Daisuke OYA

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Integrally bonded semiconductor device and power converter includin...
- Patent number 11,887,904
- Issue date Jan 30, 2024
- Mitsubishi Electric Corporation
- Daisuke Oya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a groove within a resin insulating p...
- Patent number 11,569,141
- Issue date Jan 31, 2023
- Mitsubishi Electric Corporation
- Daisuke Oya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor-mounting heat dissipation base plate and production m...
- Patent number 11,484,936
- Issue date Nov 1, 2022
- Mitsubishi Electric Corporation
- Keisuke Tanaka
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor module and power conversion apparatus
- Patent number 11,271,043
- Issue date Mar 8, 2022
- Mitsubishi Electric Corporation
- Shota Morisaki
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor-mounting heat dissipation base plate and production m...
- Patent number 10,898,946
- Issue date Jan 26, 2021
- Mitsubishi Electric Corporation
- Keisuke Tanaka
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device
- Patent number 10,748,830
- Issue date Aug 18, 2020
- Mitsubishi Electric Corporation
- Yukimasa Hayashida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method including forming a wide...
- Patent number 10,651,121
- Issue date May 12, 2020
- Mitsubishi Electric Corporation
- Daisuke Oya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 10,483,176
- Issue date Nov 19, 2019
- Mitsubishi Electric Corporation
- Daisuke Oya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a cylindrical electrode inserted int...
- Patent number 10,340,217
- Issue date Jul 2, 2019
- Mitsubishi Electric Corporation
- Daisuke Oya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number D827590
- Issue date Sep 4, 2018
- Mitsubishi Electric Corporation
- Yukimasa Hayashida
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Power semiconductor device
- Patent number D798832
- Issue date Oct 3, 2017
- Mitsubishi Electric Corporation
- Yukimasa Hayashida
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Power semiconductor device
- Patent number D790491
- Issue date Jun 27, 2017
- Mitsubishi Electric Corporation
- Yukimasa Hayashida
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Semiconductor device
- Patent number 9,445,497
- Issue date Sep 13, 2016
- Mitsubishi Electric Corporation
- Daisuke Oya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 8,698,195
- Issue date Apr 15, 2014
- Mitsubishi Electric Corporation
- Daisuke Oya
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20240297104
- Publication date Sep 5, 2024
- Mitsubishi Electric Corporation
- Daisuke OYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20220359423
- Publication date Nov 10, 2022
- Mitsubishi Electric Corporation
- Yoshihiro YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERTER
- Publication number 20220165631
- Publication date May 26, 2022
- Mitsubishi Electric Corporation
- Daisuke OYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME
- Publication number 20220033317
- Publication date Feb 3, 2022
- DOWA METALTECH CO, LTD.
- Koji Kobayashi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210217675
- Publication date Jul 15, 2021
- Mitsubishi Electric Corporation
- Daisuke OYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR-MOUNTING HEAT DISSIPATION BASE PLATE AND PRODUCTION M...
- Publication number 20210121943
- Publication date Apr 29, 2021
- Mitsubishi Electric Corporation
- Keisuke Tanaka
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR MODULE AND POWER CONVERSION APPARATUS
- Publication number 20200266240
- Publication date Aug 20, 2020
- MITSUBISHI ELECTRIC CORPORATION
- Shota MORISAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-CERAMIC BONDED SUBSTRATE, AND MANUFACTURING METHOD THEREOF
- Publication number 20190350078
- Publication date Nov 14, 2019
- MITSUBISHI ELECTRIC CORPORATION
- Yuki WAKABAYASHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20190244889
- Publication date Aug 8, 2019
- Mitsubishi Electric Corporation
- Daisuke OYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190206757
- Publication date Jul 4, 2019
- Mitsubishi Electric Corporation
- Yukimasa HAYASHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR-MOUNTING HEAT DISSIPATION BASE PLATE AND PRODUCTION M...
- Publication number 20190111467
- Publication date Apr 18, 2019
- MITSUBISHI ELECTRIC CORPORATION
- Keisuke Tanaka
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20180286771
- Publication date Oct 4, 2018
- Mitsubishi Electric Corporation
- Daisuke OYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20180247888
- Publication date Aug 30, 2018
- Mitsubishi Electric Corporation
- Daisuke OYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160113112
- Publication date Apr 21, 2016
- Mitsubishi Electric Corporation
- Daisuke OYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120267680
- Publication date Oct 25, 2012
- MITSUBISHI ELECTRIC CORPORATION
- Daisuke Oya
- H01 - BASIC ELECTRIC ELEMENTS

Daisuke OYA

Person

Patents Grantslast 30 patents

Integrally bonded semiconductor device and power converter includin...

Semiconductor device including a groove within a resin insulating p...

Semiconductor-mounting heat dissipation base plate and production m...

Semiconductor module and power conversion apparatus

Semiconductor-mounting heat dissipation base plate and production m...

Semiconductor device

Semiconductor device manufacturing method including forming a wide...

Semiconductor module

Semiconductor device including a cylindrical electrode inserted int...

Power semiconductor device

Power semiconductor device

Power semiconductor device

Semiconductor device

Semiconductor device

Patents Applicationslast 30 patents

POWER SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND POWER CONVERTER

ALUMINUM/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR-MOUNTING HEAT DISSIPATION BASE PLATE AND PRODUCTION M...

SEMICONDUCTOR MODULE AND POWER CONVERSION APPARATUS

METAL-CERAMIC BONDED SUBSTRATE, AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE

SEMICONDUCTOR-MOUNTING HEAT DISSIPATION BASE PLATE AND PRODUCTION M...

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE