCTOR

DEVICE COMPRISING A SUBSTRATE THAT INCLUDES AN IRRADIATED PORTION O...

DOUBLE-SIDED CIRCUIT

PASSIVE COMPONENTS IMPLEMENTED ON A PLURALITY OF STACKED INSULATORS

APPARATUS WITH 3D WIREWOUND INDUCTOR INTEGRATED WITHIN A SUBSTRATE

TUNABLE MATCHING NETWORK

LC FILTER LAYER STACKING BY LAYER TRANSFER TO MAKE 3D MULTIPLEXER S...

RF MULTIPLEXER WITH INTEGRATED DIRECTIONAL COUPLERS

PASSIVE DEVICE ASSEMBLY FOR ACCURATE GROUND PLANE CONTROL

BACKSIDE DRILL EMBEDDED DIE SUBSTRATE

OPEN-PASSIVATION BALL GRID ARRAY PADS

SKEWED CO-SPIRAL INDUCTOR STRUCTURE

MULTIPLEXER DESIGN USING A 2D PASSIVE ON GLASS FILTER INTEGRATED WI...

MIM CAPACITOR AND METHOD OF MAKING THE SAME

THIN FILM MAGNET INDUCTOR STRUCTURE FOR HIGH QUALITY (Q)-FACTOR RAD...

ACOUSTIC RESONATOR DEVICES

METAL-INSULATOR-METAL (MIM) ARRAY FOR INTEGRATED RADIO FREQUENCY (R...