Damion T. Searls

Person

Hillsboro, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Mainboard assembly including a package overlying a die directly att...
- Patent number 10,555,417
- Issue date Feb 4, 2020
- Intel Corporation
- Damion Searls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mainboard assembly including a package overlying a die directly att...
- Patent number 10,251,273
- Issue date Apr 2, 2019
- Intel Corporation
- Damion Searls
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Reducing loadline impedance in a system
- Patent number 9,478,488
- Issue date Oct 25, 2016
- Intel Corporation
- Damion T. Searls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing loadline impedance in a system
- Patent number 8,659,909
- Issue date Feb 25, 2014
- Intel Corporation
- Damion Searls
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for passive phase change thermal management
- Patent number 7,886,809
- Issue date Feb 15, 2011
- Intel Corporation
- Damion T. Searls
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method of fabricating flexible display
- Patent number 7,791,585
- Issue date Sep 7, 2010
- Intel Corporation
- James D. Jackson
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Thin semiconductor device package
- Patent number 7,638,884
- Issue date Dec 29, 2009
- Intel Corporation
- James D. Jackson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improved high current component interconnections
- Patent number 7,538,440
- Issue date May 26, 2009
- Intel Corporation
- Dudi I. Amir
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin semiconductor device package
- Patent number 7,517,732
- Issue date Apr 14, 2009
- Intel Corporation
- James D. Jackson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for improving AC coupling on circuit boards
- Patent number 7,495,318
- Issue date Feb 24, 2009
- Intel Corporation
- Weston Roth
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for passive phase change thermal management
- Patent number 7,316,265
- Issue date Jan 8, 2008
- Intel Corporation
- Damion T. Searls
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electro-optic surface mount light pipe and connector
- Patent number 7,255,492
- Issue date Aug 14, 2007
- Intel Corporation
- Weston C. Roth
- G02 - OPTICS
Information Patent Grant
Capacitor placement for integrated circuit packages
- Patent number 7,230,317
- Issue date Jun 12, 2007
- Intel Corporation
- Tom E. Pearson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible display
- Patent number 7,158,111
- Issue date Jan 2, 2007
- Intel Corporation
- James D. Jackson
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Reducing loadline impedance in a system
- Patent number 7,145,782
- Issue date Dec 5, 2006
- Intel Corporation
- Damion Searls
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mount solder method and apparatus for decoupling capacitanc...
- Patent number 7,135,758
- Issue date Nov 14, 2006
- Intel Corporation
- Damion T. Searls
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic embedded wireless antenna
- Patent number 7,122,891
- Issue date Oct 17, 2006
- Intel Corporation
- Terrance Dishongh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with added impedance
- Patent number 7,057,114
- Issue date Jun 6, 2006
- Intel Corporation
- Terry Dishongh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly and a method of constructing an electronic asse...
- Patent number 6,996,899
- Issue date Feb 14, 2006
- Intel Corporation
- Damion T. Searls
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with components embedded in backside diamond l...
- Patent number 6,913,999
- Issue date Jul 5, 2005
- Intel Corporation
- Damion T. Searls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for improving AC coupling on circuit boards
- Patent number 6,905,979
- Issue date Jun 14, 2005
- Intel Corporation
- Weston Roth
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Channeled heat dissipation device and a method of fabrication
- Patent number 6,906,921
- Issue date Jun 14, 2005
- Intel Corporation
- Damion Searls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly with thermally separated support
- Patent number 6,903,271
- Issue date Jun 7, 2005
- Intel Corporation
- Tom E. Pearson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socket with multiple contact pad area socket contacts
- Patent number 6,884,087
- Issue date Apr 26, 2005
- Intel Corporation
- Damion Searls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus using nanotubes for cooling and grounding die
- Patent number 6,856,016
- Issue date Feb 15, 2005
- Damion T. Searls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallurgically enhanced heat sink
- Patent number 6,797,085
- Issue date Sep 28, 2004
- Intel Corporation
- Terrance Dishongh
- C21 - METALLURGY OF IRON
Information Patent Grant
Ganged land grid array socket contacts for improved power delivery
- Patent number 6,793,503
- Issue date Sep 21, 2004
- Intel Corporation
- Terrance J. Dishongh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ganged land grid array socket contacts for improved power delivery
- Patent number 6,793,505
- Issue date Sep 21, 2004
- Intel Corporation
- Terrance J. Dishongh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mount connector lead
- Patent number 6,774,310
- Issue date Aug 10, 2004
- Intel Corporation
- Terrance J. Dishongh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with added impedance
- Patent number 6,775,122
- Issue date Aug 10, 2004
- Intel Corporation
- Terry Dishongh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LIQUID COOLING SYSTEM LEAK DETECTION IMPROVEMENTS
- Publication number 20220196507
- Publication date Jun 23, 2022
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADD-IN CARD HAVING HIGH PERFORMANCE SEMICONDUCTOR CHIP PACKAGES WIT...
- Publication number 20220113773
- Publication date Apr 14, 2022
- Intel Corporation
- Lunyu MA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MAINBOARD ASSEMBLY INCLUDING A PACKAGE OVERLYING A DIE DIRECTLY ATT...
- Publication number 20190182958
- Publication date Jun 13, 2019
- Intel Corporation
- Damion SEARLS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reducing Loadline Impedance in a System
- Publication number 20140124942
- Publication date May 8, 2014
- Damion T. Searls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PROFILE SOLDER GRID ARRAY TECHNOLOGY FOR PRINTED CIRCUIT BOARD...
- Publication number 20120224331
- Publication date Sep 6, 2012
- Weston Roth
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Mainboard assembly including a package overlying a die directly att...
- Publication number 20100061056
- Publication date Mar 11, 2010
- Damion Searls
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Low profile solder grid array technology for printed circuit board...
- Publication number 20090310320
- Publication date Dec 17, 2009
- Weston Roth
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
THIN SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20090109643
- Publication date Apr 30, 2009
- James D. Jackson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Mount Components Joined Between a Package Substrate and a P...
- Publication number 20090051004
- Publication date Feb 26, 2009
- Weston C. Roth
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
APPARATUS AND METHOD FOR PASSIVE PHASE CHANGE THERMAL MANAGEMENT
- Publication number 20080066890
- Publication date Mar 20, 2008
- Intel Corporation
- Damion T. Searls
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Thin semiconductor device package
- Publication number 20070243661
- Publication date Oct 18, 2007
- James D. Jackson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for improved high current component interconnections
- Publication number 20070125833
- Publication date Jun 7, 2007
- Dudi I. Amir
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD OF FABRICATING FLEXIBLE DISPLAY
- Publication number 20070092689
- Publication date Apr 26, 2007
- Intel Corporation
- James D. Jackson
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Reducing loadline impedance in a system
- Publication number 20070074389
- Publication date Apr 5, 2007
- Damion Searls
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of mounting a substrate to a motherboard
- Publication number 20060203459
- Publication date Sep 14, 2006
- Thomas O. Morgan
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Mobile computing device form factor
- Publication number 20060133881
- Publication date Jun 22, 2006
- Edward P. Osburn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Capacitor placement for integrated circuit packages
- Publication number 20060049479
- Publication date Mar 9, 2006
- Tom E. Pearson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electro-optic surface mount light pipe and connector
- Publication number 20060024002
- Publication date Feb 2, 2006
- Weston C. Roth
- G02 - OPTICS
Information Patent Application
Reducing loadline impedance in a system
- Publication number 20060014444
- Publication date Jan 19, 2006
- Damion Searls
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for improved high current component interconnections
- Publication number 20050225953
- Publication date Oct 13, 2005
- Dudi I. Amir
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Apparatus and method for improving AC coupling on circuit boards
- Publication number 20050195579
- Publication date Sep 8, 2005
- Intel Corporation
- Weston Roth
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ceramic embedded wireless antenna
- Publication number 20050134507
- Publication date Jun 23, 2005
- Terrance Dishongh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY WITH THERMALLY SEPARATED SUPPORT
- Publication number 20050067178
- Publication date Mar 31, 2005
- Tom E. Pearson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electro-optic through-hole mount light pipe and connector
- Publication number 20050068788
- Publication date Mar 31, 2005
- Weston C. Roth
- G02 - OPTICS
Information Patent Application
SOCKET WITH MULTIPLE CONTACT PAD AREA SOCKET CONTACTS
- Publication number 20050064739
- Publication date Mar 24, 2005
- Damion Searls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for passive phase change thermal management
- Publication number 20050051300
- Publication date Mar 10, 2005
- Intel Corporation
- Damion T. Searls
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Method for improved high current component interconnections
- Publication number 20040216917
- Publication date Nov 4, 2004
- Dudi I. Amir
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Channeled heat dissipation device and a method of fabrication
- Publication number 20040179336
- Publication date Sep 16, 2004
- Damion Searls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface mount solder method and apparatus for decoupling capacitanc...
- Publication number 20040155335
- Publication date Aug 12, 2004
- Intel Corporation
- Damion T. Searls
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Apparatus and method for improving AC coupling on circuit boards
- Publication number 20040119147
- Publication date Jun 24, 2004
- Intel Corporation
- Weston Roth
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Damion T. Searls

Person

Patents Grantslast 30 patents

Mainboard assembly including a package overlying a die directly att...

Mainboard assembly including a package overlying a die directly att...

Reducing loadline impedance in a system

Method for reducing loadline impedance in a system

Apparatus and method for passive phase change thermal management

Method of fabricating flexible display

Thin semiconductor device package

Method for improved high current component interconnections

Thin semiconductor device package

Apparatus and method for improving AC coupling on circuit boards

Method for passive phase change thermal management

Electro-optic surface mount light pipe and connector

Capacitor placement for integrated circuit packages

Flexible display

Reducing loadline impedance in a system

Surface mount solder method and apparatus for decoupling capacitanc...

Ceramic embedded wireless antenna

Circuit board with added impedance

Electronic assembly and a method of constructing an electronic asse...

Semiconductor device with components embedded in backside diamond l...

Apparatus and method for improving AC coupling on circuit boards

Channeled heat dissipation device and a method of fabrication

Electronic assembly with thermally separated support

Socket with multiple contact pad area socket contacts

Method and apparatus using nanotubes for cooling and grounding die

Metallurgically enhanced heat sink

Ganged land grid array socket contacts for improved power delivery

Ganged land grid array socket contacts for improved power delivery

Surface mount connector lead

Circuit board with added impedance

Patents Applicationslast 30 patents

LIQUID COOLING SYSTEM LEAK DETECTION IMPROVEMENTS

ADD-IN CARD HAVING HIGH PERFORMANCE SEMICONDUCTOR CHIP PACKAGES WIT...

MAINBOARD ASSEMBLY INCLUDING A PACKAGE OVERLYING A DIE DIRECTLY ATT...

Reducing Loadline Impedance in a System

LOW PROFILE SOLDER GRID ARRAY TECHNOLOGY FOR PRINTED CIRCUIT BOARD...

Mainboard assembly including a package overlying a die directly att...

Low profile solder grid array technology for printed circuit board...

THIN SEMICONDUCTOR DEVICE PACKAGE

Surface Mount Components Joined Between a Package Substrate and a P...

APPARATUS AND METHOD FOR PASSIVE PHASE CHANGE THERMAL MANAGEMENT

Thin semiconductor device package

Method for improved high current component interconnections

METHOD OF FABRICATING FLEXIBLE DISPLAY

Reducing loadline impedance in a system

Method of mounting a substrate to a motherboard

Mobile computing device form factor

Capacitor placement for integrated circuit packages

Electro-optic surface mount light pipe and connector

Reducing loadline impedance in a system

Method for improved high current component interconnections

Apparatus and method for improving AC coupling on circuit boards

Ceramic embedded wireless antenna

ELECTRONIC ASSEMBLY WITH THERMALLY SEPARATED SUPPORT

Electro-optic through-hole mount light pipe and connector

SOCKET WITH MULTIPLE CONTACT PAD AREA SOCKET CONTACTS

Apparatus and method for passive phase change thermal management

Method for improved high current component interconnections

Channeled heat dissipation device and a method of fabrication

Surface mount solder method and apparatus for decoupling capacitanc...

Apparatus and method for improving AC coupling on circuit boards