Claims
- 1. A method of forming a current loop in a decoupling capacitor system, comprising:
providing a decoupling capacitor between an electrical first bump and an electrical second bump, wherein the decoupling capacitor includes a Vcc terminal and a Vss terminal; responding to a component transient in connection with the decoupling capacitor, the electrical first bump and the electrical second bump; directing a Vcc upwardly from the decoupling capacitor and the electrical first bump toward the component; and retrieving a Vss from the component downwardly toward the decoupling capacitor and the electrical second bump.
- 2. The method according to claim 1, wherein responding to a component transient includes forming a simple current loop.
- 3. The method according to claim 1, wherein responding to a component transient includes forming a simple deflected current loop.
- 4. The method according to claim 1, wherein responding to a component transient includes forming a simple current loop and at least one simple deflected current loop.
- 5. The method of claim 1, wherein the component transient originates in a component, wherein directing a Vcc upwardly from the decoupling capacitor and the electrical first bump toward the component and retrieving a Vss from the component downwardly toward the decoupling capacitor and the electrical second bump, includes forming a current loop that originates in the decoupling capacitor, that passes through the component, and that terminates in the decoupling capacitor.
- 6. The method of claim 1, wherein the current loop is selected from a simple current loop and a simple deflected current loop.
- 7. The method of claim 1, wherein the component transient originates in a component disposed in a top structure, wherein directing a Vcc upwardly from the decoupling capacitor and the electrical first bump toward the top structure and retrieving a Vss from the component downwardly toward the decoupling capacitor and the electrical second bump, includes forming a current loop that originates in the decoupling capacitor, that passes through the top structure, and that terminates in the decoupling capacitor.
- 8. The method of claim 7, wherein the current loop is selected from a simple current loop and a simple deflected current loop.
- 9. The method of claim 1, wherein the component transient originates in an interposer disposed in a top structure, wherein directing a Vcc upwardly from the decoupling capacitor and the electrical first bump toward the interposer and retrieving a Vss from the interposer downwardly toward the decoupling capacitor and the electrical second bump, includes forming a current loop that originates in the decoupling capacitor, that passes through the interposer, and that terminates in the decoupling capacitor.
- 10. The method of claim 1, wherein the component transient originates in a socket disposed in a top structure, wherein directing a Vcc upwardly from the decoupling capacitor and the electrical first bump toward the socket and retrieving a Vss from the interposer downwardly toward the decoupling capacitor and the electrical second bump, includes forming a current loop that originates in the decoupling capacitor, that passes through the socket, and that terminates in the decoupling capacitor.
- 11. A method of forming a current loop in a decoupling capacitor, the system including a component, comprising:
providing a decoupling capacitor between an electrical first bump and an electrical second bump, wherein the decoupling capacitor includes a Vcc terminal and a Vss terminal; responding to a component transient in connection with the decoupling capacitor, the electrical first bump and the electrical second bump; directing a Vcc upwardly from the decoupling capacitor and the electrical first bump toward the component; and retrieving a Vss from the component downwardly toward the decoupling capacitor and the electrical second bump, wherein directing a Vcc upwardly from the decoupling capacitor and the electrical first bump toward the component and retrieving a Vss from the component downwardly toward the decoupling capacitor and the electrical second bump, includes forming a current loop that originates in the decoupling capacitor, that passes through the component, and that terminates in the decoupling capacitor, and wherein the current loop is selected from a simple current loop and a simple deflected current loop.
- 12. The method of claim 11, wherein the component is disposed in an interposer, and wherein directing and retrieving include directing a Vcc upwardly toward the interposer and retrieving a Vss downwardly from the interposer.
- 13. The method of claim 11, wherein the component is disposed in a socket, and wherein directing and retrieving include directing a Vcc upwardly toward the socket and retrieving a Vss downwardly from the socket.
- 14. A method of forming a current loop in a system, the system including:
a substrate including a substrate first pad and a substrate second pad; an electrical first bump including a bottom end and a top end, wherein the bottom end is adhered to the first pad; an electrical second bump including a bottom end and a top end, wherein the bottom end is adhered to the second pad; a first decoupling capacitor disposed above the substrate and substantially contiguous to the electrical first bump; and a top structure disposed at the electrical first bump top end, wherein the top structure is in electrical communication with the first decoupling capacitor the method including: responding to a transient in the electrical component in connection with the first decoupling capacitor, the electrical first bump and the electrical second bump; directing a Vcc upwardly from the first decoupling capacitor and the electrical first bump toward the component; and retrieving a Vss from the component downwardly toward the decoupling capacitor and the electrical second bump, wherein directing a Vcc upwardly from first decoupling capacitor and the electrical first bump toward the component and retrieving a Vss from the component downwardly toward the first decoupling capacitor and the electrical second bump, includes forming a current loop that originates in the first decoupling capacitor, that passes through the component, and that terminates in the first decoupling capacitor, and wherein the current loop is selected from a simple current loop and a simple deflected current loop.
- 15. The method of claim 14, wherein the component is disposed in an interposer, and wherein directing and retrieving include directing a Vcc upwardly toward the interposer and retrieving a Vss downwardly from the interposer.
- 16. The method of claim 14, wherein the component is disposed in a socket, and wherein directing and retrieving include directing a Vcc upwardly toward the socket and retrieving a Vss downwardly from the socket.
RELATED APPLICATIONS
[0001] The application is a divisional of U.S. patent application Ser. No. 10/152524, filed May 21, 2002, which is incorporated herein by reference.
Divisions (1)
|
Number |
Date |
Country |
Parent |
10152524 |
May 2002 |
US |
Child |
10774955 |
Feb 2004 |
US |